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1.发明申请Conductive Particles Comprising Complex Metal Layer With Density Gradient, Method for Preparing the Particles, and Anisotropic Conductive Adhesive Composition Comprising the Particles 有权包含具有密度梯度的复合金属层的导电颗粒，制备颗粒的方法以及包含颗粒的各向异性导电粘合剂组合物公开(公告)号：US20080102277A1
公开(公告)日：2008-05-01
申请号：US11966040
申请日：2007-12-28
CPC分类号： H05K3/323 , H05K2201/0221 , H05K2201/0233 , Y10T428/25 , Y10T428/2991 , Y10T428/2998
摘要： Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and can include nickel (Ni) and gold (Au).
摘要翻译： 本文公开了具有优异的电可靠性的各向异性导电颗粒，其可用作电连接结构的材料。 进一步公开了一种制备导电颗粒的方法，该导电颗粒包括聚合物树脂基础颗粒和形成在基础颗粒表面上的导电复合金属镀层，其中导电复合金属镀层具有基本上连续的密度梯度，并且可以包括镍（Ni）和 金（Au）。
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2.发明申请Polymer Particles, Conductive Particles, and an Anisotropic Conductive Packaging Materials Containing the Same 有权聚合物颗粒，导电颗粒和包含其的各向异性导电包装材料公开(公告)号：US20070252112A1
公开(公告)日：2007-11-01
申请号：US11763521
申请日：2007-06-15
IPC分类号： H01B1/12
CPC分类号： H05K3/323 , H05K2201/0221 , H05K2201/0233 , Y10T428/2982 , Y10T428/2991 , Y10T428/2998
摘要： Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which can be used in circuit board mounting applications. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.
摘要翻译： 本文公开了各向异性导电粘合剂膜中包含的各向异性导电颗粒，其可用于电路板安装应用中。 导电颗粒具有均匀的形状，窄的粒径分布，以及适当的压缩成形性和可变形性。 此外，导电颗粒在连接基板之间插入和压缩时表现出增强的导电性能而不会破裂，从而实现了颗粒和连接基板之间的足够的接触面积。 进一步公开的是在导电颗粒中使用的基于聚合物的颗粒。
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3.发明申请Polymer Particles and Conductive Particles Having Enhanced Conducting Properties, and Anisotropic Conductive Packaging Materials Containing the Same 有权具有增强的导电性能的聚合物颗粒和导电颗粒以及包含其的各向异性导电包装材料公开(公告)号：US20070295943A1
公开(公告)日：2007-12-27
申请号：US11828559
申请日：2007-07-26
IPC分类号： H01B1/22
CPC分类号： H01B1/22 , H01L2224/73204 , H01L2924/07811 , H05K3/323 , H05K2201/0212 , H05K2201/0221 , Y10T428/2982 , Y10T428/2991 , Y10T428/2998 , H01L2924/00
摘要： Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films, which can be used in circuit board mounting applications. The conductive particles can exhibit superior electrical reliability. Further disclosed are polymer particles having good compressive deformability and recoverability from deformation without being ruptured when an adhesive film containing conductive particles including the polymer particles as a component is interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Because the polymer particles have a spherical shape, a uniform particle diameter, and a narrow particle diameter distribution, the particles can exhibit enhanced conducting properties.
摘要翻译： 本文公开了各向异性导电粘合剂膜中所含的各向异性导电颗粒，其可用于电路板安装应用中。 导电颗粒可以表现出优异的电可靠性。 进一步公开了当包含作为组分的聚合物颗粒的导电颗粒的粘合剂膜被插入并在连接基板之间被压缩时，具有良好的压缩变形性和变形性的可恢复性而不破裂的聚合物颗粒，从而实现了颗粒和连接之间的足够的接触面积 底物。 由于聚合物颗粒具有球形，均匀的粒径和窄的粒径分布，因此颗粒可以表现出增强的导电性能。
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