摘要:
A liquid-cooled pipe for use in a liquid-cooled heat sink kit is disclosed to include a pipe body, which has a close end, an open end, an axial passage extending from the close end to the open end, and a longitudinal series of through holes in the peripheral wall, a plurality of partition members respectively inserted into the axial passage of the pipe body connected in series with the partition plate of one partition member stopped against the legs of next such that each two adjacent partition members define with the pipe body a respective small chamber in fluid communication with two through holes of the pipe body, and an end cover plate fixedly fastened to the pipe body to seal the open end.
摘要:
A modularized cooler includes the at least two heat radiator modules arranged in a stack, each heat radiator module having a set of radiation fins, heat-exchange tubes arranged in parallel and surrounded by the radiation fins, two locating plates holding the heat-exchange tubes in place, and a plurality of first bends and second bends respectively connected between every two adjacent heat-exchange tubes at two sides of the radiation fins and forming with the heat-exchange tubes a continuously S-shaped piping having an inlet and an outlet, and at least one connecting tubes that connect the S-shaped pipings of the heat radiator modules in series.
摘要:
A liquid-cooled heat radiator kit is disclosed to include a heat radiator, which has radiation elements at the top wall and parallel grooves at the bottom wall, two liquid-cooled heat pipes bilaterally arranged in parallel at the bottom side of the heat radiator, each liquid-cooled heat pipes having two close ends and a plurality of enclosed chambers spaced between the two close ends, and a plurality of straight flow-guide pipes respectively fastened to the grooves at the bottom side of the heat radiator and connected between the two liquid-cooled heat pipes to form with the enclosed chambers of the liquid-cooled heat pipes a detoured flow passage for the passing of a cooling fluid in one direction.
摘要:
A liquid-cooled pipe for use in a liquid-cooled heat sink kit is disclosed to include a pipe body, which has a close end, an open end, an axial passage extending from the close end to the open end, and a longitudinal series of through holes in the peripheral wall, a plurality of partition members respectively inserted into the axial passage of the pipe body connected in series with the partition plate of one partition member stopped against the legs of next such that each two adjacent partition members define with the pipe body a respective small chamber in fluid communication with two through holes of the pipe body, and an end cover plate fixedly fastened to the pipe body to seal the open end.
摘要:
A improved heat collector in a fluid-cooling system for a computer includes a case, and a cooling plate. The case comprises a water inlet, a water outlet, a top surface, and a bottom surface, wherein the bottom surface is a heat collecting face. The cooling plate firmly connected to the top surface of the case, the cooling plate further comprising a plurality of cooling fins protruded upwards. A nature airflow can be formed among the cooling fins of the heat collector; therefore the heat collector can also radiate heat to air to improve the cooling efficiency.
摘要:
A modularized cooler includes the at least two heat radiator modules arranged in a stack, each heat radiator module having a set of radiation fins, heat-exchange tubes arranged in parallel and surrounded by the radiation fins, two locating plates holding the heat-exchange tubes in place, and a plurality of first bends and second bends respectively connected between every two adjacent heat-exchange tubes at two sides of the radiation fins and forming with the heat-exchange tubes a continuously S-shaped piping having an inlet and an outlet, and at least one connecting tubes that connect the S-shaped pipings of the heat radiator modules in series.
摘要:
An improved heat collector in a fluid-cooling system for a computer includes a case, and a cooling plate. The case comprises a water inlet, a water outlet, a top surface, and a bottom surface, wherein the bottom surface is a heat collecting face. The cooling plate is firmly connected to the top surface of the case, the cooling plate further comprising a plurality of cooling fins protruded upwards. A natural airflow can be formed among the cooling fins of the heat collector; therefore the heat collector can also radiate heat to air to improve the cooling efficiency.
摘要:
A liquid-cooled heat radiator kit is disclosed to include a heat radiator, which has radiation elements at the top wall and parallel grooves at the bottom wall, two liquid-cooled heat pipes bilaterally arranged in parallel at the bottom side of the heat radiator, each liquid-cooled heat pipes having two close ends and a plurality of enclosed chambers spaced between the two close ends, and a plurality of straight flow-guide pipes respectively fastened to the grooves at the bottom side of the heat radiator and connected between the two liquid-cooled heat pipes to form with the enclosed chambers of the liquid-cooled heat pipes a detoured flow passage for the passing of a cooling fluid in one direction.
摘要:
A semiconductor manufacturing process is provided. First, a substrate is provided, wherein a patterned conductive layer, a dielectric layer and a patterned metal hard mask layer are sequentially formed thereon. Thereafter, a portion of the dielectric layer is removed to form a damascene opening exposing the patterned conductive layer. Afterwards, the dielectric layer is heated to above 200° C. Thereafter, a plasma treatment process is performed on the damascene opening, wherein the gases used to generate the plasma include hydrogen gas and inert gas. Afterwards, a conductive layer is formed in the damascene opening to fill therein.
摘要:
A device for processing a radio frequency (RF) signal of an optical disk drive includes a high-pass (HP) filter, an RF variable gain amplifier (VGA), an RF analog-digital converter (ADC), and a digital module. The HP filter filters the RF signal and is capable of selectively utilizing one of a first cut-off frequency and a second cut-off frequency. The RF VGA amplifies the filtered RF signal. The RF ADC converts the amplified RF signal into a digital code. The digital module is capable of executing a first function and a second function with the digital code. The HP filter utilizes the first cut-off frequency when the digital module desires to execute the first function, and the HP filter utilizes the second cut-off frequency when the digital module desires to execute the second function.