公开(公告)号：US20120329249A1

公开(公告)日：2012-12-27

申请号：US13530543

申请日：2012-06-22

申请人： Jung-Seok Ahn ,  II Hwan Kim ,  Jung-Hwan Kim ,  Sangwook Park ,  Chungsun Lee ,  Kwang-chul Choi

发明人： Jung-Seok Ahn ,  II Hwan Kim ,  Jung-Hwan Kim ,  Sangwook Park ,  Chungsun Lee ,  Kwang-chul Choi

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/13025 ,  H01L2224/13101 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Methods of manufacturing a plurality of semiconductor chips are provided. The method may include providing a middle layer between a substrate and a carrier to combine the carrier with the substrate, thinning the substrate; after thinning the substrate, separating the carrier from the substrate; and after the carrier is separated from the substrate, cutting the substrate to form the plurality of semiconductor chips, wherein the middle layer is adhered to the carrier with a first bonding force, and the middle layer is adhered to the substrate with a second bonding force, and wherein the second bonding force is greater than the first bonding force.

摘要翻译： 提供制造多个半导体芯片的方法。 该方法可以包括在衬底和载体之间提供中间层以将载体与衬底组合，使衬底变薄; 在使衬底变薄之后，将衬底与衬底分离; 在载体与基板分离之后，切割基板以形成多个半导体芯片，其中中间层以第一结合力粘附到载体上，并且中间层以第二结合力粘附到基板 并且其中所述第二结合力大于所述第一结合力。

公开(公告)号：US08483242B2

公开(公告)日：2013-07-09

申请号：US12943661

申请日：2010-11-10

申请人： Mun Yong Han ,  Jae Cheon Kim ,  II Hwan Kim

发明人： Mun Yong Han ,  Jae Cheon Kim ,  II Hwan Kim

IPC分类号： H04J3/06

CPC分类号： H04W24/10

摘要： A method and apparatus for processing inter-RAT measurement in a dual modem device are disclosed. A method for processing inter-RAT measurement in a dual modem device includes receiving, by a first processor communicating with a first communication network, a measurement control signal including a parameter for signal measurement from the first communication network; transmitting, by the first processor, timing information based on a system frame number (SFN) and a global time to a second processor; acquiring time synchronization for the inter-RAT measurement between the first processor and the second processor on the basis of the system frame number (SFN) and the global time; transmitting the parameter from the first processor to the second processor; and measuring, by the second processor, a signal of a second communication network using the parameter.

摘要翻译： 公开了一种用于在双调制解调器设备中处理RAT间测量的方法和装置。 一种用于在双调制解调器设备中处理RAT间测量的方法包括：由与第一通信网络通信的第一处理器接收包括用于来自第一通信网络的信号测量参数的测量控制信号; 由第一处理器将基于系统帧号（SFN）的定时信息和全局时间发送到第二处理器; 基于系统帧号（SFN）和全球时间，获取第一处理器和第二处理器之间的RAT间测量的时间同步; 将参数从第一处理器传送到第二处理器; 以及由所述第二处理器测量使用所述参数的第二通信网络的信号。

公开(公告)号：US20110049929A1

公开(公告)日：2011-03-03

申请号：US12623150

申请日：2009-11-20

申请人： Tae Wan PARK ,  Chang Wook Park ,  Seung Jin Heo ,  Jay II Jeong ,  II Hwan Kim ,  Jong Hoon Lee ,  In Sik Hwang

发明人： Tae Wan PARK ,  Chang Wook Park ,  Seung Jin Heo ,  Jay II Jeong ,  II Hwan Kim ,  Jong Hoon Lee ,  In Sik Hwang

IPC分类号： B60J7/00

CPC分类号： B60J7/026 ,  B60J7/0435

摘要： A sliding roof for a convertible vehicle may include front, middle, and rear roofs, guide rails for sliding the front, middle, and rear roofs, and lift links for lifting the front and rear roofs such that the guide rail of the middle roof slides toward the guide rail of the rear roof and packaged adjacent to the rear of the vehicle. The sliding roof may include a latch which fixes a side pillar of the front roof to a windshield frame during operation of a sunroof and fixes the side pillar to the sunroof during packaging of the roof, thus ensuring the space of a rear seat of the vehicle.

摘要翻译： 用于可转换车辆的滑动车顶可以包括前，中，后车顶，用于滑动前，后，后车顶的导轨，以及用于提升前后车顶的升降连杆，使得中间车顶的导轨滑动 朝向后车顶的导轨并且相邻于车辆的后部包装。 滑动屋顶可以包括闩锁，其在天窗操作期间将前屋顶的侧柱固定到挡风玻璃框架，并且在屋顶的包装期间将侧柱固定到天窗，从而确保车辆的后座椅的空间 。