公开(公告)号：US07350686B2

公开(公告)日：2008-04-01

申请号：US10530548

申请日：2002-12-13

申请人： Junichi Onozaki ,  Masahiko Furuno ,  Hiroshi Saito ,  Haruhiko Andou ,  Isao Sakamoto ,  Masaru Shirai ,  Yuji Ohashi

发明人： Junichi Onozaki ,  Masahiko Furuno ,  Hiroshi Saito ,  Haruhiko Andou ,  Isao Sakamoto ,  Masaru Shirai ,  Yuji Ohashi

IPC分类号： B23K31/02

CPC分类号： H01L24/12 ,  B23K3/0623 ,  H01L21/288 ,  H01L24/10 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3484 ,  H05K2203/0425 ,  H05K2203/0776 ,  H01L2924/00 ,  H01L2924/00014

摘要： Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid in a liquid tank, a substrate is positioned with a surface facing up. Subsequently, the inert liquid containing solder fine particles is fed from a solder fine particle forming unit to the liquid tank and the solder fine particles are dropped from a supply pipe onto the substrate in the inert liquid. The solder fine particles naturally fall down by the gravity, thereby reaching the substrate. The solder fine particles reached on the pad electrodes on the substrate stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.

摘要翻译： 获得的是细小的焊盘电极以及具有大量焊料的焊料凸块和少量的差异。 首先，在液体槽中的惰性液体中，将基板面朝上定位。 随后，将含有焊料细颗粒的惰性液体从焊料细颗粒形成单元供给到液体槽，并且将焊料细颗粒从供给管中滴落到惰性液体中的基板上。 焊料细颗粒自然地因重力而下降，从而到达基板。 在基板上的焊盘电极上达到的焊料细颗粒由于重力而停留在其上，并且在焊料湿润时间之后在焊盘电极的表面上扩散，从而形成焊料涂层。

公开(公告)号：US20060054667A1

公开(公告)日：2006-03-16

申请号：US10530548

申请日：2002-12-13

申请人： Junichi Onozaki ,  Masahiko Furuno ,  Hiroshi Saito ,  Haruhiko Andou ,  Isao Sakamoto ,  Masaru Shirai ,  Yuji Ohashi

发明人： Junichi Onozaki ,  Masahiko Furuno ,  Hiroshi Saito ,  Haruhiko Andou ,  Isao Sakamoto ,  Masaru Shirai ,  Yuji Ohashi

IPC分类号： B23K31/02 ,  B23K35/12 ,  B23K1/20

CPC分类号： H01L24/12 ,  B23K3/0623 ,  H01L21/288 ,  H01L24/10 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3484 ,  H05K2203/0425 ,  H05K2203/0776 ,  H01L2924/00 ,  H01L2924/00014

摘要： Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid (13) in a liquid tank (11), a substrate (20) is positioned with a surface (21) facing up. Subsequently, the inert liquid (13) containing solder fine particles (14) is fed from a solder fine particle forming unit (15) to the liquid tank (11) and the solder fine particles (14) are dropped from a supply pipe (16) onto the substrate (20) in the inert liquid (13). The solder fine particles (14) naturally fall down by the gravity, thereby reaching the substrate (20). The solder fine particles (14) reached on the pad electrodes on the substrate (20) stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.

摘要翻译： 获得的是细小的焊盘电极以及具有大量焊料的焊料凸块和少量的差异。 首先，在液体罐（11）中的惰性液体（13）中，将表面（21）面向上的基板（20）定位。 随后，将含有焊料细颗粒（14）的惰性液体（13）从焊料细颗粒形成单元（15）供给到液体罐（11），并且焊料细颗粒（14）从供给管（16） ）到惰性液体（13）中的基底（20）上。 焊料细颗粒（14）自然地因重力而下落，从而到达衬底（20）。 到达衬底（20）上的焊盘电极上的焊料细颗粒（14）由于重力而停留在其上，并且在焊料湿润时间之后扩散在焊盘电极的表面上，从而形成焊料涂层。