Abstract:
A rack system may include a first plurality of line cards, where a particular one of the first plurality of line cards receives or sends packets via ports; a plurality of fabric cards, where a particular one of the plurality of fabric cards includes a switching fabric; a second plurality of line cards, where a particular one of the second plurality of line cards receives or sends packets via ports; a first backplane that connects the first plurality of line cards to the plurality of fabric cards; and a second backplane that connects the second plurality of line cards to the plurality of fabric cards.
Abstract:
A rack system may include a first plurality of line cards, where a particular one of the first plurality of line cards receives or sends packets via ports; a plurality of fabric cards, where a particular one of the plurality of fabric cards includes a switching fabric; a second plurality of line cards, where a particular one of the second plurality of line cards receives or sends packets via ports; a first backplane that connects the first plurality of line cards to the plurality of fabric cards; and a second backplane that connects the second plurality of line cards to the plurality of fabric cards.
Abstract:
A test fixture, for a heatsink, may include a probe assembly with a thermocouple probe configured to removably contact a bottom surface of a pedestal of the heatsink, and measure a surface temperature of the heatsink. The test fixture may include an insulator housing configured to house the probe assembly and a heater block, and to insulate the probe assembly from the heater block. The heater block may be provided within the insulator housing and may be configured to provide heat to the heatsink via the bottom surface of the pedestal of the heatsink. The test fixture may include a mounting block connected to the insulator housing and configured to connect to the heatsink.