公开(公告)号：US11991863B2

公开(公告)日：2024-05-21

申请号：US17532633

申请日：2021-11-22

Applicant: Juniper Networks, Inc.

Inventor： Nikola Ikonomov ,  Attila I. Aranyosi ,  Sean Kim

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/2049 ,  G06F1/20

Abstract: A disclosed apparatus may include (1) a heat-emitting component, (2) a heatsink that includes a designated area thermally coupled to the heat-emitting component, (3) a plurality of springs that apply forces that support the thermal coupling between the designated area of the heatsink and the heat-emitting component, and (4) a pressure plate that concentrates the forces applied by the springs toward the designated area of the heatsink. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US20230164956A1

公开(公告)日：2023-05-25

申请号：US17532633

申请日：2021-11-22

Applicant: Juniper Networks, Inc.

Inventor： Nikola Ikonomov ,  Attila I. Aranyosi ,  Sean Kim

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/2049 ,  G06F1/20

Abstract: A disclosed apparatus may include (1) a heat-emitting component, (2) a heatsink that includes a designated area thermally coupled to the heat-emitting component, (3) a plurality of springs that apply forces that support the thermal coupling between the designated area of the heatsink and the heat-emitting component, and (4) a pressure plate that concentrates the forces applied by the springs toward the designated area of the heatsink. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US11965928B1

公开(公告)日：2024-04-23

申请号：US17410101

申请日：2021-08-24

Applicant: Juniper Networks, Inc.

Inventor： Marshall J. Lise ,  Travis S. Mikjaniec ,  Sean Kim

IPC: G01R31/28 ,  H05B3/26

CPC classification number: G01R31/2875 ,  H05B3/265 ,  H05B2203/004 ,  H05B2203/013 ,  H05B2203/016

Abstract: A disclosed Thermal Test Vehicle (TTV) for simulating the thermal characteristics of a certain integrated circuit may include (1) a substrate that serves as both (A) an electrical insulator that resists electrical energy and (B) a thermal conductor that conducts thermal energy and (2) one or more resistive elements coupled to the substrate, wherein the resistive elements extend across a majority of at least one dimension of the substrate. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US09408331B2

公开(公告)日：2016-08-02

申请号：US14284848

申请日：2014-05-22

Applicant: JUNIPER NETWORKS, INC.

Inventor： Sean Kim ,  Muhammad Sagarwala ,  Phu Truong

IPC: H05K7/20 ,  G06F1/20 ,  H05K7/14

CPC classification number: H05K7/20736 ,  G06F1/20 ,  H05K7/1492

Abstract: A rack system may include a first plurality of line cards, where a particular one of the first plurality of line cards receives or sends packets via ports; a plurality of fabric cards, where a particular one of the plurality of fabric cards includes a switching fabric; a second plurality of line cards, where a particular one of the second plurality of line cards receives or sends packets via ports; a first backplane that connects the first plurality of line cards to the plurality of fabric cards; and a second backplane that connects the second plurality of line cards to the plurality of fabric cards.

Abstract translation: 机架系统可以包括第一组多个线路卡，其中第一组多个线路卡中的特定线路卡经由端口接收或发送分组; 多个织物卡，其中所述多个织物卡中的特定一个织物卡包括交换织物; 第二多个线卡，其中第二组线路卡中的特定一个线卡经由端口接收或发送分组; 将所述第一多个线路卡连接到所述多个织物卡的第一背板; 以及将所述第二多个线路卡连接到所述多个织物卡的第二背板。