公开(公告)号：US11965928B1

公开(公告)日：2024-04-23

申请号：US17410101

申请日：2021-08-24

Applicant: Juniper Networks, Inc.

Inventor： Marshall J. Lise ,  Travis S. Mikjaniec ,  Sean Kim

IPC: G01R31/28 ,  H05B3/26

CPC classification number: G01R31/2875 ,  H05B3/265 ,  H05B2203/004 ,  H05B2203/013 ,  H05B2203/016

Abstract: A disclosed Thermal Test Vehicle (TTV) for simulating the thermal characteristics of a certain integrated circuit may include (1) a substrate that serves as both (A) an electrical insulator that resists electrical energy and (B) a thermal conductor that conducts thermal energy and (2) one or more resistive elements coupled to the substrate, wherein the resistive elements extend across a majority of at least one dimension of the substrate. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US10591964B1

公开(公告)日：2020-03-17

申请号：US15432195

申请日：2017-02-14

Applicant: Juniper Networks, Inc.

Inventor： Travis S. Mikjaniec ,  Mahesh Nagarajan ,  Henry K. Sim ,  Daniel Farmer ,  Attila I. Aranyosi

IPC: G06F1/20 ,  H05K7/20

Abstract: The disclosed apparatus may include (1) a plurality of vapor chambers that (A) are mounted to a plurality of individual power components that dissipate heat within a computing device and (B) absorb heat dissipated by the plurality of individual power components within the computing device and (2) at least one thermal coupling that (A) physically bridges the plurality of vapor chambers to one another within the computing device and (B) facilitates heat transfer among the plurality of vapor chambers mounted to the individual power components. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US10455727B1

公开(公告)日：2019-10-22

申请号：US15985277

申请日：2018-05-21

Applicant: Juniper Networks, Inc.

Inventor： Travis S. Mikjaniec ,  Susheela Nanjunda Rao Narasimhan ,  Gauri R. Khanolkar ,  Katsuhiro Okamura

IPC: H05K7/20 ,  G06F1/26 ,  G06F1/3206

Abstract: The disclosed apparatus may include may include (1) an active power supply blank that (A) fits within a power supply slot of a network device that forwards network traffic and (B) generates airflow that cools the network device and (2) a power interface that electrically couples the active power supply blank to the network device, wherein the power interface enables the active power supply blank to (A) draw electrical power from the network device and (B) generate the airflow that cools the network device using the electrical power drawn from the network device. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US09961799B1

公开(公告)日：2018-05-01

申请号：US15241704

申请日：2016-08-19

Applicant: Juniper Networks, Inc.

Inventor： Mahesh Nagarajan ,  Henry K. Sim ,  John Kenney ,  Brian J. Ray ,  Sriram Gopalaratnam ,  Gauri R. Khanolkar ,  Olaf Moeller ,  Travis S. Mikjaniec

IPC: H05K7/20 ,  F28F3/04 ,  H05K7/14 ,  H05K9/00 ,  H04B10/25

CPC classification number: H05K7/20409 ,  F28F3/04 ,  H04B10/25 ,  H05K7/1418 ,  H05K7/20127 ,  H05K7/20545 ,  H05K9/0041 ,  H05K9/0058

Abstract: The disclosed apparatus may include (1) a faceplate that facilitates at least one connection between at least one communication cable and a line card that forwards traffic in connection with a network, (2) at least one heatsink that (A) is integrated into the faceplate and (B) absorbs heat dissipated by at least one electronic component included in the line card, and (3) at least one mount that (A) is integrated into the faceplate and (B) enables the electronic component to attach to the heatsink. Various other apparatuses and systems are also disclosed.