公开(公告)号：US20180012789A1

公开(公告)日：2018-01-11

申请号：US15644828

申请日：2017-07-10

Applicant: KABUSHIKI KAISHA YASKAWA DENKI

Inventor： Hiroyuki HANDA ,  John D. PAYNE ,  John Charles ROGERS ,  Carl Michael TRAYNOR

IPC: H01L21/687 ,  B25J9/16 ,  B25J13/08 ,  B25J15/06

CPC classification number: H01L21/68707 ,  B25J9/042 ,  B25J9/1651 ,  B25J11/0095 ,  B25J13/088 ,  B25J15/0616 ,  B25J19/023 ,  H01L21/67742 ,  H01L21/67766

Abstract: A robotic apparatus for transporting a workpiece includes a first arm that pivots about a first axis and a second arm that is pivotably connected to the first arm. The second arm has a surface upon which the workpiece can be received. A first drive unit of the robotic apparatus drives the first arm member to pivot about the first axis. The robotic apparatus includes a controller that controls the first drive unit to move the surface of the second arm member to transport the workpiece. The control unit also controls the first drive unit such that the surface is not moved at an acceleration value that exceeds a predetermined acceleration limit during the transport of the workpiece.

公开(公告)号：US20210074566A1

公开(公告)日：2021-03-11

申请号：US17005378

申请日：2020-08-28

Applicant: KABUSHIKI KAISHA YASKAWA DENKI ,  Yaskawa America, Inc.

Inventor： John Charles ROGERS ,  Margaret Kathleen SWIECICKI

IPC: H01L21/68 ,  G01N21/95 ,  G01N21/43

Abstract: A pre-aligner for pre-aligning a wafer having a notch. The pre-aligner includes a wafer platform having a wafer receiving surface, and a drive device. A detector is provided to detect the notch, and a memory is provided to store a notch window defining a range of angles in which the notch is predicted to be located in relation to a start position. A controller performs a pre-alignment operation where the wafer is rotated from the start position to an alignment location. The controller performs the operation such that the wafer is rotated at maximum acceleration/deceleration values from the start position to a notch location detected by the detector: where the operation is limited to a maximum velocity for rotation of the wafer from the start position to a notch window; and where the operation is limited to a scanning velocity within the notch window until the notch location is detected.

公开(公告)号：US20250002268A1

公开(公告)日：2025-01-02

申请号：US18755638

申请日：2024-06-26

Applicant: KABUSHIKI KAISHA YASKAWA DENKI ,  Yaskawa America, Inc.

Inventor： John Charles ROGERS

IPC: B65G47/90

Abstract: A robotic apparatus including an arm member configured to pivot about a first axis, a first end effector, a second end effector, a drive unit, and a control unit. The first and second end effectors are pivotably connected to the arm member about a second axis, and each have a surface to receive a workpiece. The drive unit drives the arm member to pivot about the first axis, and to drive the first and second end effectors to pivot about the second axis. The control unit controls the drive unit to move the arm member and the first and second end effectors to perform a swapping operation that includes the first and second end effectors swapping arc positions at opposite ends of an arc of constant radius of curvature such that the workpieces on the first and second end effectors each travel at equal and constant velocities along the arc.