公开(公告)号：US20170251913A1

公开(公告)日：2017-09-07

申请号：US15057767

申请日：2016-03-01

Applicant: KARL STORZ Endovision, Inc.

Inventor： Dashiell Birnkrant ,  Gerard Vadenais ,  Jordan He ,  Jason Curtis

IPC: A61B1/05 ,  H05K3/34 ,  A61B1/00 ,  H04N5/335

CPC classification number: A61B1/0011 ,  A61B1/051 ,  H04N5/2253 ,  H04N2005/2255 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10356 ,  H05K2201/10628 ,  H05K2201/10757

Abstract: An image sensor module includes a circuit board, image sensor, electronic component assembly, and cable assembly. The circuit board includes a center section located between two end sections. The end sections each extend away from the center section and define an interior area there between. The image sensor is secured to an outer face of the circuit board in the center section with sensor contact fingers being connected at the circuit board outer face in one or both end sections. The electronic component arrangement is mounted on an inner face of the circuit board in the center section. A number of wires of the cable assembly extend through an end gap between the circuit board end sections and are connected to the inner face of the circuit board so as to overlap with the sensor contact fingers along a module longitudinal axis.

公开(公告)号：US20240090756A1

公开(公告)日：2024-03-21

申请号：US17946204

申请日：2022-09-16

Applicant: KARL STORZ Endovision, Inc.

Inventor： Dashiell Birnkrant ,  Gerard Vadenais ,  Katherine Rohena ,  Udaya Silva

IPC: A61B1/05 ,  A61B1/00

CPC classification number: A61B1/05 ,  A61B1/00096 ,  G02B23/2484

Abstract: An electrical bridge connects to a packaged imaging sensor in the distal tip of a scope shaft. The bridge has an insulative body including a distal surface with a cross sectional size no greater than that of the packaged image sensor. A plurality of electrical contacts are arranged in an array along the distal surface of the insulative body for connecting to the packaged image sensor. Conductive paths are formed through the insulative body connecting to the electrical contacts. Wire attachment contacts connecting to the conductive paths. The wire attachment contacts are formed within the cross-sectional area of the insulative body and elongated in a longitudinal direction perpendicular the distal surface for soldering to wires oriented in the longitudinal direction. The wire attachment contacts are adjacent to respective voids in the insulative body for receiving the wires, the voids including insulative walls on two sides.