公开(公告)号：US20200277705A1

公开(公告)日：2020-09-03

申请号：US16643758

申请日：2018-08-24

Applicant: KCF Technologies Co., Ltd.

Inventor： Seung Min KIM ,  Ho Gun KIM

IPC: C25D1/04 ,  C25D3/38 ,  H01M4/70 ,  H01M4/66 ,  C25D5/48

Abstract: The present invention relates to an electrolytic copper foil current collector where the surface properties are controlled to achieve a high adhesiveness to a negative electrode material. An electrolytic copper foil has a first surface and the second surface, the electrolytic copper foil comprising a first protective layer on the first surface side, a second protective layer on the second surface side, and a copper film between the first and second protective layers, wherein the coupling coefficient at the first surface or second surface of the electrolytic copper foil is 1.5 to 9.4 as represented by coupling coefficient=Rp/μm+peak density/30+amount of Cr adhesion/(mg/m2) (here, peak density is measured according to ASME standard B46.1). The electrolytic copper foil has a high adhesiveness to a negative electrode material and a low electrical resistance can be provided by controlling the surface properties of the electrolytic copper foil surface.

公开(公告)号：US20190003066A1

公开(公告)日：2019-01-03

申请号：US15999169

申请日：2018-08-17

Applicant: KCF Technologies Co., Ltd.

Inventor： Seung Min KIM ,  An Na LEE ,  Ho Gun KIM ,  Shan Hua JIN

IPC: C25D1/04 ,  C25D5/12 ,  C25D5/16 ,  C25D3/38 ,  C25D7/06 ,  H05K1/09 ,  H01M4/66

Abstract: Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1: PAR=Rp/Ra  [Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.