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Patent Agency Ranking
公开(公告)号：US20210025066A1
公开(公告)日：2021-01-28
申请号：US16959352
申请日：2019-01-25
Applicant: KCF Technologies Co., Ltd.
Inventor： Seung Min KIM , Shan Hua JIN
Abstract: The present invention relates to an electrolytic copper foil having excellent handling characteristics in the manufacture of copper foil and in post-processing for manufacturing a secondary battery. The present invention provides an electrolytic copper foil having a first surface and a second surface, wherein the texture coefficient of the (220) plane of the electrolytic copper foil is 0.4-1.32, the difference (|Δ(Rz/Ra)|) between Rz/Ra on the first surface and Rz/Ra on the second surface, of the electrolytic copper foil, is less than 2.42, and the difference (|ΔPD|) in peak density (PD) between the first surface and the second surface, of the electrolytic copper foil, is 96 ea or less.
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公开(公告)号：US20190006658A1
公开(公告)日：2019-01-03
申请号：US16113479
申请日：2018-08-27
Applicant: KCF Technologies Co., Ltd.
Inventor： Young Wook CHAE , Young Hyun KIM , Shan Hua JIN
IPC: H01M4/134 , H01M4/1395 , H01M4/04 , C25D5/56 , C25D3/38 , H01M10/0525
Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, wherein the copper foil has a first surface of a direction of the matte surface of the copper layer and a second surface of a direction of the shiny surface of the copper layer, wherein a dynamic friction coefficient of the first surface is designated by μk1 and a dynamic friction coefficient of the second surface is designated by μk2. A ratio of three-dimensional surface area to two-dimensional surface area of the first surface is designated by Fs1, a ratio of three-dimensional surface area to two-dimensional surface area of the second surface is designated by Fs2.
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公开(公告)号：US20190003066A1
公开(公告)日：2019-01-03
申请号：US15999169
申请日：2018-08-17
Applicant: KCF Technologies Co., Ltd.
Inventor： Seung Min KIM , An Na LEE , Ho Gun KIM , Shan Hua JIN
Abstract: Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1: PAR=Rp/Ra [Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.
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公开(公告)号：US20210025067A1
公开(公告)日：2021-01-28
申请号：US16959360
申请日：2019-01-25
Applicant: KCF Technologies Co., Ltd.
Inventor： Seung Min KIM , Joong Kyu AN , Shan Hua JIN
IPC: C25D1/04 , C25D3/38 , H01M4/66 , H01M10/052
Abstract: The present invention relates to: an electrolytic copper foil having high dimensional stability and texture stability in a high temperature environment of a process for manufacturing an Li secondary battery; and a manufacturing method therefor. The electrolytic copper foil of the present invention has a thermal expansion coefficient of 17.1-22 μm/(m·° C.) in a temperature region of 30-190° C., has a variation of full width at half maximum of the (220) plane of 0.81-1.19 according to heat treatment for 30 minutes at 190° C., and has a weight deviation of 5% or less in the transverse direction.
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公开(公告)号：US20200181790A1
公开(公告)日：2020-06-11
申请号：US16631739
申请日：2018-07-25
Applicant: KCF Technologies Co., Ltd.
Inventor： Shan Hua JIN , An Na LEE , Seung Min KIM
Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.
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