公开(公告)号：US11744018B2

公开(公告)日：2023-08-29

申请号：US17147908

申请日：2021-01-13

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Peter Alexandre Blais ,  James A. Burk ,  Galen W. Miller ,  Hunter Hayes ,  Allen Templeton ,  Lonnie G. Jones ,  Mark R. Laps

IPC: H05K1/18 ,  H01G4/38 ,  H05K1/14 ,  H05K1/02 ,  H05K3/32 ,  H01L29/20 ,  H01G4/30 ,  H01L25/07 ,  H01L29/16

CPC classification number: H05K1/181 ,  H01G4/38 ,  H05K1/0272 ,  H05K1/145 ,  H05K3/328 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545

Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

公开(公告)号：US20210227693A1

公开(公告)日：2021-07-22

申请号：US17147908

申请日：2021-01-13

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Peter Alexandre Blais ,  James A. Burk ,  Galen W. Miller ,  Hunter Hayes ,  Allen Templeton ,  Lonnie G. Jones ,  Mark R. Laps

IPC: H05K1/18 ,  H01G4/38 ,  H05K1/14 ,  H05K1/02 ,  H05K3/32

Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.