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公开(公告)号：US11744018B2
公开(公告)日：2023-08-29
申请号：US17147908
申请日：2021-01-13
Applicant: KEMET Electronics Corporation
Inventor： John Bultitude , Peter Alexandre Blais , James A. Burk , Galen W. Miller , Hunter Hayes , Allen Templeton , Lonnie G. Jones , Mark R. Laps
IPC: H05K1/18 , H01G4/38 , H05K1/14 , H05K1/02 , H05K3/32 , H01L29/20 , H01G4/30 , H01L25/07 , H01L29/16
CPC classification number: H05K1/181 , H01G4/38 , H05K1/0272 , H05K1/145 , H05K3/328 , H01G4/30 , H01L25/072 , H01L29/1608 , H01L29/2003 , H05K2201/10015 , H05K2201/10166 , H05K2201/10545
Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.
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公开(公告)号：US20210227693A1
公开(公告)日：2021-07-22
申请号：US17147908
申请日：2021-01-13
Applicant: KEMET Electronics Corporation
Inventor： John Bultitude , Peter Alexandre Blais , James A. Burk , Galen W. Miller , Hunter Hayes , Allen Templeton , Lonnie G. Jones , Mark R. Laps
Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.
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公开(公告)号：US20210327646A1
公开(公告)日：2021-10-21
申请号：US17233796
申请日：2021-04-19
Applicant: KEMET Electronics Corporation
Inventor： Mark R. Laps , John Bultitude , Philip M. Lessner , Lonnie G. Jones , Allen Templeton , Nathan A. Reed
Abstract: Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.
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Patent Agency Ranking
公开(公告)号：US20140232485A1
公开(公告)日：2014-08-21
申请号：US14263130
申请日：2014-04-28
Applicant: Kemet Electronics Corporation
Inventor： John Bultitude , Mark R. Laps , Lonnie G. Jones
CPC classification number: H01G2/14 , H01G4/005 , H01G4/232 , H01G4/30 , H03H7/0115
Abstract: A discharge capacitor for use in electronic circuits is described. The discharge capacitor has first internal electrodes in electrical contact with a first external termination and second internal electrodes parallel to and interleaved with the first internal electrodes wherein the second internal electrodes are in electrical contact with a second external termination. A dielectric is between the first internal electrodes and adjacent second internal electrodes. A first discharge gap is between at least one first internal electrode of said first internal electrodes and said second external termination.
Abstract translation: 描述了用于电子电路的放电电容器。 放电电容器具有与第一外部端子电连接的第一内部电极和与第一内部电极平行并交错的第二内部电极，其中第二内部电极与第二外部端子电接触。 电介质位于第一内部电极和相邻的第二内部电极之间。 第一放电间隙在所述第一内部电极的至少一个第一内部电极和所述第二外部端子之间。
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公开(公告)号：US12249463B2
公开(公告)日：2025-03-11
申请号：US17233796
申请日：2021-04-19
Applicant: KEMET Electronics Corporation
Inventor： Mark R. Laps , John Bultitude , Philip M. Lessner , Lonnie G. Jones , Allen Templeton , Nathan A. Reed
Abstract: Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.
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公开(公告)号：US09142353B2
公开(公告)日：2015-09-22
申请号：US14263130
申请日：2014-04-28
Applicant: Kemet Electronics Corporation
Inventor： John Bultitude , Mark R. Laps , Lonnie G. Jones
CPC classification number: H01G2/14 , H01G4/005 , H01G4/232 , H01G4/30 , H03H7/0115
Abstract: A discharge capacitor for use in electronic circuits is described. The discharge capacitor has first internal electrodes in electrical contact with a first external termination and second internal electrodes parallel to and interleaved with the first internal electrodes wherein the second internal electrodes are in electrical contact with a second external termination. A dielectric is between the first internal electrodes and adjacent second internal electrodes. A first discharge gap is between at least one first internal electrode of said first internal electrodes and said second external termination.
Abstract translation: 描述了用于电子电路的放电电容器。 放电电容器具有与第一外部端子电连接的第一内部电极和与第一内部电极平行并交错的第二内部电极，其中第二内部电极与第二外部端子电接触。 电介质位于第一内部电极和相邻的第二内部电极之间。 第一放电间隙在所述第一内部电极的至少一个第一内部电极和所述第二外部端子之间。
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公开(公告)号：US08947852B2
公开(公告)日：2015-02-03
申请号：US13905247
申请日：2013-05-30
Applicant: Kemet Electronics Corporation
Inventor： Lonnie G. Jones , John Bultitude , Mark R. Laps , James R. Magee , Jeffrey W. Bell
Abstract: An improved electronic component is described. The electronic component has a capacitor with first planer internal electrodes in electrical contact with a first termination and second planer internal electrodes in electrical contact with a second termination. A dielectric is between the first planer electrodes and the second planer internal electrodes. The electronic component further comprises at least one of: an inductor comprising a conductive trace wherein said conductive trace is between the first termination and a third termination; and an overvoltage protection component comprising: a third internal electrode contained within the dielectric and wherein the third internal electrode is electrically connected to the first termination; a fourth internal electrode contained within the ceramic and electrically connected to a fourth termination; and a gap between the third internal electrode and the fourth internal electrode.
Abstract translation: 描述了改进的电子部件。 电子部件具有电容器，其具有与第一端接电接触的第一平面内部电极和与第二端接电接触的第二平面内部电极。 电介质位于第一平面电极和第二平面内部电极之间。 电子部件还包括以下至少一个：包括导电迹线的电感器，其中所述导电迹线在第一端接和第三端接之间; 以及过电压保护部件，包括：包含在所述电介质内的第三内部电极，并且其中所述第三内部电极电连接到所述第一端子; 第四内部电极，其包含在陶瓷内并电连接到第四端子; 以及第三内部电极和第四内部电极之间的间隙。
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公开(公告)号：US20140198422A1
公开(公告)日：2014-07-17
申请号：US13905247
申请日：2013-05-30
Applicant: Kemet Electronics Corporation
Inventor： Lonnie G. Jones , John Bultitude , Mark R. Laps , James R. Magee , Jeffrey W. Ball
IPC: H02H7/00
Abstract: An improved electronic component is described. The electronic component has a capacitor with first planer internal electrodes in electrical contact with a first termination and second planer internal electrodes in electrical contact with a second termination. A dielectric is between the first planer electrodes and the second planer internal electrodes. The electronic component further comprises at least one of: an inductor comprising a conductive trace wherein said conductive trace is between the first termination and a third termination; and an overvoltage protection component comprising: a third internal electrode contained within the dielectric and wherein the third internal electrode is electrically connected to the first termination; a fourth internal electrode contained within the ceramic and electrically connected to a fourth termination; and a gap between the third internal electrode and the fourth internal electrode.
Abstract translation: 描述了改进的电子部件。 电子部件具有电容器，其具有与第一端接电接触的第一平面内部电极和与第二端接电接触的第二平面内部电极。 电介质位于第一平面电极和第二平面内部电极之间。 电子部件还包括以下至少一个：包括导电迹线的电感器，其中所述导电迹线在第一端接和第三端接之间; 以及过电压保护部件，包括：包含在所述电介质内的第三内部电极，并且其中所述第三内部电极电连接到所述第一端子; 第四内部电极，其包含在陶瓷内并电连接到第四端子; 以及第三内部电极和第四内部电极之间的间隙。
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