公开(公告)号：US20230296669A1

公开(公告)日：2023-09-21

申请号：US17898102

申请日：2022-08-29

Applicant: KIOXIA CORPORATION

Inventor： Takuya KUSAKA ,  Hirosuke NARAI ,  Kazunori MASUDA ,  Makoto IWAI

IPC: G01R31/28 ,  H01L23/00 ,  H01L25/065 ,  H01L23/538

CPC classification number: G01R31/2896 ,  G01R31/2853 ,  G01R31/2884 ,  H01L24/48 ,  H01L25/0657 ,  H01L23/5386 ,  H01L2224/48147 ,  H01L2224/48149 ,  H01L2224/48229 ,  H01L2924/1438 ,  H01L2924/1431 ,  H01L23/49816

Abstract: A semiconductor device includes first and second chips in a package. A first pad is on the first chip and electrically connected to a node between a power supply pad and a ground pad on the first chip. Second and third pads are on the second chip. An internal wiring connects the first pad to the second pad within the package. A power circuit on the semiconductor chip configured to supply a current to the second pad. A switch is on the second chip between the second pad and the power supply circuit to connect or disconnect the second pad from the power circuit. A control circuit is on the second chip and configured to output a first signal for the switch in response to a test signal supplied to the third pad and a second signal to the power circuit to cause the power circuit to output current.