公开(公告)号：US20170291391A1

公开(公告)日：2017-10-12

申请号：US15471309

申请日：2017-03-28

Applicant: KITAGAWA INDUSTRIES CO., LTD.

Inventor： Rika OYA

IPC: B32B7/02 ,  B32B27/30 ,  B32B27/20 ,  B29C47/00 ,  H01B1/04 ,  B29C47/06 ,  B29C47/88 ,  H05K7/20 ,  H01B1/02 ,  B32B27/08 ,  B29C47/02

CPC classification number: B32B7/02 ,  B29C47/0004 ,  B29C47/0021 ,  B29C47/025 ,  B29C47/065 ,  B29C47/8805 ,  B29K2033/12 ,  B29K2105/0038 ,  B29K2105/16 ,  B29K2509/02 ,  B29K2995/0013 ,  B29L2007/002 ,  B29L2009/00 ,  B32B7/04 ,  B32B7/06 ,  B32B27/08 ,  B32B27/20 ,  B32B27/22 ,  B32B27/308 ,  B32B37/15 ,  B32B2250/02 ,  B32B2250/24 ,  B32B2250/246 ,  B32B2250/40 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/107 ,  B32B2307/302 ,  B32B2307/536 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2457/00 ,  C09D133/066 ,  H01B1/023 ,  H01B1/04 ,  H05K7/20481

Abstract: A thermal conducting sheet having a high adhesion between layers even if the thermal conducting sheet has a multilayer structure is provided. The thermal conducting sheet including a low-hardness layer and a reinforcing layer laminated on one side or both sides of the low-hardness layer. The reinforcing layer having a hardness greater than a hardness of the low-hardness layer. The low-hardness layer comprises: acrylic polymer, silicon carbide, aluminum hydroxide, magnesium hydroxide, and plasticizer.