MULTI-CONTROLLER INSPECTION SYSTEM

    公开(公告)号:US20210349038A1

    公开(公告)日:2021-11-11

    申请号:US17136919

    申请日:2020-12-29

    Abstract: An inspection system is disclosed. The inspection system includes a shared memory configured to receive image data from a defect inspection tool and a controller communicatively coupled to the shared memory. The controller includes a host image module configured to apply one or more general-purpose defect-inspection algorithms to the image data using central-processing unit (CPU) architectures, a results module configured to generate inspection data for defects identified by the host image module, and secondary image module(s) configured to apply one or more targeted defect-inspection algorithms to the image data. The secondary image module(s) employ flexible sampling of the image data to match a data processing rate of the host image module within a selected tolerance. The flexible sampling of the image data is adjusted responsive to the inspection data generated by the results module and the host image module.

    DEEP LEARNING BASED MODE SELECTION FOR INSPECTION

    公开(公告)号:US20250020598A1

    公开(公告)日:2025-01-16

    申请号:US18646704

    申请日:2024-04-25

    Abstract: Methods and systems for determining information for a specimen are provided. One system includes a computer subsystem and one or more components executed by the computer subsystem that include a setup deep learning (DL) model configured for separately performing defect detection for a specimen based on output generated for the specimen by each of two or more modes of an inspection system, respectively, and separately re-performing defect detection for the specimen based on masked output generated for each of the modes, respectively. The computer subsystem determines a difference between results of separately performing and separately re-performing the defect detections for each of the modes, respectively, and identifies a subset of the modes for which the difference is larger than other modes as candidate mode(s) for inspection of the specimen.

    Multi-controller inspection system

    公开(公告)号:US11415526B2

    公开(公告)日:2022-08-16

    申请号:US17136919

    申请日:2020-12-29

    Abstract: An inspection system is disclosed. The inspection system includes a shared memory configured to receive image data from a defect inspection tool and a controller communicatively coupled to the shared memory. The controller includes a host image module configured to apply one or more general-purpose defect-inspection algorithms to the image data using central-processing unit (CPU) architectures, a results module configured to generate inspection data for defects identified by the host image module, and secondary image module(s) configured to apply one or more targeted defect-inspection algorithms to the image data. The secondary image module(s) employ flexible sampling of the image data to match a data processing rate of the host image module within a selected tolerance. The flexible sampling of the image data is adjusted responsive to the inspection data generated by the results module and the host image module.

    MODE SELECTION AND DEFECT DETECTION TRAINING

    公开(公告)号:US20210366103A1

    公开(公告)日:2021-11-25

    申请号:US17128502

    申请日:2020-12-21

    Abstract: A system may be configured for joint defect discovery and optical mode selection. Defects are detected during a defect discovery step. The discovered defects are accumulated into a mode selection dataset. The mode selection dataset is used to perform mode selection to determine a mode combination. The mode combination may then be used to train the defect detection model. Additional defects may then be detected by the defect detection model. The additional defects may then be provided to the mode selection dataset, for further performing mode selection and training the defect detection model. One or more run-time modes may then be determined. The system may be configured for mode selection and defect detection at an image pixel level.

    LEARNABLE DEFECT DETECTION FOR SEMICONDUCTOR APPLICATIONS

    公开(公告)号:US20230118839A1

    公开(公告)日:2023-04-20

    申请号:US18078989

    申请日:2022-12-11

    Abstract: Methods and systems for learnable defect detection for semiconductor applications are provided. One system includes a deep metric learning defect detection model configured for projecting a test image for a specimen and a corresponding reference image into latent space, determining a distance in the latent space between one or more different portions of the test image and corresponding portion(s) of the corresponding reference image, and detecting defects in the one or more different portions of the test image based on the determined distances. Another system includes a learnable low-rank reference image generator configured for removing noise from one or more test images for a specimen thereby generating one or more reference images corresponding to the one or more test images.

    Learnable defect detection for semiconductor applications

    公开(公告)号:US11551348B2

    公开(公告)日:2023-01-10

    申请号:US16838037

    申请日:2020-04-02

    Abstract: Methods and systems for learnable defect detection for semiconductor applications are provided. One system includes a deep metric learning defect detection model configured for projecting a test image for a specimen and a corresponding reference image into latent space, determining a distance in the latent space between one or more different portions of the test image and corresponding portion(s) of the corresponding reference image, and detecting defects in the one or more different portions of the test image based on the determined distances. Another system includes a learnable low-rank reference image generator configured for removing noise from one or more test images for a specimen thereby generating one or more reference images corresponding to the one or more test images.

    Mode selection and defect detection training

    公开(公告)号:US11769242B2

    公开(公告)日:2023-09-26

    申请号:US17128502

    申请日:2020-12-21

    Abstract: A system may be configured for joint defect discovery and optical mode selection. Defects are detected during a defect discovery step. The discovered defects are accumulated into a mode selection dataset. The mode selection dataset is used to perform mode selection to determine a mode combination. The mode combination may then be used to train the defect detection model. Additional defects may then be detected by the defect detection model. The additional defects may then be provided to the mode selection dataset, for further performing mode selection and training the defect detection model. One or more run-time modes may then be determined. The system may be configured for mode selection and defect detection at an image pixel level.

    PROTECTING DATA SOURCES FROM DIFFERENT ENTITIES FOR SEMICONDUCTOR YIELD RELATED APPLICATIONS

    公开(公告)号:US20240169116A1

    公开(公告)日:2024-05-23

    申请号:US18334357

    申请日:2023-06-13

    CPC classification number: G06F30/20 G06F30/3308

    Abstract: Methods and systems for performing functions with protected data sources from different entities are provided. One system includes a virtual system coupled to an actual system to thereby receive output generated by the actual system for a physical version of the specimen while the specimen is disposed within the actual system. The virtual system includes at least a computer system and a storage medium. The virtual system is not capable of having the physical version of the specimen disposed therein. The virtual system is configured for performing one or more functions for the specimen with two or more protected data sources from two or more different entities, respectively. The virtual system is also configured for performing a virtual version of a process capable of being performed by the actual system for the physical version of the specimen.

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