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公开(公告)号:US11281111B2
公开(公告)日:2022-03-22
申请号:US16317603
申请日:2018-12-14
Applicant: KLA-TENCOR CORPORATION
Inventor: Yoni Shalibo , Yuri Paskover , Vladimir Levinski , Amnon Manassen , Shlomo Eisenbach , Gilad Laredo , Ariel Hildesheim
Abstract: Metrology methods and tools are provided, which enhance the accuracy of the measurements and enable simplification of the measurement process as well as improving the correspondence between the metrology targets and the semiconductor devices. Methods comprise illuminating the target in a Littrow configuration to yield a first measurement signal comprising a −1st diffraction order and a 0th diffraction order and a second measurement signal comprising a +1st distraction order and a 0th diffraction order, wherein the −1st diffraction order of the first measurement signal and the +1st diffraction order of the second measurement signal are diffracted at 180° to a direction of the illumination, performing a first measurement of the first measurement signal and a second measurement of the second measurement signal, and deriving metrology metric(s) therefrom. Optionally, a reflected 0th diffraction order may be split to yield components which interact with the −1st and +1st diffraction orders.
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公开(公告)号:US11430687B2
公开(公告)日:2022-08-30
申请号:US16340634
申请日:2019-03-25
Applicant: KLA-TENCOR CORPORATION
Inventor: Ariel Hildesheim , Ofer Angel
IPC: B25B11/00 , H01L21/683 , H01L21/687
Abstract: A vacuum hold-down apparatus retains a wafer in a desired position and orientation. A vacuum chuck assembly of the vacuum hold-down apparatus has a vacuum chuck surface with a vacuum communication aperture. A venturi vacuum generator is fixed with respect to the vacuum chuck assembly and communicates with the vacuum chuck surface via the vacuum communication aperture. A positive pressure fluid line communicates with the venturi vacuum generator.
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公开(公告)号:US20210217645A1
公开(公告)日:2021-07-15
申请号:US16340634
申请日:2019-03-25
Applicant: KLA-TENCOR CORPORATION
Inventor: Ariel Hildesheim , Ofer Angel
IPC: H01L21/683 , B25B11/00
Abstract: Vacuum hold-down apparatus suitable for retaining a wafer in a desired position and orientation, the apparatus including a vacuum chuck assembly defining a vacuum chuck surface having a vacuum communication aperture, a venturi vacuum generator fixed with respect to the vacuum chuck assembly and communicating with the vacuum chuck surface via the vacuum communication aperture and a positive pressure fluid line communicating with the venturi vacuum generator.
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