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公开(公告)号：US11852590B1
公开(公告)日：2023-12-26
申请号：US16552107
申请日：2019-08-27
Applicant: KLA-Tencor Corporation
Inventor： Amnon Manassen , Daria Negri , Andrew V. Hill , Ohad Bachar , Vladimir Levinski , Yuri Paskover
CPC classification number: G01N21/8806 , G01B11/272 , G01N21/33 , G01N21/3563 , G01N21/8422 , G01N21/9505 , G01B2210/56 , G01N2021/8438 , G01N2201/06113
Abstract: A metrology system may include an imaging sub-system including one or more lenses and a detector to image a sample, where the sample includes metrology target elements on two or more sample layers. The metrology system may further include a controller to determine layer-specific imaging configurations of the imaging sub-system to image the metrology target elements on the two or more sample layers within a selected image quality tolerance, where each layer-specific imaging configuration includes a selected configuration of one or more components of the imaging sub-system. The controller may further receive, from the imaging sub-system, one or more images of the metrology target elements on the two or more sample layers generated using the layer-specific imaging configurations. The controller may further provide a metrology measurement based on the one or more images of the metrology target elements on the two or more sample layers.
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公开(公告)号：US11314173B2
公开(公告)日：2022-04-26
申请号：US16672483
申请日：2019-11-03
Applicant: KLA-Tencor Corporation
Inventor： Vladimir Levinski , Yuri Paskover , Amnon Manassen , Yoni Shalibo
Abstract: Metrology tools and methods are provided, which estimate the effect of topographic phases corresponding to different diffraction orders, which result from light scattering on periodic targets, and adjust the measurement conditions to improve measurement accuracy. In imaging, overlay error magnification may be reduced by choosing appropriate measurement conditions based on analysis of contrast function behavior, changing illumination conditions (reducing spectrum width and illumination NA), using polarizing targets and/or optical systems, using multiple defocusing positions etc. On-the-fly calibration of measurement results may be carried out in imaging or scatterometry using additional measurements or additional target cells.
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公开(公告)号：US11281111B2
公开(公告)日：2022-03-22
申请号：US16317603
申请日：2018-12-14
Applicant: KLA-TENCOR CORPORATION
Inventor： Yoni Shalibo , Yuri Paskover , Vladimir Levinski , Amnon Manassen , Shlomo Eisenbach , Gilad Laredo , Ariel Hildesheim
Abstract: Metrology methods and tools are provided, which enhance the accuracy of the measurements and enable simplification of the measurement process as well as improving the correspondence between the metrology targets and the semiconductor devices. Methods comprise illuminating the target in a Littrow configuration to yield a first measurement signal comprising a −1st diffraction order and a 0th diffraction order and a second measurement signal comprising a +1st distraction order and a 0th diffraction order, wherein the −1st diffraction order of the first measurement signal and the +1st diffraction order of the second measurement signal are diffracted at 180° to a direction of the illumination, performing a first measurement of the first measurement signal and a second measurement of the second measurement signal, and deriving metrology metric(s) therefrom. Optionally, a reflected 0th diffraction order may be split to yield components which interact with the −1st and +1st diffraction orders.
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公开(公告)号：US20210255551A1
公开(公告)日：2021-08-19
申请号：US17241006
申请日：2021-04-26
Applicant: KLA-Tencor Corporation
Inventor： Vladimir Levinski , Yuri Paskover , Amnon Manassen , Yoni Shalibo
Abstract: Metrology tools and methods are provided, which estimate the effect of topographic phases corresponding to different diffraction orders, which result from light scattering on periodic targets, and adjust the measurement conditions to improve measurement accuracy. In imaging, overlay error magnification may be reduced by choosing appropriate measurement conditions based on analysis of contrast function behavior, changing illumination conditions (reducing spectrum width and illumination NA), using polarizing targets and/or optical systems, using multiple defocusing positions etc. On-the-fly calibration of measurement results may be carried out in imaging or scatterometry using additional measurements or additional target cells.
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5.发明申请公开(公告)号：US20200159129A1
公开(公告)日：2020-05-21
申请号：US16491963
申请日：2019-08-05
Applicant: KLA-TENCOR CORPORATION
Inventor： Amnon Manassen , Yuri Paskover , Eran Amit
Abstract: Scatterometry overlay (SCOL) measurement methods, systems and targets are provided to enable efficient SCOL metrology with in-die targets. Methods comprise generating a signal matrix by: illuminating a SCOL target at multiple values of at least one illumination parameter, and at multiple spot locations on the target, wherein the illumination is at a NA (numerical aperture)>⅓ yielding a spot diameter
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Patent Agency Ranking
公开(公告)号：US10444161B2
公开(公告)日：2019-10-15
申请号：US15608766
申请日：2017-05-30
Applicant: KLA-Tencor Corporation
Inventor： Amnon Manassen , Daria Negri , Andrew V. Hill , Ohad Bachar , Vladimir Levinski , Yuri Paskover
Abstract: A metrology system includes an image device and a controller. The image device includes a spectrally-tunable illumination device and a detector to generate images of a sample having metrology target elements on two or more sample layers based on radiation emanating from the sample in response to illumination from the spectrally-tunable illumination device. The controller determines layer-specific imaging configurations of the imaging device to image the metrology target elements on the two or more sample layers within a selected image quality tolerance in which each layer-specific imaging configuration includes an illumination spectrum from the spectrally-tunable illumination device. The controller further receives one or more images of the metrology target elements on the two or more sample layers generated using the layer-specific imaging configurations. The controller further provides a metrology measurement based on the one or more images of the metrology target elements on the two or more sample layers.
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公开(公告)号：US11815347B2
公开(公告)日：2023-11-14
申请号：US15599881
申请日：2017-05-19
Applicant: KLA-Tencor Corporation
Inventor： Yuri Paskover , Amnon Manassen , Vladimir Levinski
CPC classification number: G01B11/272 , G01B11/303 , G01N21/6489 , G01N21/9501 , G03F7/70633 , G01B2210/56
Abstract: Systems and methods are provided which utilize optical microcavity probes to map wafer topography by near-field interactions therebetween in a manner which complies with high volume metrology requirements. The optical microcavity probes detect features on a wafer by shifts in an interference signal between reference radiation and near-field interactions of radiation in the microcavities and wafer features, such as device features and metrology target features. Various illumination and detection configurations provide quick and sensitive signals which are used to enhance optical metrology measurements with respect to their accuracy and sensitivity. The optical microcavity probes may be scanned at a controlled height and position with respect to the wafer and provide information concerning the spatial relations between device and target features.
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公开(公告)号：US20190122357A1
公开(公告)日：2019-04-25
申请号：US15739381
申请日：2017-10-22
Applicant: KLA-Tencor Corporation
Inventor： Tzahi Grunzweig , Nadav Gutman , David Gready , Mark Ghinovker , Vladimir Levinski , Claire E. Staniunas , Nimrod Shuall , Yuri Paskover
Abstract: Systems and methods are provided, which calculate overlay misregistration error estimations from analyzed measurements of each ROI (region of interest) in at least one metrology imaging target, and incorporate the calculated overlay misregistration error estimations in a corresponding estimation of overlay misregistration. Disclosed embodiments provide a graduated and weighted analysis of target quality which may be integrated in a continuous manner into the metrology measurement processes, and moreover evaluates target quality in terms of overlay misregistration, which forms a common basis for evaluation of errors from different sources, such as characteristics of production steps, measurement parameters and target characteristics. Such common basis then enables any of combining various error sources to give a single number associated with measurement fidelity, analyzing various errors at wafer, lot and process levels, and/or to trade-off the resulting accuracy for throughput by reducing the number of measurements, in a controlled manner.
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公开(公告)号：US10048132B2
公开(公告)日：2018-08-14
申请号：US15222503
申请日：2016-07-28
Applicant: KLA-Tencor Corporation
Inventor： Andrew V. Hill , Amnon Manassen , Yuri Paskover , Yuval Lubashevsky
Abstract: Metrology methods and systems are provided, in which the detected image is split at a field plane of the collection path of the metrology system's optical system into at least two pupil plane images. Optical elements such as prisms may be used to split the field plane images, and multiple targets or target cells may be measured simultaneously by spatially splitting the field plane and/or the illumination sources and/or by using two polarization types. The simultaneous capturing of multiple targets or target cells increases the throughput of the disclosed metrology systems.
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公开(公告)号：US20180087900A1
公开(公告)日：2018-03-29
申请号：US15599881
申请日：2017-05-19
Applicant: KLA-Tencor Corporation
Inventor： Yuri Paskover , Amnon Manassen , Vladimir Levinski
CPC classification number: G01B11/272 , G01B11/303 , G01B2210/56 , G01N21/6489 , G01N21/9501 , G03F7/70633
Abstract: Systems and methods are provided which utilize optical microcavity probes to map wafer topography by near-field interactions therebetween in a manner which complies with high volume metrology requirements. The optical microcavity probes detect features on a wafer by shifts in an interference signal between reference radiation and near-field interactions of radiation in the microcavities and wafer features, such as device features and metrology target features. Various illumination and detection configurations provide quick and sensitive signals which are used to enhance optical metrology measurements with respect to their accuracy and sensitivity. The optical microcavity probes may be scanned at a controlled height and position with respect to the wafer and provide information concerning the spatial relations between device and target features.
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