公开(公告)号：US20130182262A1

公开(公告)日：2013-07-18

申请号：US13742113

申请日：2013-01-15

Applicant: KLA-Tencor Corporation

Inventor： Shouhong Tang ,  Andrew An Zeng ,  Yi Zhang ,  Jie-Fei Zheng

IPC: G01B9/02

CPC classification number: G01B9/02076 ,  G01B9/02027

Abstract: Methods and systems for reducing wafer shape and thickness measurement errors resulted from cavity shape changes are disclosed. Cavity calibration process is performed immediately before the wafer measurement. Calibrating the cavity characteristics every time the method is executed reduces wafer shape and thickness measurement errors resulted from cavity shape changes. Additionally or alternatively, a polynomial fitting process utilizing a polynomial of at least a second order is utilized for cavity tilt estimation. High order cavity shape information generated using high order polynomials takes into consideration cavity shape changes due to temperature variations, stress or the like, effectively increases accuracy of the wafer shape and thickness information computed.

Abstract translation: 公开了用于减小由腔形变化导致的晶片形状和厚度测量误差的方法和系统。 在晶片测量之前立即进行腔校准处理。 每次执行该方法时校准腔体特性可降低由腔体形状变化导致的晶片形状和厚度测量误差。 附加地或替代地，利用至少二阶多项式的多项式拟合过程用于腔倾斜估计。 使用高阶多项式生成的高阶腔形状信息考虑到由于温度变化，应力等引起的空腔形状变化，有效地提高了计算出的晶片形状和厚度信息的精度。

公开(公告)号：US09121684B2

公开(公告)日：2015-09-01

申请号：US13742113

申请日：2013-01-15

Applicant: KLA-Tencor Corporation

Inventor： Shouhong Tang ,  Andrew An Zeng ,  Yi Zhang ,  Jie-Fei Zheng

IPC: G01B11/02 ,  G01B9/02

CPC classification number: G01B9/02076 ,  G01B9/02027

Abstract: Methods and systems for reducing wafer shape and thickness measurement errors resulted from cavity shape changes are disclosed. Cavity calibration process is performed immediately before the wafer measurement. Calibrating the cavity characteristics every time the method is executed reduces wafer shape and thickness measurement errors resulted from cavity shape changes. Additionally or alternatively, a polynomial fitting process utilizing a polynomial of at least a second order is utilized for cavity tilt estimation. High order cavity shape information generated using high order polynomials takes into consideration cavity shape changes due to temperature variations, stress or the like, effectively increases accuracy of the wafer shape and thickness information computed.

Abstract translation: 公开了用于减小由腔形变化导致的晶片形状和厚度测量误差的方法和系统。 在晶片测量之前立即进行腔校准处理。 每次执行该方法时校准腔体特性可降低由腔体形状变化导致的晶片形状和厚度测量误差。 附加地或替代地，利用至少二阶多项式的多项式拟合过程用于腔倾斜估计。 使用高阶多项式生成的高阶腔形状信息考虑到由于温度变化，应力等引起的空腔形状变化，有效地提高了计算出的晶片形状和厚度信息的精度。

公开(公告)号：US20160146590A1

公开(公告)日：2016-05-26

申请号：US14945847

申请日：2015-11-19

Applicant: KLA-Tencor Corporation

Inventor： Dengpeng Chen ,  Yi Zhang ,  Jie-Fei Zheng

IPC: G01B9/02

CPC classification number: G01B9/02027 ,  G01B9/02007

Abstract: The system includes a dual interferometer sub-system including a first and second channel. The system includes an illumination source. The illumination source includes a first laser source disposed along a first input path and a second laser source disposed along a second input path. The illumination sources includes a combiner-splitter element optically coupled to an output of the first laser source and an output of the second laser source and is configured to combine light of a first wavelength from the first laser source and light of a second wavelength from the second laser source. The combiner-splitter element is further configured to split the combined light into a first channel and a second channel of the dual interferometer sub-system, where the first and second each receive a portion of the light of the first wavelength and the light of the second wavelength.

Abstract translation: 该系统包括包括第一和第二通道的双干涉仪子系统。 该系统包括照明源。 照明源包括沿着第一输入路径设置的第一激光源和沿着第二输入路径设置的第二激光源。 照明源包括光耦合到第一激光源的输出和第二激光源的输出的组合器分离器元件，并且被配置为将来自第一激光源的第一波长的光和来自第一激光源的第二波长的光组合 第二激光源。 组合分离器元件还被配置为将组合的光分成双干涉仪子系统的第一通道和第二通道，其中第一和第二通道接收第一波长的光的一部分和 第二波长。

公开(公告)号：US09651359B2

公开(公告)日：2017-05-16

申请号：US14945847

申请日：2015-11-19

Applicant: KLA-Tencor Corporation

Inventor： Dengpeng Chen ,  Yi Zhang ,  Jie-Fei Zheng

IPC: G01B9/02

CPC classification number: G01B9/02027 ,  G01B9/02007

Abstract: The system includes a dual interferometer sub-system including a first and second channel. The system includes an illumination source. The illumination source includes a first laser source disposed along a first input path and a second laser source disposed along a second input path. The illumination sources includes a combiner-splitter element optically coupled to an output of the first laser source and an output of the second laser source and is configured to combine light of a first wavelength from the first laser source and light of a second wavelength from the second laser source. The combiner-splitter element is further configured to split the combined light into a first channel and a second channel of the dual interferometer sub-system, where the first and second each receive a portion of the light of the first wavelength and the light of the second wavelength.

公开(公告)号：US08902429B1

公开(公告)日：2014-12-02

申请号：US13705873

申请日：2012-12-05

Applicant: KLA-Tencor Corporation

Inventor： Jie-Fei Zheng ,  Steve Cui

IPC: G01B9/02

CPC classification number: G01B9/02035 ,  G01B2210/44

Abstract: The disclosure is directed to focusing one or more detectors of an interferometry system. An initial focus position may be determined by focusing a detector on an edge of a sample by comparing image contrast of intensity frames collected by the detector. Data associated with an inner edge of a ring formed by the image of the sample reflected on a reference flat may be collected from one or more positions near the initial focus position. The detector can be focused to a selected position by comparing edge data collected at the various detector positions near the initial focus position.

Abstract translation: 本公开涉及聚焦干涉测量系统的一个或多个检测器。 可以通过比较由检测器收集的强度帧的图像对比度来将检测器聚焦在样本的边缘上来确定初始聚焦位置。 与由参考平面反射的样品的图像形成的环的内边缘相关联的数据可以从初始聚焦位置附近的一个或多个位置收集。 通过比较在初始聚焦位置附近的各种检测器位置收集的边缘数据，可以将检测器聚焦到选定位置。