公开(公告)号：US10466596B2

公开(公告)日：2019-11-05

申请号：US14186744

申请日：2014-02-21

Applicant: KLA-Tencor Corporation

Inventor： Bill Pierson ,  Ramkumar Karur-Shanmugam ,  Chin-Chou Huang ,  Ady Levy ,  John Charles Robinson

IPC: G03F7/20

Abstract: The present disclosure is directed to a method of determining at least one correctable for a process tool. In an embodiment, the method includes the steps of: measuring one or more parameter values at one or more measurement locations of each field of a selection of measured fields of a wafer; estimating one or more parameter values for one or more locations of each field of a selection of unmeasured fields of the wafer; and determining at least one correctable for a process tool based upon the one or more parameter values measured at the one or more measurement locations of each field of the selection of measured fields of the wafer and the one or more parameter values estimated for the one or more locations of each field of the selection of unmeasured fields of the wafer.

公开(公告)号：US20180253017A1

公开(公告)日：2018-09-06

申请号：US15867485

申请日：2018-01-10

Applicant: KLA-Tencor Corporation

Inventor： Michael E. Adel ,  Amnon Manassen ,  William Pierson ,  Ady Levy ,  Pradeep Subrahmanyan ,  Liran Yerushalmi ,  DongSub Choi ,  Hoyoung Heo ,  Dror Alumot ,  John Charles Robinson

IPC: G03F7/20

CPC classification number: G03F7/70633 ,  G03F7/705 ,  G03F7/70508 ,  G03F7/7085

Abstract: A process control system may include a controller configured to receive after-development inspection (ADI) data after a lithography step for the current layer from an ADI tool, receive after etch inspection (AEI) overlay data after an exposure step of the current layer from an AEI tool, train a non-zero offset predictor with ADI data and AEI overlay data to predict a non-zero offset from input ADI data, generate values of the control parameters of the lithography tool using ADI data and non-zero offsets generated by the non-zero offset predictor, and provide the values of the control parameters to the lithography tool for fabricating the current layer on the at least one production sample.

公开(公告)号：US20150241790A1

公开(公告)日：2015-08-27

申请号：US14186744

申请日：2014-02-21

Applicant: KLA-Tencor Corporation

Inventor： Bill Pierson ,  Ramkumar Karur-Shanmugam ,  Chin-Chou Huang ,  Ady Levy ,  John Charles Robinson

IPC: G03F7/20

Abstract: The present disclosure is directed to a method of determining at least one correctable for a process tool. In an embodiment, the method includes the steps of: measuring one or more parameter values at one or more measurement locations of each field of a selection of measured fields of a wafer; estimating one or more parameter values for one or more locations of each field of a selection of unmeasured fields of the wafer; and determining at least one correctable for a process tool based upon the one or more parameter values measured at the one or more measurement locations of each field of the selection of measured fields of the wafer and the one or more parameter values estimated for the one or more locations of each field of the selection of unmeasured fields of the wafer.

Abstract translation: 本公开涉及一种确定至少一个可校正过程工具的方法。 在一个实施例中，该方法包括以下步骤：测量晶片的测量场的选择的每个场的一个或多个测量位置处的一个或多个参数值; 估计所述晶片的未测量场的选择的每个场的一个或多个位置的一个或多个参数值; 以及基于在晶片的测量场的选择的每个场的一个或多个测量位置处测量的一个或多个参数值以及针对所述晶片的所测量的一个或多个参数值估计的一个或多个参数值来确定至少一个可校正的处理工具 每个场的更多位置选择晶片的未测量场。

公开(公告)号：US20140303912A1

公开(公告)日：2014-10-09

申请号：US14242528

申请日：2014-04-01

Applicant: KLA-Tencor Corporation

Inventor： Saibal Banerjee ,  Sonu Maheshwary ,  John Charles Robinson ,  Dale Legband

IPC: G01R31/26

CPC classification number: H01L22/14 ,  G05B19/41875 ,  G05B2219/32194 ,  G05B2219/45031 ,  H01L22/20 ,  Y02P90/22

Abstract: Inline yield monitoring may include the use of one or more modules of algorithmic software. Inline yield monitoring may include the use of two related algorithmic software modules such as a learning and a prediction module. The learning module may learn critical PET (parametric electrical test) parameters from data of probe electrical test yields and PET attribute values. The critical PET parameters may best separate outliers and inliers in the yield data. The prediction module may use the critical PET parameters found by the learning module to predict whether a wafer is an inlier or an outlier in a probe test classification.

Abstract translation: 在线产量监测可能包括使用一个或多个算法软件模块。 在线产量监测可以包括使用两个相关的算法软件模块，例如学习和预测模块。 学习模块可以从探头电气测试产量和PET属性值的数据中学习关键的PET（参数电气测试）参数。 关键的PET参数可以最佳地分离产量数据中的异常值和内在值。 预测模块可以使用由学习模块发现的关键PET参数来预测晶片是否是探针测试分类中的异常值或异常值。

公开(公告)号：US10409171B2

公开(公告)日：2019-09-10

申请号：US15867485

申请日：2018-01-10

Applicant: KLA-Tencor Corporation

Inventor： Michael E. Adel ,  Amnon Manassen ,  William Pierson ,  Ady Levy ,  Pradeep Subrahmanyan ,  Liran Yerushalmi ,  DongSub Choi ,  Hoyoung Heo ,  Dror Alumot ,  John Charles Robinson

IPC: G03B27/00 ,  G03F7/20

Abstract: A process control system may include a controller configured to receive after-development inspection (ADI) data after a lithography step for the current layer from an ADI tool, receive after etch inspection (AEI) overlay data after an exposure step of the current layer from an AEI tool, train a non-zero offset predictor with ADI data and AEI overlay data to predict a non-zero offset from input ADI data, generate values of the control parameters of the lithography tool using ADI data and non-zero offsets generated by the non-zero offset predictor, and provide the values of the control parameters to the lithography tool for fabricating the current layer on the at least one production sample.