公开(公告)号：US10340165B2

公开(公告)日：2019-07-02

申请号：US15451038

申请日：2017-03-06

Applicant: KLA-Tencor Corporation

Inventor： Jeremy Nabeth ,  Onur N. Demirer ,  Ramkumar Karur-Shanmugam ,  Choon (George) Hoong Hoo ,  Christian Sparka ,  Hoyoung Heo ,  Stuart Sherwin ,  Fatima Anis ,  Mark D. Smith ,  William Pierson

IPC: G01C1/06 ,  H01L21/67 ,  G01B11/27 ,  G06F17/50 ,  G01B11/00 ,  G03F7/20 ,  G03F9/00

Abstract: A semiconductor tool includes an illumination source to generate an illumination beam, one or more illumination optical elements to direct a portion of the illumination beam to a sample, a detector, one or more collection optical elements to direct radiation emanating from the sample to the detector, and a controller communicatively coupled to the detector. The controller is configured to measure alignment at a plurality of locations across the sample to generate alignment data, select an analysis area for alignment zone determination, divide the analysis area into two or more alignment zones having different alignment signatures; model the alignment data of at least a first alignment zone of the two or more alignment zones using a first alignment model, and model the alignment data of at least a second alignment zone of the two or more alignment zones using a second alignment model different than the first alignment model.

公开(公告)号：US20170287754A1

公开(公告)日：2017-10-05

申请号：US15451038

申请日：2017-03-06

Applicant: KLA-Tencor Corporation

Inventor： Jeremy Nabeth ,  Onur N. Demirer ,  Ramkumar Karur-Shanmugam ,  Choon George Hoong Hoo ,  Christian Sparka ,  Hoyoung Heo ,  Stuart Sherwin ,  Fatima Anis ,  Mark D. Smith ,  William Pierson

IPC: H01L21/67 ,  G06F17/50 ,  G01B11/27

CPC classification number: H01L21/67259 ,  G01B11/002 ,  G01B11/272 ,  G01B2210/56 ,  G03F7/70633 ,  G03F9/7046 ,  G06F17/5009

Abstract: A semiconductor tool includes an illumination source to generate an illumination beam, one or more illumination optical elements to direct a portion of the illumination beam to a sample, a detector, one or more collection optical elements to direct radiation emanating from the sample to the detector, and a controller communicatively coupled to the detector. The controller is configured to measure alignment at a plurality of locations across the sample to generate alignment data, select an analysis area for alignment zone determination, divide the analysis area into two or more alignment zones having different alignment signatures; model the alignment data of at least a first alignment zone of the two or more alignment zones using a first alignment model, and model the alignment data of at least a second alignment zone of the two or more alignment zones using a second alignment model different than the first alignment model.

公开(公告)号：US10466596B2

公开(公告)日：2019-11-05

申请号：US14186744

申请日：2014-02-21

Applicant: KLA-Tencor Corporation

Inventor： Bill Pierson ,  Ramkumar Karur-Shanmugam ,  Chin-Chou Huang ,  Ady Levy ,  John Charles Robinson

IPC: G03F7/20

Abstract: The present disclosure is directed to a method of determining at least one correctable for a process tool. In an embodiment, the method includes the steps of: measuring one or more parameter values at one or more measurement locations of each field of a selection of measured fields of a wafer; estimating one or more parameter values for one or more locations of each field of a selection of unmeasured fields of the wafer; and determining at least one correctable for a process tool based upon the one or more parameter values measured at the one or more measurement locations of each field of the selection of measured fields of the wafer and the one or more parameter values estimated for the one or more locations of each field of the selection of unmeasured fields of the wafer.

公开(公告)号：US20150241790A1

公开(公告)日：2015-08-27

申请号：US14186744

申请日：2014-02-21

Applicant: KLA-Tencor Corporation

Inventor： Bill Pierson ,  Ramkumar Karur-Shanmugam ,  Chin-Chou Huang ,  Ady Levy ,  John Charles Robinson

IPC: G03F7/20

Abstract: The present disclosure is directed to a method of determining at least one correctable for a process tool. In an embodiment, the method includes the steps of: measuring one or more parameter values at one or more measurement locations of each field of a selection of measured fields of a wafer; estimating one or more parameter values for one or more locations of each field of a selection of unmeasured fields of the wafer; and determining at least one correctable for a process tool based upon the one or more parameter values measured at the one or more measurement locations of each field of the selection of measured fields of the wafer and the one or more parameter values estimated for the one or more locations of each field of the selection of unmeasured fields of the wafer.

Abstract translation: 本公开涉及一种确定至少一个可校正过程工具的方法。 在一个实施例中，该方法包括以下步骤：测量晶片的测量场的选择的每个场的一个或多个测量位置处的一个或多个参数值; 估计所述晶片的未测量场的选择的每个场的一个或多个位置的一个或多个参数值; 以及基于在晶片的测量场的选择的每个场的一个或多个测量位置处测量的一个或多个参数值以及针对所述晶片的所测量的一个或多个参数值估计的一个或多个参数值来确定至少一个可校正的处理工具 每个场的更多位置选择晶片的未测量场。