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公开(公告)号：US20160109375A1
公开(公告)日：2016-04-21
申请号：US14882370
申请日：2015-10-13
Applicant: KLA-Tencor Corporation
Inventor： Stilian Ivanov Pandev , Wei Lu , Andrei V. Shchegrov , Pablo Rovira , Jonathan M. Madsen
IPC: G01N21/88
CPC classification number: G01N21/956 , G01N21/93
Abstract: Methods and systems for measuring metrology targets smaller than the illumination spot size employed to perform the measurement are described herein. Collected measurement signals contaminated with information from structures surrounding the target area are reconstructed to eliminate the contamination. In some examples, measurement signals associated one or more small targets and one or more large targets located in close proximity to one another are used to train a signal reconstruction model. The model is subsequently used to reconstruct measurement signals from other small targets. In some other examples, multiple measurements of a small target at different locations within the target are de-convolved to estimate target area intensity. Reconstructed measurement signals are determined by a convolution of the illumination spot profile and the target area intensity. In a further aspect, the reconstructed signals are used to estimate values of parameters of interest associated with the measured structures.
Abstract translation: 本文描述了用于测量小于用于执行测量的照明点尺寸的度量目标的方法和系统。 重建被污染源自目标区域周围结构信息的收集的测量信号，以消除污染。 在一些示例中，使用与一个或多个小目标相关联的测量信号和彼此靠近彼此靠近的一个或多个大目标来训练信号重建模型。 该模型随后用于重建来自其他小目标的测量信号。 在一些其他示例中，目标内不同位置处的小目标的多次测量被去卷积以估计目标区域强度。 重建的测量信号由照明光斑轮廓和目标区域强度的卷积确定。 在另一方面，重建的信号用于估计与测量结构相关联的感兴趣参数的值。
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Patent Agency Ranking
2.发明授权公开(公告)号：US11562289B2
公开(公告)日：2023-01-24
申请号：US16287523
申请日：2019-02-27
Applicant: KLA-Tencor Corporation
Inventor： Song Wu , Yin Xu , Andrei V. Shchegrov , Lie-Quan Lee , Pablo Rovira , Jonathan Madsen
Abstract: A metrology system is disclosed. In one embodiment, the metrology system includes a controller communicatively coupled to a reference metrology tool and an optical metrology tool, the controller including one or more processors configured to: generate a geometric model for determining a profile of a test HAR structure from metrology data from a reference metrology tool; generate a material model for determining one or more material parameters of a test HAR structure from metrology data from the optical metrology tool; form a composite model from the geometric model and the material model; measure at least one additional test HAR structure with the optical metrology tool; and determine a profile of the at least one additional test HAR structure based on the composite model and metrology data from the optical metrology tool associated with the at least one HAR test structure.
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公开(公告)号：US10139352B2
公开(公告)日：2018-11-27
申请号：US14882370
申请日：2015-10-13
Applicant: KLA-Tencor Corporation
Inventor： Stilian Ivanov Pandev , Wei Lu , Andrei V. Shchegrov , Pablo Rovira , Jonathan M. Madsen
IPC: G01N21/93 , G01N21/956
Abstract: Methods and systems for measuring metrology targets smaller than the illumination spot size employed to perform the measurement are described herein. Collected measurement signals contaminated with information from structures surrounding the target area are reconstructed to eliminate the contamination. In some examples, measurement signals associated one or more small targets and one or more large targets located in close proximity to one another are used to train a signal reconstruction model. The model is subsequently used to reconstruct measurement signals from other small targets. In some other examples, multiple measurements of a small target at different locations within the target are de-convolved to estimate target area intensity. Reconstructed measurement signals are determined by a convolution of the illumination spot profile and the target area intensity. In a further aspect, the reconstructed signals are used to estimate values of parameters of interest associated with the measured structures.
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4.发明申请公开(公告)号：US20200184372A1
公开(公告)日：2020-06-11
申请号：US16287523
申请日：2019-02-27
Applicant: KLA-Tencor Corporation
Inventor： Song Wu , Yin Xu , Andrei V. Shchegrov , Lie-Quan Lee , Pablo Rovira , Jonathan Madsen
IPC: G06N20/00 , G01Q30/04 , H01J37/26 , G01N23/201 , G01N21/95
Abstract: A metrology system is disclosed. In one embodiment, the metrology system includes a controller communicatively coupled to a reference metrology tool and an optical metrology tool, the controller including one or more processors configured to: generate a geometric model for determining a profile of a test HAR structure from metrology data from a reference metrology tool; generate a material model for determining one or more material parameters of a test HAR structure from metrology data from the optical metrology tool; form a composite model from the geometric model and the material model; measure at least one additional test HAR structure with the optical metrology tool; and determine a profile of the at least one additional test HAR structure based on the composite model and metrology data from the optical metrology tool associated with the at least one HAR test structure.
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公开(公告)号：US10663392B2
公开(公告)日：2020-05-26
申请号：US16056244
申请日：2018-08-06
Applicant: KLA-Tencor Corporation
Inventor： Barry Blasenheim , Noam Sapiens , Michael Friedmann , Pablo Rovira
Abstract: In some embodiments, a collection system of a semiconductor metrology tool includes a chuck to support a target from which an optical beam is reflected and an aperture mask to provide an adjustable aperture for the reflected optical beam. The aperture mask includes a plurality of opaque plates with adjustable positions. The collection system also includes a spectrometer to receive the reflected optical beam. The aperture mask is situated between the chuck and the spectrometer along the optical axis.
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公开(公告)号：US20190049365A1
公开(公告)日：2019-02-14
申请号：US16056244
申请日：2018-08-06
Applicant: KLA-Tencor Corporation
Inventor： Barry Blasenheim , Noam Sapiens , Michael Friedmann , Pablo Rovira
Abstract: In some embodiments, a collection system of a semiconductor metrology tool includes a chuck to support a target from which an optical beam is reflected and an aperture mask to provide an adjustable aperture for the reflected optical beam. The aperture mask includes a plurality of opaque plates with adjustable positions. The collection system also includes a spectrometer to receive the reflected optical beam. The aperture mask is situated between the chuck and the spectrometer along the optical axis.
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