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公开(公告)号：US20150199463A1
公开(公告)日：2015-07-16
申请号：US14594917
申请日：2015-01-12
Applicant: KLA-Tencor Corporation
Inventor： Jonathan Iloreta , Matthew A. Laffin , Leonid Poslavsky , Torsten Kaack , Qiang Zhao , Lie-Quan Lee
IPC: G06F17/50
CPC classification number: H01L22/12
Abstract: Methods and tools for generating measurement models of complex device structures based on re-useable, parametric models are presented. Metrology systems employing these models are configured to measure structural and material characteristics associated with different semiconductor fabrication processes. The re-useable, parametric sub-structure model is fully defined by a set of independent parameters entered by a user of the model building tool. All other variables associated with the model shape and internal constraints among constituent geometric elements are pre-defined within the model. In some embodiments, one or more re-useable, parametric models are integrated into a measurement model of a complex semiconductor device. In another aspect, a model building tool generates a re-useable, parametric sub-structure model based on input from a user. The resulting models can be exported to a file that can be used by others and may include security features to control the sharing of sensitive intellectual property with particular users.
Abstract translation: 提出了基于可重复使用的参数模型生成复杂设备结构测量模型的方法和工具。 采用这些模型的计量系统被配置为测量与不同半导体制造工艺相关联的结构和材料特性。 可重复使用的参数子结构模型由模型构建工具的用户输入的一组独立参数完全定义。 与模型形状相关联的所有其他变量和组成几何元素之间的内部约束在模型中被预先定义。 在一些实施例中，将一个或多个可重复使用的参数模型集成到复合半导体器件的测量模型中。 在另一方面，模型构建工具基于来自用户的输入生成可重复使用的参数子结构模型。 所得到的模型可以导出到其他人可以使用的文件，并且可能包括用于控制与特定用户共享敏感知识产权的安全功能。
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2.发明申请公开(公告)号：US20200184372A1
公开(公告)日：2020-06-11
申请号：US16287523
申请日：2019-02-27
Applicant: KLA-Tencor Corporation
Inventor： Song Wu , Yin Xu , Andrei V. Shchegrov , Lie-Quan Lee , Pablo Rovira , Jonathan Madsen
IPC: G06N20/00 , G01Q30/04 , H01J37/26 , G01N23/201 , G01N21/95
Abstract: A metrology system is disclosed. In one embodiment, the metrology system includes a controller communicatively coupled to a reference metrology tool and an optical metrology tool, the controller including one or more processors configured to: generate a geometric model for determining a profile of a test HAR structure from metrology data from a reference metrology tool; generate a material model for determining one or more material parameters of a test HAR structure from metrology data from the optical metrology tool; form a composite model from the geometric model and the material model; measure at least one additional test HAR structure with the optical metrology tool; and determine a profile of the at least one additional test HAR structure based on the composite model and metrology data from the optical metrology tool associated with the at least one HAR test structure.
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公开(公告)号：US09347872B1
公开(公告)日：2016-05-24
申请号：US14493863
申请日：2014-09-23
Applicant: KLA-Tencor Corporation
Inventor： Leonid Poslavsky , Lie-Quan Lee
CPC classification number: G01N21/211 , G01N21/9501 , G01N2021/213
Abstract: Methods and systems for determining a meta-model to correct model based measurements are presented. Such systems are employed to measure structural and material characteristics (e.g., material composition, dimensional characteristics of structures and films, etc.) associated with different semiconductor fabrication processes. In one aspect, model-based measurement parameter values are corrected based on a meta-model that maps specimen parameter values determined based on the measurement model to reference parameter values determined based on a more accurate reference measurement. In another aspect, parameters of a meta-model are determined such that errors between reference parameter values and specimen parameter values determined based on the measurement model are minimized. In some embodiments, the accuracy of a corrected parameter value is an order of magnitude greater than the uncorrected parameter value.
Abstract translation: 提出了用于确定元模型以校正基于模型的测量的方法和系统。 这种系统用于测量与不同半导体制造工艺相关的结构和材料特性（例如，材料组成，结构和薄膜的尺寸特性等）。 在一个方面，基于模型的测量参数值是基于将基于测量模型确定的样本参数值映射到基于更准确的参考测量确定的参考参数值的元模型来校正的。 在另一方面，确定元模型的参数，使得基于测量模型确定的参考参数值和样本参数值之间的误差被最小化。 在一些实施例中，校正的参数值的精度比未校正的参数值大一个数量级。
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公开(公告)号：US10386729B2
公开(公告)日：2019-08-20
申请号：US14293221
申请日：2014-06-02
Applicant: KLA-Tencor Corporation
Inventor： Lie-Quan Lee , Leonid Poslavsky , Stilian Ivanov Pandev
Abstract: Dynamic removal of correlation of highly-correlated parameters for optical metrology is described. An embodiment of a method includes determining a model of a structure, the model including a set of parameters; performing optical metrology measurement of the structure, including collecting spectra data on a hardware element; during the measurement of the structure, dynamically removing correlation of two or more parameters of the set of parameters, an iteration of the dynamic removal of correlation including: generating a Jacobian matrix of the set of parameters, applying a singular value decomposition of the Jacobian matrix, selecting a subset of the set of parameters, and computing a direction of the parameter search based on the subset of parameters. If the model does not converge, performing one or more additional iterations of the dynamic removal of correlation until the model converges; and if the model does converge, reporting the results of the measurement.
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Patent Agency Ranking
公开(公告)号：US10345721B1
公开(公告)日：2019-07-09
申请号：US15184782
申请日：2016-06-16
Applicant: KLA-Tencor Corporation
Inventor： Meng Cao , Lie-Quan Lee , Qiang Zhao , Heyin Li , Mengmeng Ye
IPC: G03F9/00
Abstract: Methods and systems for optimizing a set of measurement library control parameters for a particular metrology application are presented herein. Measurement signals are collected from one or more metrology targets by a target measurement system. Values of user selected parameters of interest are resolved by fitting a pre-computed measurement library function to the measurement signals for a given set of library control parameters. Values of one or more library control parameters are optimized such that differences between the values of the parameters of interest estimated by the library based measurement and reference values associated with trusted measurements of the parameters of interest are minimized. The optimization of the library control parameter values is performed without recalculating the pre-computed measurement library. Subsequent library based measurements are performed by the target measurement system using the optimized set of measurement library control parameters with improved measurement performance.
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公开(公告)号：US20170023491A1
公开(公告)日：2017-01-26
申请号：US15166897
申请日：2016-05-27
Applicant: KLA-Tencor Corporation
Inventor： Meng Cao , Lie-Quan Lee , Qiang Zhao , Heyin Li , Mengmeng Ye
IPC: G01N21/95
CPC classification number: G01N21/9501 , G01B21/04 , G01B2210/56 , G01N21/211 , G01N2021/213 , G03F7/705 , G03F7/70625 , G03F7/70633
Abstract: Methods and systems for evaluating and ranking the measurement efficacy of multiple sets of measurement system combinations and recipes for a particular metrology application are presented herein. Measurement efficacy is based on estimates of measurement precision, measurement accuracy, correlation to a reference measurement, measurement time, or any combination thereof. The automated the selection of measurement system combinations and recipes reduces time to measurement and improves measurement results. Measurement efficacy is quantified by a set of measurement performance metrics associated with each measurement system and recipe. In one example, the sets of measurement system combinations and recipes most capable of measuring the desired parameter of interest are presented to the user in rank order based on corresponding values of one or more measurement performance metrics. A user is able to select the appropriate measurement system combination in an objective, quantitative manner.
Abstract translation: 本文介绍了用于评估和评估特定测量应用的多组测量系统组合和配方的测量功能的方法和系统。 测量功效基于测量精度，测量精度，与参考测量的相关性，测量时间或其任何组合的估计。 自动化测量系统组合和配方的选择减少了测量时间并提高了测量结果。 通过与每个测量系统和配方相关联的一组测量性能指标量化测量功效。 在一个示例中，基于一个或多个测量性能度量的对应值，以等级顺序向用户呈现最能测量所需感兴趣参数的测量系统组合和配方的集合。 用户能够以客观，定量的方式选择合适的测量系统组合。
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公开(公告)号：US09553033B2
公开(公告)日：2017-01-24
申请号：US14594917
申请日：2015-01-12
Applicant: KLA-Tencor Corporation
Inventor： Jonathan Iloreta , Matthew A. Laffin , Leonid Poslavsky , Torsten Kaack , Qiang Zhao , Lie-Quan Lee
CPC classification number: H01L22/12
Abstract: Methods and tools for generating measurement models of complex device structures based on re-useable, parametric models are presented. Metrology systems employing these models are configured to measure structural and material characteristics associated with different semiconductor fabrication processes. The re-useable, parametric sub-structure model is fully defined by a set of independent parameters entered by a user of the model building tool. All other variables associated with the model shape and internal constraints among constituent geometric elements are pre-defined within the model. In some embodiments, one or more re-useable, parametric models are integrated into a measurement model of a complex semiconductor device. In another aspect, a model building tool generates a re-useable, parametric sub-structure model based on input from a user. The resulting models can be exported to a file that can be used by others and may include security features to control the sharing of sensitive intellectual property with particular users.
Abstract translation: 提出了基于可重复使用的参数模型生成复杂设备结构测量模型的方法和工具。 采用这些模型的计量系统被配置为测量与不同半导体制造工艺相关联的结构和材料特性。 可重复使用的参数子结构模型由模型构建工具的用户输入的一组独立参数完全定义。 与模型形状相关联的所有其他变量和组成几何元素之间的内部约束在模型中被预先定义。 在一些实施例中，将一个或多个可重复使用的参数模型集成到复合半导体器件的测量模型中。 在另一方面，模型构建工具基于来自用户的输入生成可重复使用的参数子结构模型。 所得到的模型可以导出到其他人可以使用的文件，并且可能包括用于控制与特定用户共享敏感知识产权的安全功能。
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8.发明授权公开(公告)号：US11562289B2
公开(公告)日：2023-01-24
申请号：US16287523
申请日：2019-02-27
Applicant: KLA-Tencor Corporation
Inventor： Song Wu , Yin Xu , Andrei V. Shchegrov , Lie-Quan Lee , Pablo Rovira , Jonathan Madsen
Abstract: A metrology system is disclosed. In one embodiment, the metrology system includes a controller communicatively coupled to a reference metrology tool and an optical metrology tool, the controller including one or more processors configured to: generate a geometric model for determining a profile of a test HAR structure from metrology data from a reference metrology tool; generate a material model for determining one or more material parameters of a test HAR structure from metrology data from the optical metrology tool; form a composite model from the geometric model and the material model; measure at least one additional test HAR structure with the optical metrology tool; and determine a profile of the at least one additional test HAR structure based on the composite model and metrology data from the optical metrology tool associated with the at least one HAR test structure.
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公开(公告)号：US10732520B1
公开(公告)日：2020-08-04
申请号：US16417085
申请日：2019-05-20
Applicant: KLA-Tencor Corporation
Inventor： Meng Cao , Lie-Quan Lee , Qiang Zhao , Heyin Li , Mengmeng Ye
Abstract: Methods and systems for optimizing a set of measurement library control parameters for a particular metrology application are presented herein. Measurement signals are collected from one or more metrology targets by a target measurement system. Values of user selected parameters of interest are resolved by fitting a pre-computed measurement library function to the measurement signals for a given set of library control parameters. Values of one or more library control parameters are optimized such that differences between the values of the parameters of interest estimated by the library based measurement and reference values associated with trusted measurements of the parameters of interest are minimized. The optimization of the library control parameter values is performed without recalculating the pre-computed measurement library. Subsequent library based measurements are performed by the target measurement system using the optimized set of measurement library control parameters with improved measurement performance.
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