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公开(公告)号：US11067516B2
公开(公告)日：2021-07-20
申请号：US16613787
申请日：2018-05-14
Applicant: KLA-Tencor Corporation
Inventor： Shishir Suman , Kenong Wu , Hong Chen
IPC: G01N21/956 , G01N21/95 , G01N23/2251 , G01N21/88
Abstract: Methods and systems for transforming positions of defects detected on a wafer are provided. One method includes aligning output of an inspection subsystem for a first frame in a first swath in a first die in a first instance of a multi-die reticle printed on the wafer to the output for corresponding frames, swaths, and dies in other reticle instances printed on the wafer. The method also includes determining different swath coordinate offsets for each of the frames, respectively, in the other reticle instances based on the swath coordinates of the output for the frames and the corresponding frames aligned thereto and applying one of the different swath coordinate offsets to the swath coordinates reported for the defects based on the other reticle instances in which they are detected thereby transforming the swath coordinates for the defects from swath coordinates in the other reticle instances to the first reticle instance.
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公开(公告)号：US11295432B2
公开(公告)日：2022-04-05
申请号：US15969229
申请日：2018-05-02
Applicant: KLA-TENCOR CORPORATION
Inventor： Kaushik Reddy Vemareddy , Shishir Suman , Pavan Kumar Perali
Abstract: A noise map is used for defect detection. One or more measurements of intensities at one or more pixels are received and an intensity statistic is determined for each measurement. The intensity statistics are grouped into at least one region and stored with at least one alignment target. A wafer can be inspected with a wafer inspection tool using the noise map. The noise map can be used as a segmentation mask to suppress noise.
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公开(公告)号：US10365232B2
公开(公告)日：2019-07-30
申请号：US15939278
申请日：2018-03-29
Applicant: KLA-Tencor Corporation
Inventor： Shishir Suman , Kenong Wu
IPC: G01N21/956 , G01N21/95 , G01N23/2251 , G01N21/88
Abstract: Methods and systems for transforming positions of defects detected on a wafer are provided. One method includes aligning output of an inspection subsystem for a first frame in a first swath in a first die in a first instance of a multi-die reticle printed on the wafer to the output for corresponding frames, swaths, and dies in other reticle instances printed on the wafer. The method also includes determining different swath coordinate offsets for each of the frames, respectively, in the other reticle instances based on the swath coordinates of the output for the frames and the corresponding frames aligned thereto and applying one of the different swath coordinate offsets to the swath coordinates reported for the defects based on the other reticle instances in which they are detected thereby transforming the swath coordinates for the defects from swath coordinates in the other reticle instances to the first reticle instance.
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Patent Agency Ranking
公开(公告)号：US20180276808A1
公开(公告)日：2018-09-27
申请号：US15858264
申请日：2017-12-29
Applicant: KLA-Tencor Corporation
Inventor： Bjorn Brauer , Benjamin Murray , Shishir Suman , Lisheng Gao
Abstract: Systems and methods of a two-pass inspection methodology that dynamically creates micro care areas for inspection of repeater defects. Micro care areas can be formed around each location of a repeater defect. After inspection, additional repeater defects in the micro care areas can be identified. Attributes of the repeater defects can be compared and any repeater defects with attributes that deviate from an expected group attribute distribution can be classified as nuisance.
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公开(公告)号：US20200072763A1
公开(公告)日：2020-03-05
申请号：US16613787
申请日：2018-05-14
Applicant: KLA-Tencor Corporation
Inventor： Shishir Suman , Kenong Wu , Hong Chen
IPC: G01N21/956 , G01N21/95 , G01N23/2251
Abstract: Methods and systems for transforming positions of defects detected on a wafer are provided. One method includes aligning output of an inspection subsystem for a first frame in a first swath in a first die in a first instance of a multi-die reticle printed on the wafer to the output for corresponding frames, swaths, and dies in other reticle instances printed on the wafer. The method also includes determining different swath coordinate offsets for each of the frames, respectively, in the other reticle instances based on the swath coordinates of the output for the frames and the corresponding frames aligned thereto and applying one of the different swath coordinate offsets to the swath coordinates reported for the defects based on the other reticle instances in which they are detected thereby transforming the swath coordinates for the defects from swath coordinates in the other reticle instances to the first reticle instance.
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公开(公告)号：US20180328860A1
公开(公告)日：2018-11-15
申请号：US15939278
申请日：2018-03-29
Applicant: KLA-Tencor Corporation
Inventor： Shishir Suman , Kenong Wu
IPC: G01N21/956 , G01N21/95 , G01N23/2251
CPC classification number: G01N21/95607 , G01N21/9501 , G01N23/2251 , G01N2021/8861 , G01N2223/6116 , G01N2223/646
Abstract: Methods and systems for transforming positions of defects detected on a wafer are provided. One method includes aligning output of an inspection subsystem for a first frame in a first swath in a first die in a first instance of a multi-die reticle printed on the wafer to the output for corresponding frames, swaths, and dies in other reticle instances printed on the wafer. The method also includes determining different swath coordinate offsets for each of the frames, respectively, in the other reticle instances based on the swath coordinates of the output for the frames and the corresponding frames aligned thereto and applying one of the different swath coordinate offsets to the swath coordinates reported for the defects based on the other reticle instances in which they are detected thereby transforming the swath coordinates for the defects from swath coordinates in the other reticle instances to the first reticle instance.
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公开(公告)号：US10600175B2
公开(公告)日：2020-03-24
申请号：US15858264
申请日：2017-12-29
Applicant: KLA-Tencor Corporation
Inventor： Bjorn Brauer , Benjamin Murray , Shishir Suman , Lisheng Gao
Abstract: Systems and methods of a two-pass inspection methodology that dynamically creates micro care areas for inspection of repeater defects. Micro care areas can be formed around each location of a repeater defect. After inspection, additional repeater defects in the micro care areas can be identified. Attributes of the repeater defects can be compared and any repeater defects with attributes that deviate from an expected group attribute distribution can be classified as nuisance.
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公开(公告)号：US20190005638A1
公开(公告)日：2019-01-03
申请号：US15969229
申请日：2018-05-02
Applicant: KLA-TENCOR CORPORATION
Inventor： Kaushik Reddy Vemareddy , Shishir Suman , Pavan Kumar Perali
Abstract: A noise map is used for defect detection. One or more measurements of intensities at one or more pixels are received and an intensity statistic is determined for each measurement. The intensity statistics are grouped into at least one region and stored with at least one alignment target. A wafer can be inspected with a wafer inspection tool using the noise map. The noise map can be used as a segmentation mask to suppress noise.
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