公开(公告)号：US10429321B2

公开(公告)日：2019-10-01

申请号：US15671729

申请日：2017-08-08

Applicant: KLA-Tencor Corporation

Inventor： Steve Zamek ,  David L. Brown ,  Venkatraman Iyer

IPC: G01N21/95 ,  G01T1/24 ,  H01L27/146 ,  H04N5/372 ,  H04N5/225 ,  H01J37/28

Abstract: An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.

公开(公告)号：US20180059033A1

公开(公告)日：2018-03-01

申请号：US15671729

申请日：2017-08-08

Applicant: KLA-Tencor Corporation

Inventor： Steve Zamek ,  David L. Brown ,  Venkatraman Iyer

IPC: G01N21/95 ,  H01L27/146 ,  G01T1/24 ,  H04N5/372

CPC classification number: G01N21/9501 ,  G01T1/24 ,  H01J37/28 ,  H01J2237/2441 ,  H01J2237/2447 ,  H01L27/14618 ,  H01L27/14636 ,  H04N5/2256 ,  H04N5/372 ,  H04N5/37206

Abstract: An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.

公开(公告)号：US11441893B2

公开(公告)日：2022-09-13

申请号：US16018355

申请日：2018-06-26

Applicant: KLA-Tencor Corporation

Inventor： Prasanna Dighe ,  Dieter Mueller ,  Dong Chen ,  Dengpeng Chen ,  Steve Zamek ,  Daniel Kavaldjiev ,  Alexander Buettner

IPC: G01B11/06 ,  G02B6/36

Abstract: A system for analyzing a sample includes an illumination source with a plurality of transmitting optical fibers optically coupled to the illumination source and a detector with a plurality of receiving optical fibers optically coupled to the detector. The system further includes a plurality of probes coupled to respective ones of the plurality of transmitting optical fibers and respective ones of the plurality of receiving optical fibers. The plurality of probes are configured to illuminate respective portions of a surface of the sample and configured to receive illumination reflected, refracted, or radiated from the respective portions of the surface of the sample. The system may further include one or more switches and/or splitters configured to optically couple respective ones of the plurality of transmitting optical fibers to the illumination source and/or configured to optically couple respective ones of the plurality of receiving optical fibers to the detector.

公开(公告)号：US20190331592A1

公开(公告)日：2019-10-31

申请号：US16018355

申请日：2018-06-26

Applicant: KLA-Tencor Corporation

Inventor： Prasanna Dighe ,  Dieter Mueller ,  Dong Chen ,  Dengpeng Chen ,  Steve Zamek ,  Daniel Kavaldjiev ,  Alexander Buettner

IPC: G01N21/27 ,  G01N21/21 ,  G01N21/95 ,  G03F7/20

Abstract: A system for analyzing a sample includes an illumination source with a plurality of transmitting optical fibers optically coupled to the illumination source and a detector with a plurality of receiving optical fibers optically coupled to the detector. The system further includes a plurality of probes coupled to respective ones of the plurality of transmitting optical fibers and respective ones of the plurality of receiving optical fibers. The plurality of probes are configured to illuminate respective portions of a surface of the sample and configured to receive illumination reflected, refracted, or radiated from the respective portions of the surface of the sample. The system may further include one or more switches and/or splitters configured to optically couple respective ones of the plurality of transmitting optical fibers to the illumination source and/or configured to optically couple respective ones of the plurality of receiving optical fibers to the detector.