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    Interposer based imaging sensor for high-speed image acquisition and inspection systems
    1.
    发明授权
    Interposer based imaging sensor for high-speed image acquisition and inspection systems 有权
    基于内插器的成像传感器，用于高速图像采集和检测系统

    公开(公告)号：US08748828B2

    公开(公告)日：2014-06-10

    申请号：US13622155

    申请日：2012-09-18

    申请人： KLA-Tencor Corporation

    发明人： David L. Brown ,  Guowu Zheng ,  Yung-Ho Chuang ,  Venkatraman Iyer

    IPC分类号： G01T1/20

    CPC分类号： H01L27/14636 ,  G01N21/9501 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/14806 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/19105 ,  H04N5/3355 ,  H04N5/369 ,  H05K13/00 ,  Y10T29/49117

    摘要： The present invention includes an interposer disposed on a surface of a substrate, a light sensing array sensor disposed on the interposer, the light sensing array sensor being back-thinned and configured for back illumination, the light sensing array sensor including columns of pixels, one or more amplification circuitry elements configured to amplify an output of the light sensing array sensor, the amplification circuits being operatively connected to the interposer, one or more analog-to-digital conversion circuitry elements configured to convert an output of the light sensing array sensor to a digital signal, the ADC circuitry elements being operatively connected to the interposer, one or more driver circuitry elements configured to drive a clock or control signal of the array sensor, the interposer configured to electrically couple at least two of the light sensing array sensor, the amplification circuits, the conversion circuits, the driver circuits, or one or more additional circuits.

    摘要翻译： 本发明包括设置在基板的表面上的插入器，设置在插入件上的光感测阵列传感器，光感测阵列传感器被背面薄化并被配置为用于背光照明，光感测阵列传感器包括像素列，一 或多个放大电路元件，被配置为放大光感测阵列传感器的输出，放大电路可操作地连接到插入器，一个或多个模拟 - 数字转换电路元件，被配置为将光感测阵列传感器的输出转换成 数字信号，所述ADC电路元件可操作地连接到所述插入器，配置成驱动所述阵列传感器的时钟或控制信号的一个或多个驱动器电路元件，所述插入器被配置为电耦合所述光感测阵列传感器中的至少两个， 放大电路，转换电路，驱动器电路或一个或多个附加电路 电话

    Apparatus for high-speed imaging sensor data transfer
    3.
    发明授权
    Apparatus for high-speed imaging sensor data transfer 有权

    公开(公告)号：US10429321B2

    公开(公告)日：2019-10-01

    申请号：US15671729

    申请日：2017-08-08

    申请人： KLA-Tencor Corporation

    发明人： Steve Zamek ,  David L. Brown ,  Venkatraman Iyer

    IPC分类号： G01N21/95 ,  G01T1/24 ,  H01L27/146 ,  H04N5/372 ,  H04N5/225 ,  H01J37/28

    摘要： An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.

    Integrated multi-channel analog front end and digitizer for high speed imaging applications
    8.
    发明授权
    Integrated multi-channel analog front end and digitizer for high speed imaging applications 有权
    集成多通道模拟前端和数字化仪，用于高速成像应用

    公开(公告)号：US09462206B2

    公开(公告)日：2016-10-04

    申请号：US14272454

    申请日：2014-05-07

    申请人： KLA-Tencor Corporation

    发明人： David L. Brown ,  Mansour Kermat ,  Lance Glasser ,  Henrik Nielsen ,  Guowu Zheng ,  Kurt Lehman ,  Kenneth F. Hatch ,  Yung-Ho Chuang ,  Venkatraman Iyer

    IPC分类号： H04N5/335 ,  H04N5/228 ,  H04N5/378 ,  H04N5/372 ,  H01L27/146 ,  H04N5/369

    CPC分类号： H04N5/378 ,  H01L27/14634 ,  H04N5/3694 ,  H04N5/37206 ,  H04N5/37213

    摘要： A module for high speed image processing includes an image sensor for generating a plurality of analog outputs representing an image and a plurality of HDDs for concurrently processing the plurality of analog outputs. Each HDD is an integrated circuit configured to process in parallel a predetermined set of the analog outputs. Each channel of the HDD can include an AFE for conditioning a signal representing one sensor analog output, an ADC for converting a conditioned signal into a digital signal, and a data formatting block for calibrations and formatting the digital signal for transport to an off-chip device. The HDDs and drive electronics are combined with the image sensor into one package to optimize signal integrity and high dynamic range, and to achieve high data rates through use of synchronized HDD channels. Combining multiple modules results in a highly scalable imaging subsystem optimized for inspection and metrology applications.

    摘要翻译： 用于高速图像处理的模块包括用于产生表示图像的多个模拟输出的图像传感器和用于同时处理多个模拟输出的多个HDD。 每个HDD是被配置为并行处理预定的一组模拟输出的集成电路。 HDD的每个通道可以包括用于调节表示一个传感器模拟输出的信号的AFE，用于将经调节的信号转换成数字信号的ADC，以及用于校准和格式化数字信号以传送到芯片外的数据格式化块 设备。 HDD和驱动电子设备与图像传感器组合成一个封装，以优化信号完整性和高动态范围，并通过使用同步的HDD通道实现高数据速率。 组合多个模块可实现高度可扩展的成像子系统，以优化检测和计量应用。

    Apparatus for High-Speed Imaging Sensor Data Transfer
    9.
    发明申请
    Apparatus for High-Speed Imaging Sensor Data Transfer 审中-公开

    公开(公告)号：US20180059033A1

    公开(公告)日：2018-03-01

    申请号：US15671729

    申请日：2017-08-08

    申请人： KLA-Tencor Corporation

    发明人： Steve Zamek ,  David L. Brown ,  Venkatraman Iyer

    IPC分类号： G01N21/95 ,  H01L27/146 ,  G01T1/24 ,  H04N5/372

    CPC分类号： G01N21/9501 ,  G01T1/24 ,  H01J37/28 ,  H01J2237/2441 ,  H01J2237/2447 ,  H01L27/14618 ,  H01L27/14636 ,  H04N5/2256 ,  H04N5/372 ,  H04N5/37206

    摘要： An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.

    Scanning Electron Microscope And Methods Of Inspecting And Reviewing Samples
    10.
    发明申请
    Scanning Electron Microscope And Methods Of Inspecting And Reviewing Samples 审中-公开

    公开(公告)号：US20170329025A1

    公开(公告)日：2017-11-16

    申请号：US15667500

    申请日：2017-08-02

    申请人： KLA-Tencor Corporation

    发明人： David L. Brown ,  Yung-Ho Alex Chuang ,  John Fielden ,  Marcel Trimpl ,  Jingjing Zhang ,  Devis Contarato ,  Venkatraman Iyer

    IPC分类号： G01T1/24 ,  H01J37/244 ,  H01J37/28 ,  H01L31/00

    摘要： A scanning electron microscope incorporates a multi-pixel solid-state electron detector. The multi-pixel solid-state detector may detect back-scattered and/or secondary electrons. The multi-pixel solid-state detector may incorporate analog-to-digital converters and other circuits. The multi-pixel solid state detector may be capable of approximately determining the energy of incident electrons and/or may contain circuits for processing or analyzing the electron signals. The multi-pixel solid state detector is suitable for high-speed operation such as at a speed of about 100 MHz or higher. The scanning electron microscope may be used for reviewing, inspecting or measuring a sample such as unpatterned semiconductor wafer, a patterned semiconductor wafer, a reticle or a photomask. A method of reviewing or inspecting a sample is also described.