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    Monitoring Incident Beam Position in a Wafer Inspection System
    1.
    发明申请
    Monitoring Incident Beam Position in a Wafer Inspection System 有权
    监测晶圆检测系统中的入射光束位置

    公开(公告)号：US20140071437A1

    公开(公告)日：2014-03-13

    申请号：US13794030

    申请日：2013-03-11

    Applicant: KLA-Tencor Corporation

    Inventor： Juergen Reich ,  Aleksey Petrenko ,  Richard Fong ,  Bret Whiteside ,  Jien Cao ,  Christian Wolters ,  Anatoly Romanovsky ,  Daniel Kavaldjiev

    IPC: G01J1/42

    CPC classification number: G01J1/4257 ,  G01N21/9501 ,  H01L21/67259 ,  H01L21/681

    Abstract: Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction.

    Abstract translation: 提供了用于监测晶片检测系统中的入射光束位置的方法，系统和结构。 一种结构包括形成在卡盘中的特征，其构造成在晶片检查系统检查期间支撑晶片。 卡盘在θ方向旋转晶片，同时在检查期间沿径向方向平移晶片。 穿过特征中心的轴与卡盘的半径对准，使得轴相对于晶片检查系统的入射光束的位置指示在θ方向上的入射光束位置的变化。

    Multi-spot analysis system with multiple optical probes
    3.
    发明授权
    Multi-spot analysis system with multiple optical probes 有权

    公开(公告)号：US11441893B2

    公开(公告)日：2022-09-13

    申请号：US16018355

    申请日：2018-06-26

    Applicant: KLA-Tencor Corporation

    Inventor： Prasanna Dighe ,  Dieter Mueller ,  Dong Chen ,  Dengpeng Chen ,  Steve Zamek ,  Daniel Kavaldjiev ,  Alexander Buettner

    IPC: G01B11/06 ,  G02B6/36

    Abstract: A system for analyzing a sample includes an illumination source with a plurality of transmitting optical fibers optically coupled to the illumination source and a detector with a plurality of receiving optical fibers optically coupled to the detector. The system further includes a plurality of probes coupled to respective ones of the plurality of transmitting optical fibers and respective ones of the plurality of receiving optical fibers. The plurality of probes are configured to illuminate respective portions of a surface of the sample and configured to receive illumination reflected, refracted, or radiated from the respective portions of the surface of the sample. The system may further include one or more switches and/or splitters configured to optically couple respective ones of the plurality of transmitting optical fibers to the illumination source and/or configured to optically couple respective ones of the plurality of receiving optical fibers to the detector.

    Multi-Spot Analysis System with Multiple Optical Probes
    4.
    发明申请
    Multi-Spot Analysis System with Multiple Optical Probes 审中-公开

    公开(公告)号：US20190331592A1

    公开(公告)日：2019-10-31

    申请号：US16018355

    申请日：2018-06-26

    Applicant: KLA-Tencor Corporation

    Inventor： Prasanna Dighe ,  Dieter Mueller ,  Dong Chen ,  Dengpeng Chen ,  Steve Zamek ,  Daniel Kavaldjiev ,  Alexander Buettner

    IPC: G01N21/27 ,  G01N21/21 ,  G01N21/95 ,  G03F7/20

    Abstract: A system for analyzing a sample includes an illumination source with a plurality of transmitting optical fibers optically coupled to the illumination source and a detector with a plurality of receiving optical fibers optically coupled to the detector. The system further includes a plurality of probes coupled to respective ones of the plurality of transmitting optical fibers and respective ones of the plurality of receiving optical fibers. The plurality of probes are configured to illuminate respective portions of a surface of the sample and configured to receive illumination reflected, refracted, or radiated from the respective portions of the surface of the sample. The system may further include one or more switches and/or splitters configured to optically couple respective ones of the plurality of transmitting optical fibers to the illumination source and/or configured to optically couple respective ones of the plurality of receiving optical fibers to the detector.

    Wafer Inspection
    8.
    发明申请
    Wafer Inspection 有权
    晶圆检验

    公开(公告)号：US20150369753A1

    公开(公告)日：2015-12-24

    申请号：US14838194

    申请日：2015-08-27

    Applicant: KLA-Tencor Corporation

    Inventor： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

    IPC: G01N21/88 ,  G01N21/95

    CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

    Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

    Abstract translation: 提供了配置用于检查晶片的系统。 一个系统包括被配置为将光脉冲引导到晶片上的区域的照明子系统; 扫描子系统，被配置为扫描穿过所述晶片的光脉冲; 配置为将从晶片上的区域散射的光脉冲成像到传感器的集合子系统，其中，所述传感器被配置为将少数散射光的脉冲的数量积分成散射光的脉冲数， 在传感器的整个区域成像，并且其中传感器被配置为响应于散射光的积分脉冲产生输出; 以及计算机子系统，被配置为使用由所述传感器产生的输出来检测所述晶片上的缺陷。

    Monitoring incident beam position in a wafer inspection system
    9.
    发明授权
    Monitoring incident beam position in a wafer inspection system 有权
    监测晶圆检测系统中的入射光束位置

    公开(公告)号：US08934091B2

    公开(公告)日：2015-01-13

    申请号：US13794030

    申请日：2013-03-11

    Applicant: KLA-Tencor Corporation

    Inventor： Juergen Reich ,  Aleksey Petrenko ,  Richard Fong ,  Bret Whiteside ,  Jien Cao ,  Christian Wolters ,  Anatoly Romanovsky ,  Daniel Kavaldjiev

    IPC: G01J1/00 ,  H01L21/67 ,  G01J1/42

    CPC classification number: G01J1/4257 ,  G01N21/9501 ,  H01L21/67259 ,  H01L21/681

    Abstract: Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction.

    Abstract translation: 提供了用于监测晶片检测系统中的入射光束位置的方法，系统和结构。 一种结构包括形成在卡盘中的特征，其构造成在晶片检查系统检查期间支撑晶片。 卡盘在θ方向旋转晶片，同时在检查期间沿径向方向平移晶片。 穿过特征中心的轴与卡盘的半径对准，使得轴相对于晶片检查系统的入射光束的位置指示在θ方向上的入射光束位置的变化。

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