公开(公告)号：US20190206704A1

公开(公告)日：2019-07-04

申请号：US16322365

申请日：2017-08-03

Applicant: KONDOH INDUSTRIES, LTD.

Inventor： Toshiro KISAKIBARU ,  Kouta UENO ,  Isao HONBORI ,  Satoki SUGIYAMA

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  B06B1/06 ,  B65G47/90

CPC classification number: H01L21/67092 ,  B06B1/0607 ,  B65G47/90 ,  H01L21/02 ,  H01L21/67115 ,  H01L21/677 ,  H01L21/6773 ,  H01L21/68707

Abstract: An apparatus for manufacturing semiconductors is provided by which adhesion of moisture to a wafer in an EFEM is easily prevented. The apparatus 1 for manufacturing the semiconductors comprises processing equipment 30 that processes a wafer 90, a FOUP 40 that supplies the wafer 90 and that houses the wafer 90 that has been processed, an EFEM 10 that transfers the wafer 90 between the FOUP 40 and the processing equipment 30, a fan and filter unit 20 that sends an airflow 72 from above to the EFEM 10, an ultrasonic oscillator 52 that generates high-frequency power, and a vibrator 54 that generates ultrasonic waves 80 by using the high-frequency power that is generated by the ultrasonic oscillator 52 and that applies the ultrasonic waves 80 to the wafer 90 that is transported in the EFEM 10 and that has been processed.