公开(公告)号：US20160276387A1

公开(公告)日：2016-09-22

申请号：US14407325

申请日：2014-09-04

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： NICOLAAS JOHANNES ANTHONIUS VAN VEEN ,  RAFAEL GOSHEN ,  DAVID YOGEV ,  AMIR LIVNE

IPC: H01L27/146 ,  H01L25/04 ,  H01L23/00

CPC classification number: H01L27/14634 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L25/042 ,  H01L25/043 ,  H01L27/14623 ,  H01L27/14661 ,  H01L27/14663 ,  H01L27/1469 ,  H01L2224/091 ,  H01L2224/09165 ,  H01L2224/16105 ,  H01L2224/16113 ,  H01L2224/16148 ,  H01L2224/16505 ,  H01L2224/16506 ,  H01L2224/171 ,  H01L2224/81047 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2225/06551 ,  H01L2924/0002 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/12043 ,  H01L2924/00

Abstract: The present invention generally relates to a radiation detector element wherein a photodiode is transversely fixed to a detector element substrate through at least one connection comprising two fused solder balls, wherein a first of the two fused solder balls contacts the photodiode and a second of the two fused solder balls (contacts the detector element substrate. The invention further relates to a method of transversally attaching two substrates, in particular constructing the above-mentioned radiation detector element. It also relates to an imaging system comprising at least one radiation detector element.

Abstract translation: 本发明总体上涉及一种辐射检测器元件，其中光电二极管通过包括两个熔融焊球的至少一个连接横向地固定到检测器元件衬底，其中两个熔融焊球中的第一个接触光电二极管，并且两个熔融焊球中的第二个 熔接焊球（接触检测器元件基板）本发明还涉及横向安装两个基板的方法，特别是构造上述辐射探测器元件，还涉及一种包括至少一个辐射探测器元件的成像系统。

公开(公告)号：US20220413170A1

公开(公告)日：2022-12-29

申请号：US17781151

申请日：2020-12-08

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： ROGER STEADMAN BOOKER ,  AMIR LIVNE

IPC: G01T1/24 ,  H01L27/146

Abstract: The present invention relates to a photon counting detector comprising a plurality of detector tiles. Each detector tile comprises a sensor material layer (20), an integrated circuit (30), an input/output connection or flex (50), a high voltage electrode or foil (60), and an anti scatter grid (10). The input/output connection or flex is connected to the integrated circuit. The integrated circuit is configured to readout signals from the sensor material layer. The anti scatter grid is positioned adjacent to a surface of the sensor material layer. The high voltage electrode or foil extends across the surface of the sensor material layer and is configured to provide a bias voltage to the surface of the sensor material layer. The high voltage electrode or foil comprises at least one tail section (70). Relating to the photon counting detector and the plurality of detector tiles, the high voltage electrode or foil of a first detector tile is configured to make an electrical connection with the high voltage electrode or foil of an adjacent detector tile via one or more tail sections of the at least one tail section of the first detector tile and/or via one or more tail sections of the at least one tail section of the adjacent detector tile.