公开(公告)号：US20240332032A1

公开(公告)日：2024-10-03

申请号：US18623233

申请日：2024-04-01

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Dong Jin Kim ,  Jin Han Kim ,  Won Chul Do ,  Jae Hun Bae ,  Won Myoung Ki ,  Dong Hoon Han ,  Do Hyung Kim ,  Ji Hun Lee ,  Jun Hwan Park ,  Seung Nam Son ,  Hyun Cho ,  Curtis Zwenger

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

CPC分类号： H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/92 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68304 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/1132 ,  H01L2224/131 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81464 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/81911 ,  H01L2224/81913 ,  H01L2224/81914 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161

摘要： A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

公开(公告)号：US20240290761A1

公开(公告)日：2024-08-29

申请号：US18439276

申请日：2024-02-12

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Bora Baloglu ,  Ron Huemoeller ,  Curtis Zwenger

IPC分类号： H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/538 ,  H01L23/552 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L25/105 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/565 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L25/0657 ,  H01L25/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/214 ,  H01L2224/32135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/06589 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/3511

摘要： A semiconductor package having an internal heat distribution layer and methods of forming the semiconductor package are provided. The semiconductor package can include a first semiconductor device, a second semiconductor device, and an external heat distribution layer. The first semiconductor device can comprise a first semiconductor die and an external surface comprising a top surface, a bottom surface, and a side surface joining the bottom surface to the tope surface. The second semiconductor device can comprise a second semiconductor die and can be stacked on the top surface of the first semiconductor device. The external heat distribution layer can cover an external surface of the second semiconductor device and the side surface of the first semiconductor device. The external heat distribution layer further contacts an internal heat distribution layer on a top surface of the first semiconductor die.

公开(公告)号：US20240178182A1

公开(公告)日：2024-05-30

申请号：US18519056

申请日：2023-11-26

申请人： PROTEC CO., LTD.

发明人： Youn Sung Ko ,  GEUNSIK AHN

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L24/13 ,  H01L2224/13147 ,  H01L2224/81123 ,  H01L2224/8117 ,  H01L2224/81224

摘要： A flip-chip laser bonding apparatus and method are provided in which flip-chip type semiconductor chips are bonded to a substrate using laser light. The flip-chip laser bonding apparatus and method are effective in rapidly bonding bent or flexible flip-chip type semiconductor chips to a substrate with high quality without contact defects of solder bumps.

公开(公告)号：US20240162402A1

公开(公告)日：2024-05-16

申请号：US18089563

申请日：2022-12-28

申请人： AUO Corporation

发明人： Chia-Hui Pai ,  Wen-Hsien Tseng ,  Chien-Hung Kuo

IPC分类号： H01L33/62 ,  H01L23/00 ,  H01L25/16

CPC分类号： H01L33/62 ,  H01L24/05 ,  H01L24/13 ,  H01L24/29 ,  H01L25/167 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/0568 ,  H01L2224/05686 ,  H01L2224/13021 ,  H01L2224/16057 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29139 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/73153 ,  H01L2224/81224 ,  H01L2224/83224 ,  H01L2224/9221 ,  H01L2924/0132 ,  H01L2924/0549

摘要： A display device includes a circuit substrate, a plurality of pad sets and a plurality of light-emitting elements. The plurality of pad sets is disposed on the circuit substrate, and each pad set includes a first pad and a second pad surrounding the first pad. The plurality of light-emitting elements is disposed above the circuit substrate, and each light-emitting element includes a first electrode, a second electrode and a light-emitting stack between the first electrode and the second electrode, wherein the first electrode is electrically connected to the first pad, the second electrode is electrically connected to the second pad, and an orthographic projection of the second electrode on the circuit substrate is overlapped with an orthographic projection of the first pad on the circuit substrate.

公开(公告)号：US11973054B2

公开(公告)日：2024-04-30

申请号：US17577406

申请日：2022-01-18

申请人： Stroke Precision Advanced Engineering Co., Ltd.

发明人： Yu-Min Huang ,  Sheng Che Huang ,  Chingju Lin ,  Wei-Hao Wang

IPC分类号： B23K1/00 ,  B23K1/005 ,  H01L23/00 ,  B23K101/40

CPC分类号： H01L24/75 ,  B23K1/0053 ,  B23K1/0056 ,  H01L24/80 ,  H01L24/81 ,  B23K2101/40 ,  H01L2224/75263 ,  H01L2224/75283 ,  H01L2224/75705 ,  H01L2224/7598 ,  H01L2224/80224 ,  H01L2224/8023 ,  H01L2224/80815 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81224 ,  H01L2224/8123 ,  H01L2224/81815

摘要： A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.

公开(公告)号：US20240105671A1

公开(公告)日：2024-03-28

申请号：US18447320

申请日：2023-08-10

申请人： Stroke Precision Advanced Engineering Co., Ltd.

发明人： Chien-Shou Liao ,  Chingju Lin

IPC分类号： H01L23/00 ,  H01L25/16

CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L25/167 ,  H01L2224/75262 ,  H01L2224/75314 ,  H01L2224/7555 ,  H01L2224/81005 ,  H01L2224/81201 ,  H01L2224/81224 ,  H01L2224/81815

摘要： An apparatus for transferring an electronic component including a first platform, a second platform, an actuator mechanism, and a flexible push generator is provided. The first platform is configured to carry a carrier substrate. The second platform is configured to carry a target substrate. The actuator mechanism is configured to actuate the first platform and the second platform to approach and move away from each other. The flexible push generator is disposed near the first platform or the second platform and generating a plurality of flexible pushes toward the first platform and the second platform in response to the first platform and the second platform actuated in a way that the first platform and the second platform approach each other.

公开(公告)号：US11652081B2

公开(公告)日：2023-05-16

申请号：US17233245

申请日：2021-04-16

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Yi Dao Wang ,  Tung Yao Lin ,  Rong He Guo

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L24/83 ,  H01L2224/81224 ,  H01L2224/83224

摘要： A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.

公开(公告)号：US20190237445A1

公开(公告)日：2019-08-01

申请号：US16381982

申请日：2019-04-11

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L25/075 ,  H01L21/683 ,  G02F1/1335 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  H01L21/66 ,  H01L23/00 ,  H01L33/62 ,  H01L21/67 ,  H01L23/544 ,  H01L21/48 ,  H01L23/532

CPC分类号： H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/75261 ,  H01L2224/75262 ,  H01L2224/75303 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75317 ,  H01L2224/75651 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75843 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066 ,  H01L2924/00014

摘要： A system to effectuate improved transfer of semiconductor die. A first frame secures a first substrate having the semiconductor die. A second frame secures a second substrate adjacent the first substrate. A needle is disposed adjacent to the first frame. The needle includes: a longitudinal surface extending in a direction toward the second frame, and a base end having a cross-sectional dimension being based, at least in part, on a cross-sectional dimension of the semiconductor die. A needle actuator is operably connected to the needle and is configured to actuate the needle such that, during the transfer operation, when the first substrate is secured in the first frame and the second substrate is secured in the second frame, the needle presses the semiconductor die into contact with the second substrate so as to transfer the semiconductor die onto the second substrate.

公开(公告)号：US20170323863A1

公开(公告)日：2017-11-09

申请号：US15150342

申请日：2016-05-09

申请人： Amkor Technology, Inc.

发明人： Kyoung Yeon Lee ,  Tae Yong Lee ,  Min Chul Shin ,  Se Man Oh

IPC分类号： H01L23/00

CPC分类号： H01L24/11 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/1111 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16012 ,  H01L2224/16013 ,  H01L2224/16057 ,  H01L2224/16104 ,  H01L2224/16238 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81359 ,  H01L2224/81379 ,  H01L2224/81385 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2924/014

摘要： A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device, and a method of manufacturing thereof, that comprises a substrate including a dielectric layer, at least one conductive trace and conductive bump pad formed on one surface of the dielectric layer, and a protection layer covering the at least one conductive trace and conductive bump pad, the at least one conductive bump pad having one end exposed through the protection layer, and a semiconductor die electrically connected to the conductive bump pad of the substrate.

公开(公告)号：US09793198B2

公开(公告)日：2017-10-17

申请号：US14275519

申请日：2014-05-12

申请人： Invensas Corporation

发明人： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC分类号： H01L23/498 ,  B23K35/22 ,  B23K35/02 ,  B32B15/01 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  B23K1/00 ,  B23K101/40

CPC分类号： H01L23/49811 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/0266 ,  B23K35/22 ,  B23K2101/40 ,  B32B15/01 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3135 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/73 ,  H01L24/742 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/98 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/03 ,  H01L2224/03001 ,  H01L2224/03009 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/03334 ,  H01L2224/0348 ,  H01L2224/03848 ,  H01L2224/03849 ,  H01L2224/039 ,  H01L2224/03901 ,  H01L2224/0391 ,  H01L2224/04105 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05294 ,  H01L2224/05547 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05582 ,  H01L2224/056 ,  H01L2224/05794 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/05847 ,  H01L2224/05855 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/10145 ,  H01L2224/11001 ,  H01L2224/11005 ,  H01L2224/11009 ,  H01L2224/111 ,  H01L2224/11318 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/11901 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/1319 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13561 ,  H01L2224/13562 ,  H01L2224/13565 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/1403 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1701 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/17505 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/2401 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/75253 ,  H01L2224/81 ,  H01L2224/81138 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8122 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/82005 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82105 ,  H01L2224/83 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841

摘要： A solder connection may be surrounded by a solder locking layer (1210, 2210) and may be recessed in a hole (1230) in that layer. The recess may be obtained by evaporating a vaporizable portion (1250) of the solder connection. Other features are also provided.