公开(公告)号：US20150099978A1

公开(公告)日：2015-04-09

申请号：US14385783

申请日：2013-03-01

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Richard Edward Davidsen ,  Michael Scarsella ,  James Christopher Taylor ,  Andrew Lee Robinson ,  Wojtek Sudol

IPC: A61B8/00

CPC classification number: A61B8/546 ,  A61B8/4444 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/4494 ,  A61B2018/00023 ,  G01S7/52079 ,  G01S15/8915 ,  G10K11/004

Abstract: A matrix array probe including a transducer array and integrated circuitry coupled to the transducer elements dissipates heat generated by the array and integrated circuitry through the cover of the transducer probe. A pump in the probe connector pumps fluid through a closed loop system including inbound an outbound fluid conduits in the cable. The fluid conduits in the cable are separated by the cable electrical conductors for the probe. The heat transfer in the probe is done by a heat exchanger in the transducer backing block. Additional cooling may be provided by metal to metal contact with a chiller in the ultrasound system.

Abstract translation: 包括耦合到换能器元件的换能器阵列和集成电路的矩阵阵列探针通过换能器探针的盖消散由阵列和集成电路产生的热量。 探头连接器中的一个泵通过一个闭环系统来泵送流体，包括入口电缆中的出口流体管道。 电缆中的流体导管由用于探针的电缆电导体分开。 探头中的传热通过传感器支撑块中的热交换器进行。 可以在超声系统中与冷却器的金属与金属接触来提供额外的冷却。

公开(公告)号：US20180125463A1

公开(公告)日：2018-05-10

申请号：US15862894

申请日：2018-01-05

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Richard Edward Davidsen ,  Michael Scarsella ,  James Christopher Taylor ,  Andrew Lee Robinson ,  Wojtek Sudol

IPC: A61B8/00 ,  G10K11/00

CPC classification number: A61B8/546 ,  A61B8/4444 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/4494 ,  A61B2018/00023 ,  G01S7/52079 ,  G01S15/8915 ,  G10K11/004

Abstract: A matrix array probe including a transducer array and integrated circuitry coupled to the transducer elements dissipates heat generated by the array and integrated circuitry through the cover of the transducer probe. A pump in the probe connector pumps fluid through a closed loop system including inbound an outbound fluid conduits in the cable. The fluid conduits in the cable are separated by the cable electrical conductors for the probe. The heat transfer in the probe is done by a heat exchanger in the transducer backing block. Additional cooling may be provided by metal to metal contact with a chiller in the ultrasound system.

公开(公告)号：US11231491B2

公开(公告)日：2022-01-25

申请号：US15034082

申请日：2014-10-29

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Michael Scarsella ,  Wojtek Sudol

IPC: G01S7/52 ,  A61B8/00 ,  B06B1/06 ,  G01S15/89

Abstract: An ultrasound probe is formed with protected interconnects, thereby resulting in a more robust probe. The interconnects are mounted between an array of transducer elements and an integrated circuit. The array of transducer elements are coupled to the interconnect via flip chip bumps or other structures. Underfill material fixedly positions the interconnects to the integrated circuit. A method of making the transducer assembly is provided.

公开(公告)号：US10178986B2

公开(公告)日：2019-01-15

申请号：US15862894

申请日：2018-01-05

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Richard Edward Davidsen ,  Michael Scarsella ,  James Christopher Taylor ,  Andrew Lee Robinson ,  Wojtek Sudol

IPC: A61B8/00 ,  G10K11/00 ,  G01S7/52 ,  A61B18/00 ,  G01S15/89

Abstract: A matrix array probe including a transducer array and integrated circuitry coupled to the transducer elements dissipates heat generated by the array and integrated circuitry through the cover of the transducer probe. A pump in the probe connector pumps fluid through a closed loop system including inbound an outbound fluid conduits in the cable. The fluid conduits in the cable are separated by the cable electrical conductors for the probe. The heat transfer in the probe is done by a heat exchanger in the transducer backing block. Additional cooling may be provided by metal to metal contact with a chiller in the ultrasound system.

公开(公告)号：US09872669B2

公开(公告)日：2018-01-23

申请号：US14385783

申请日：2013-03-01

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Richard Edward Davidsen ,  Michael Scarsella ,  James Christopher Taylor ,  Andrew Lee Robinson ,  Wojtek Sudol

IPC: A61B8/00 ,  G10K11/00 ,  G01S7/52 ,  A61B18/00 ,  G01S15/89

CPC classification number: A61B8/546 ,  A61B8/4444 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/4494 ,  A61B2018/00023 ,  G01S7/52079 ,  G01S15/8915 ,  G10K11/004

Abstract: A matrix array probe including a transducer array and integrated circuitry coupled to the transducer elements dissipates heat generated by the array and integrated circuitry through the cover of the transducer probe. A pump in the probe connector pumps fluid through a closed loop system including inbound an outbound fluid conduits in the cable. The fluid conduits in the cable are separated by the cable electrical conductors for the probe. The heat transfer in the probe is done by a heat exchanger in the transducer backing block. Additional cooling may be provided by metal to metal contact with a chiller in the ultrasound system.

公开(公告)号：US09689973B2

公开(公告)日：2017-06-27

申请号：US14654877

申请日：2013-12-23

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Bernard Joseph Savord ,  William Ossmann ,  Wojtek Sudol ,  Michael Scarsella ,  George Anthony Brock-Fisher

IPC: G01S7/52 ,  G01S15/02 ,  B06B1/06

CPC classification number: G01S7/52019 ,  B06B1/0622 ,  B06B1/0629 ,  G01S7/52023 ,  G01S15/02

Abstract: An acoustic probe includes a plurality of acoustic array components separated and spaced apart from each other. Each of the acoustic array components includes: an array of acoustic element circuits disposed contiguous to each other at a first pitch; a plurality of pads each corresponding to one of the acoustic element circuits and formed within a circuitry area of the corresponding acoustic element circuit, the pads being disposed at a second pitch; a plurality of interconnection bumps each corresponding to one of the pads and being disposed in electrical connection with the corresponding pad, wherein the interconnection bumps are disposed at a third pitch; and a plurality of acoustic transducer elements on the interconnection bumps. The acoustic transducer elements are disposed at a fourth pitch. At least two of the first, second, third, and fourth pitches are different than each other.