公开(公告)号：US20190135970A1

公开(公告)日：2019-05-09

申请号：US16181351

申请日：2018-11-06

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun Aee CHUN ,  Yun Ju KIM ,  Sook Yeon PARK ,  Su Jin PARK

IPC: C08G18/58 ,  C08G18/71 ,  C08G18/18 ,  C08G18/20

Abstract: Provided are a preparation method of an epoxy compound having an alkoxysilyl group in which an increase in the epoxy equivalent weight (EEW) of the epoxy compound is minimized because alkoxysilylation occurs through a simple one-step reaction using a hydroxyl group formed during the synthesis of the epoxy compound, an epoxy compound having an alkoxysilyl group prepared by the method, a composition comprising the same, and a use thereof. The method includes the reaction of an epoxy compound having a hydroxyl group with an isocyanate alkoxysilane in the presence of amine-based base catalyst, wherein the epoxy compound having an alkoxysilyl group has a mole ratio of [epoxide group]:[alkoxysilyl group] of n:1 ranging from 2:1 to 10:1, and an EEW increase of the epoxy compound having an alkoxysilyl group is less than 260/n. The epoxy compound has good physical properties when being cured.

公开(公告)号：US20240166796A1

公开(公告)日：2024-05-23

申请号：US18490764

申请日：2023-10-20

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun Aee CHUN ,  Su Jin PARK ,  Yun Ju KIM ,  Sook Yeon PARK

IPC: C08G59/14 ,  C08G59/24 ,  C08G59/62 ,  C08G59/68 ,  C08L33/08 ,  C08L63/04 ,  C09J163/04

CPC classification number: C08G59/1444 ,  C08G59/245 ,  C08G59/621 ,  C08G59/688 ,  C08L33/08 ,  C08L63/04 ,  C09J163/04 ,  C08L2203/206 ,  C09J2203/326

Abstract: The present disclosure relates to a modified epoxy resin having a weight average molecular weight of 5,000 to 25,000 and a polydispersity index of 5.0 to 20.0, and comprising (1) an epoxy-derived unit and (2) a modifier-derived unit, a preparation method thereof, a composition comprising the same, and uses thereof. When the epoxy composition comprising the modified epoxy resin according to the present disclosure is cured, the epoxy composition has a lowered coefficient of thermal expansion (CTE), i.e., improved thermal expansion properties, due to curing-induced phase separation (morphological properties) into an epoxy region and an acrylic region. The modified epoxy of the present disclosure and the epoxy composition comprising the same are suitable as adhesives for semiconductor packaging.

公开(公告)号：US20210163673A1

公开(公告)日：2021-06-03

申请号：US17088354

申请日：2020-11-03

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun Aee CHUN ,  Sook Yeon PARK ,  Su Jin PARK ,  Yun Ju KIM

IPC: C08G59/32 ,  C08G59/30 ,  C08G59/24 ,  C08G59/42 ,  C08G59/68 ,  C08L63/04 ,  C08F220/18 ,  C08F220/56 ,  C08K3/22 ,  C08K3/36

Abstract: An epoxy composition, a composite thereof, and an article including the same, in which the reactivity of the epoxy resin having an alkoxysilyl group is improved by a specific acrylic-based polymer resin, are provided. According to the present disclosure, an epoxy composition comprising an epoxy resin having an alkoxysilyl group, an acrylic-based polymer resin, and an inorganic filler, a composite thereof, and an article including the same are provided. The epoxy composition of the present disclosure shows an excellent thermal expansion property in a composite, and may be used in manufacture of semiconductor packaging and/or electrical and electronic components.

公开(公告)号：US20200331934A1

公开(公告)日：2020-10-22

申请号：US16918311

申请日：2020-07-01

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Yun Ju KIM ,  Hyun Aee CHUN ,  Su Jin PARK ,  Sook Yeon PARK

IPC: C07F7/08 ,  B01J31/02 ,  C07D301/02

Abstract: Provided is a method for preparing an epoxy compound having an alkoxysilyl group effectively by using a mild catalyst as well as an aromatic alcohol ring-opening agent. The preparation method for an epoxy compound having an alkoxysilyl group includes: performing a ring opening step by reacting an epoxy compound having an epoxide group, which is a starting material, with an aromatic alcohol ring-opening agent in the presence of a phosphine-based catalyst and an optional solvent so as to obtain an intermediate having a partially ring-opened epoxide group; and performing an alkoxysilylation step by reacting the intermediate having a partially ring-opened epoxide with isocyanate alkoxysilane.

公开(公告)号：US20230146767A1

公开(公告)日：2023-05-11

申请号：US17884580

申请日：2022-08-10

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun Aee CHUN ,  Sook Yeon PARK ,  Yun Ju KIM ,  Su Jin PARK

IPC: C08L63/04 ,  C08G59/24 ,  C08G59/62 ,  C08G59/50 ,  C08G59/40 ,  C08G59/68

CPC classification number: C08L63/04 ,  C08G59/245 ,  C08G59/621 ,  C08G59/688 ,  C08G59/4085 ,  C08G59/5006

Abstract: The present disclosure relates to an epoxy resin of which distribution of molecular weight having distribution range of molecular weight of 300 to 2,000,000 is adjusted such that an upper limit value is increased to a maximum of 2,000,000, a method of preparing the same, a composition comprising the same, and a use thereof. The epoxy resin having controlled distribution of molecular weight of the present disclosure may have improved thermal properties of an epoxy system by expanding the distribution of molecular weight, and may exhibit excellent processability.