Laser light irradiation apparatus and laser peening treatment method

    公开(公告)号:US10226838B2

    公开(公告)日:2019-03-12

    申请号:US15080866

    申请日:2016-03-25

    摘要: An embodiment is to provide a laser light irradiation apparatus and a laser peening treatment method, by which even a member to be processed, existing in a narrow portion, can be easily processed by laser peening. The laser light irradiation apparatus 1 according to the embodiment includes: an optical fiber 2 through which laser light is guided; a condensing lens 3 that is placed on one end of the optical fiber, the condensing lens and the optical fiber defining the light path of the laser light; a guide 4 that retains the optical fiber; and a movement mechanism 5 for changing the position of the optical fiber, wherein the light path of the laser light guided through the optical fiber is emitted at an angle changed to more than 0° and less than 90° with respect to the central axis of the optical fiber by the condensing lens.

    Laser processing apparatus and laser processing method

    公开(公告)号:US10329641B2

    公开(公告)日:2019-06-25

    申请号:US14940474

    申请日:2015-11-13

    摘要: One embodiment of the laser processing apparatus is for surface treatment by supplying liquid to a surface of the target member and irradiating pulsed laser light to the surface of the target member via the liquid. The apparatus includes a laser oscillator and a liquid supply. The laser oscillator irradiates the laser light to the surface through the liquid via an optical window. The liquid supply is configured to supply the liquid to the surface of the target member via a flow path passing on an outer surface of the optical window. When the liquid is in contact with a laser light emission surface of the optical window, the laser light emission surface transmits the laser light. When the liquid is not in contact with the laser light emission surface, the laser light emission surface reflects the laser light.

    Laser processing device
    5.
    发明授权

    公开(公告)号:US10946481B2

    公开(公告)日:2021-03-16

    申请号:US15696909

    申请日:2017-09-06

    摘要: According to one embodiment, a laser processing device includes a light irradiation section, and an optical element. The optical element includes a first transparent member provided via a gap with a tip of the light irradiation section, and a second transparent member. The first transparent member includes a first surface opposed to the tip of the light irradiation section, and a second surface provided so as to be connected to the first surface. The second transparent member includes a flat surface and a convex surface, the flat surface being provided so as to be opposed to the second surface of the first transparent member, the light passed through the first transparent member passing through the convex surface. An optical axis of the laser beam passing through the first surface and an optical axis passing through the convex surface are different from each other.