公开(公告)号：US08259453B2

公开(公告)日：2012-09-04

申请号：US12964821

申请日：2010-12-10

申请人： Kaori Morita ,  Tomoyasu Yamada ,  Tamotsu Kiyakawauchi ,  Akitomi Katsumura ,  Koji Shiozawa

发明人： Kaori Morita ,  Tomoyasu Yamada ,  Tamotsu Kiyakawauchi ,  Akitomi Katsumura ,  Koji Shiozawa

IPC分类号： H05K7/02

CPC分类号： G06K19/07743

摘要： Disclosed herein is a card device including a semiconductor package section having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section having card-side terminals for inputting and outputting information signals, and package-side terminals at a location at which the semiconductor package section is joined to the substrate section by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section by superposition. The substrate section is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals. The superposition junction between the semiconductor package section and the substrate section is provided with such an offset that the card-side connector protrudes out off the card device.

摘要翻译： 本文公开了一种卡装置，其包括具有存储功能的半导体封装部分和通过叠加并通过各种电子部件安装而连接到半导体封装部分的基板部分。 半导体封装部分包括具有用于输入和输出信息信号的卡侧端子的卡侧连接器部分和在半导体封装部分通过叠加与基板部分接合的位置处的封装侧端子。 基板部分包括在基板部分通过叠加连接到半导体封装部分的位置处的基板侧端子。 通过使用封装侧端子和基板侧端子将基板部电连接到半导体封装部。 半导体封装部和基板部之间的叠合接合部设置有使卡侧连接器从卡装置突出的偏移。