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公开(公告)号:US08259453B2
公开(公告)日:2012-09-04
申请号:US12964821
申请日:2010-12-10
IPC分类号: H05K7/02
CPC分类号: G06K19/07743
摘要: Disclosed herein is a card device including a semiconductor package section having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section having card-side terminals for inputting and outputting information signals, and package-side terminals at a location at which the semiconductor package section is joined to the substrate section by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section by superposition. The substrate section is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals. The superposition junction between the semiconductor package section and the substrate section is provided with such an offset that the card-side connector protrudes out off the card device.
摘要翻译: 本文公开了一种卡装置,其包括具有存储功能的半导体封装部分和通过叠加并通过各种电子部件安装而连接到半导体封装部分的基板部分。 半导体封装部分包括具有用于输入和输出信息信号的卡侧端子的卡侧连接器部分和在半导体封装部分通过叠加与基板部分接合的位置处的封装侧端子。 基板部分包括在基板部分通过叠加连接到半导体封装部分的位置处的基板侧端子。 通过使用封装侧端子和基板侧端子将基板部电连接到半导体封装部。 半导体封装部和基板部之间的叠合接合部设置有使卡侧连接器从卡装置突出的偏移。
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公开(公告)号:US5762771A
公开(公告)日:1998-06-09
申请号:US796888
申请日:1997-02-06
申请人: Hirokazu Yamada , Takashi Kojima , Toshimi Miyamoto , Koji Shiozawa , Makoto Hori , Masahiro Hamaya , Minoru Ohta
发明人: Hirokazu Yamada , Takashi Kojima , Toshimi Miyamoto , Koji Shiozawa , Makoto Hori , Masahiro Hamaya , Minoru Ohta
IPC分类号: G01N27/407
CPC分类号: G01N27/407
摘要: An air-fuel ratio sensor comprises an oxygen concentration sensing element, a housing for holding this oxygen concentration sensing element, and protecting covers with gas holes. The protecting covers comprises an inside cover disposed closely to the oxygen concentration sensing element, and an outside cover surrounding the outside cover. Flange-like peripheral portions, formed on the protecting covers, are fixed to the abutting face of the housing by a caulking operation. These flange-like peripheral portions are disposed alternately along a same closed curve around the oxygen concentration sensing element, so that they are not overlapped with each other.
摘要翻译: 空燃比传感器包括氧浓度检测元件,用于保持该氧浓度感测元件的壳体,以及用气孔保护盖。 保护盖包括靠近氧浓度感测元件设置的内盖和围绕外盖的外盖。 形成在保护盖上的法兰状周边部分通过铆接操作固定到壳体的邻接面。 这些凸缘状周边部分沿着氧浓度感测元件周围的相同闭合曲线交替设置,使得它们不彼此重叠。
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公开(公告)号:US07292448B2
公开(公告)日:2007-11-06
申请号:US11508939
申请日:2006-08-24
申请人: Toshichika Urushibara , Koji Shiozawa , Masakazu Okabe , Yukiko Hyodo , Yusuke Masuda , Tadayuki Miyamoto
发明人: Toshichika Urushibara , Koji Shiozawa , Masakazu Okabe , Yukiko Hyodo , Yusuke Masuda , Tadayuki Miyamoto
IPC分类号: H05K7/00
CPC分类号: H05K1/147 , H05K1/141 , H05K1/189 , H05K3/363 , H05K3/4691 , H05K2201/09063 , H05K2201/2009 , H05K2203/1572 , H05K2203/167 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49155 , Y10T156/1056 , Y10T156/1075 , Y10T156/137
摘要: A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second land portions located at a predetermined interval on one surface and a flexible wiring board sandwiched by the first and second rigid substrates and which has a plurality of third land portions corresponding to the first land portions on one surface and a plurality of fourth land portions corresponding to the second land portions on the other surface. In this circuit substrate, the second and fourth land portions are displaced from each other relative to the first and third land portions and at least part of the first and third land portions and at least part of the second and fourth land portions are electrically connected to each other, respectively.
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公开(公告)号:US20070081309A1
公开(公告)日:2007-04-12
申请号:US11508939
申请日:2006-08-24
申请人: Toshichika Urushibara , Koji Shiozawa , Masakazu Okabe , Yukiko Hyodo , Yusuke Masuda , Tadayuki Miyamoto
发明人: Toshichika Urushibara , Koji Shiozawa , Masakazu Okabe , Yukiko Hyodo , Yusuke Masuda , Tadayuki Miyamoto
CPC分类号: H05K1/147 , H05K1/141 , H05K1/189 , H05K3/363 , H05K3/4691 , H05K2201/09063 , H05K2201/2009 , H05K2203/1572 , H05K2203/167 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49155 , Y10T156/1056 , Y10T156/1075 , Y10T156/137
摘要: A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second land portions located at a predetermined interval on one surface and a flexible wiring board sandwiched by the first and second rigid substrates and which has a plurality of third land portions corresponding to the first land portions on one surface and a plurality of fourth land portions corresponding to the second land portions on the other surface. In this circuit substrate, the second and fourth land portions are displaced from each other relative to the first and third land portions and at least part of the first and third land portions and at least part of the second and fourth land portions are electrically connected to each other, respectively.
摘要翻译: 电路基板包括:第一刚性基板,具有在一个表面上以预定间隔设置的多个焊盘部分;第二刚性基板,具有在一个表面上以预定间隔设置的多个第二焊盘部分和由 第一刚性基板和第二刚性基板,并且在一个表面上具有对应于第一焊盘部分的多个第三焊盘部分和与另一个表面上的第二焊盘部分对应的多个第四焊盘部分。 在该电路基板中,第二和第四接地部分相对于第一和第三接地部分以及第一和第三接地部分的至少一部分彼此位移,并且第二和第四接地部分的至少一部分电连接到 彼此分别。
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