公开(公告)号：US20110157838A1

公开(公告)日：2011-06-30

申请号：US12964821

申请日：2010-12-10

申请人： KAORI MORITA ,  TOMOYASU YAMADA ,  TAMOTSU KIYAKAWAUCHI ,  AKITOMI KATSUMURA ,  KOJI SHIOZAWA

发明人： KAORI MORITA ,  TOMOYASU YAMADA ,  TAMOTSU KIYAKAWAUCHI ,  AKITOMI KATSUMURA ,  KOJI SHIOZAWA

IPC分类号： H05K1/14

CPC分类号： G06K19/07743

摘要： Disclosed herein is a card device including a semiconductor package section having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section having card-side terminals for inputting and outputting information signals, and package-side terminals at a location at which the semiconductor package section is joined to the substrate section by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section by superposition. The substrate section is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals. The superposition junction between the semiconductor package section and the substrate section is provided with such an offset that the card-side connector protrudes out off the card device.

摘要翻译： 本文公开了一种卡装置，其包括具有存储功能的半导体封装部分和通过叠加并通过各种电子部件安装而连接到半导体封装部分的基板部分。 半导体封装部分包括具有用于输入和输出信息信号的卡侧端子的卡侧连接器部分和在半导体封装部分通过叠加与基板部分接合的位置处的封装侧端子。 基板部分包括在基板部分通过叠加连接到半导体封装部分的位置处的基板侧端子。 通过使用封装侧端子和基板侧端子将基板部电连接到半导体封装部。 半导体封装部和基板部之间的叠合接合部设置有使卡侧连接器从卡装置突出的偏移。

公开(公告)号：US08259453B2

公开(公告)日：2012-09-04

申请号：US12964821

申请日：2010-12-10

申请人： Kaori Morita ,  Tomoyasu Yamada ,  Tamotsu Kiyakawauchi ,  Akitomi Katsumura ,  Koji Shiozawa

发明人： Kaori Morita ,  Tomoyasu Yamada ,  Tamotsu Kiyakawauchi ,  Akitomi Katsumura ,  Koji Shiozawa

IPC分类号： H05K7/02

CPC分类号： G06K19/07743

摘要： Disclosed herein is a card device including a semiconductor package section having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section having card-side terminals for inputting and outputting information signals, and package-side terminals at a location at which the semiconductor package section is joined to the substrate section by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section by superposition. The substrate section is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals. The superposition junction between the semiconductor package section and the substrate section is provided with such an offset that the card-side connector protrudes out off the card device.

摘要翻译： 本文公开了一种卡装置，其包括具有存储功能的半导体封装部分和通过叠加并通过各种电子部件安装而连接到半导体封装部分的基板部分。 半导体封装部分包括具有用于输入和输出信息信号的卡侧端子的卡侧连接器部分和在半导体封装部分通过叠加与基板部分接合的位置处的封装侧端子。 基板部分包括在基板部分通过叠加连接到半导体封装部分的位置处的基板侧端子。 通过使用封装侧端子和基板侧端子将基板部电连接到半导体封装部。 半导体封装部和基板部之间的叠合接合部设置有使卡侧连接器从卡装置突出的偏移。

公开(公告)号：US20110182037A1

公开(公告)日：2011-07-28

申请号：US13008415

申请日：2011-01-18

申请人： Akitomi Katsumura

发明人： Akitomi Katsumura

IPC分类号： H05K7/00

CPC分类号： G06K19/07743 ,  G06K19/07728 ,  G06K19/07732 ,  G06K19/07735

摘要： A card device capable of improving mechanical strength of a mounting substrate with a simple structure is provided. A memory card includes the mounting substrate and a semiconductor package in a package. An electronic component such as a communication component on the mounting substrate is covered with a protective member having an electromagnetic shield function. The protective member is formed by drawing process of a sheet metal, has a containable space by a ceiling section and a side wall, and has a curve section at a joint section between an all rim of the ceiling section and the side wall. A flange is provided on the bottom end of the side wall, and the flange is solder-jointed with a ground region of the mounting substrate. In the protective member having the foregoing structure, stress hardly concentrates locally. Thus, its mechanical strength is large, and rigidity of the mounting substrate is increased.

摘要翻译： 提供能够以简单的结构提高安装基板的机械强度的卡装置。 存储卡包括安装基板和封装中的半导体封装。 诸如安装基板上的通信部件的电子部件被具有电磁屏蔽功能的保护部件覆盖。 保护部件通过金属板的拉拔加工形成，具有顶棚部和侧壁的可容纳空间，并且在天花板部分的所有边缘与侧壁之间的接合部分具有弯曲部分。 在侧壁的底端设有凸缘，凸缘与安装基板的接地区焊接。 在具有上述结构的保护构件中，应力几乎不局部集中。 因此，其机械强度大，安装基板的刚性提高。