公开(公告)号：USD593456S1

公开(公告)日：2009-06-02

申请号：US29321471

申请日：2008-07-17

申请人： Kaoru Sasaki ,  Satoshi Yoshida ,  Satoshi Harizuka

设计人： Kaoru Sasaki ,  Satoshi Yoshida ,  Satoshi Harizuka

公开(公告)号：US07619292B2

公开(公告)日：2009-11-17

申请号：US12041530

申请日：2008-03-03

申请人： Yoshihiro Okada ,  Takahiko Ogo ,  Kaoru Sasaki

发明人： Yoshihiro Okada ,  Takahiko Ogo ,  Kaoru Sasaki

IPC分类号： H01L31/02

CPC分类号： H01L27/14683 ,  H01L27/14623 ,  H01L27/14636 ,  H01L27/14685

摘要： A semiconductor integrated device comprises: a light-shielding film which shields at least some part of a transfer section of the semiconductor integrated device from light; a first wiring formed in the same layer as the light-shielding film, with one end connected to a pad electrode and an other end extended to a side edge of the semiconductor substrate; a second wiring arranged to go around a side face of the semiconductor substrate, and connected to the first wiring; and a sealing member which seals the solid-state image sensor.

摘要翻译： 半导体集成器件包括：遮光半导体集成器件的转印部分的至少一部分光的遮光膜; 形成在与所述遮光膜相同的层中的第一布线，其一端连接到焊盘电极，另一端延伸到所述半导体衬底的侧边缘; 布置成绕着半导体衬底的侧面并连接到第一布线的第二布线; 以及密封固态图像传感器的密封构件。

公开(公告)号：US07056811B2

公开(公告)日：2006-06-06

申请号：US10861155

申请日：2004-06-04

申请人： Kaoru Sasaki ,  Keiji Yamamoto

发明人： Kaoru Sasaki ,  Keiji Yamamoto

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L21/78 ,  H01L21/304

摘要： An integrated circuit is formed in each region of a front surface of a semiconductor device. The semiconductor device is mechanically ground so as to be left having a thickness enough to prevent a defect on the back surface from reaching its opposed front surface. Thereafter, the back surface of the semiconductor device is subjected to etching in mainly chemical reaction to thereby smoothe concaves and convexes caused on the back surface of the semiconductor device in mechanical grinding, so that the semiconductor device is made thinner by the amount corresponding to a concave/convex difference. When the back surface of the semiconductor device is smoothed as described above, stress will not concentrate at the concaves and convexes on the back surface of the semiconductor substrate at a later processing stage where a lower supporting base is fixedly formed on the back surface of the semiconductor substrate via an insulating resin layer, whereby a laminated body is formed on the back surface of the semiconductor substrate. This arrangement enhances the reliability of the resulting semiconductor devices.

摘要翻译： 在半导体器件的前表面的每个区域中形成集成电路。 半导体器件被机械地研磨以使其具有足够的厚度以防止背面上的缺陷到达其相对的前表面。 此后，半导体器件的背面主要进行化学反应的蚀刻，从而平滑在机械研磨中在半导体器件的背面上引起的凹凸，使得半导体器件的厚度相当于 凹/凸差。 当如上所述平滑半导体器件的背面时，在稍后的处理阶段，在半导体衬底的背面上的应力不会集中在半导体衬底的背面上的凹凸处， 半导体衬底经由绝缘树脂层，由此在半导体衬底的背面上形成层叠体。 这种布置提高了所得到的半导体器件的可靠性。

公开(公告)号：US07410294B2

公开(公告)日：2008-08-12

申请号：US10559763

申请日：2004-06-22

申请人： Satoru Shiraki ,  Kaoru Sasaki ,  Yutaka Wakabayashi

发明人： Satoru Shiraki ,  Kaoru Sasaki ,  Yutaka Wakabayashi

IPC分类号： G01K1/00

CPC分类号： G01K1/14 ,  G01K1/08

摘要： A temperature sensor with a reduced number of components is provided.In the temperature sensor (10) in accordance with the present invention, a cap part (44A) of a sensor cover (44) covers an opening (14) of a holder (12) as a whole, whereby water droplets and the like are prevented from entering between the holder (12) and a filler resin part (42). A neck part (44B) of the sensor cover (44) keeps a harness pair (34A, 34B) from breaking by bending in excess. Both of the cap part (44A) and neck part (44B) are a part of the sensor cover (44) and are integrated together. The number of components in the temperature sensor (10) employing such a sensor cover (44) is smaller than that in a temperature sensor (50) in which a cap and a lead drawing member are separate from each other.

摘要翻译： 提供了具有减少的部件数量的温度传感器。 在根据本发明的温度传感器（10）中，传感器盖（44）的盖部（44A）整体覆盖保持器（12）的开口（14），由此水滴等 被阻止进入保持器（12）和填充树脂部件（42）之间。 传感器盖（44）的颈部（44B）使线束对（34A，34B）通过弯曲过度而断裂。 帽部分（44A）和颈部部分（44B）都是传感器盖（44）的一部分并且被集成在一起。 使用这种传感器盖（44）的温度传感器（10）中的部件的数量小于其中盖和引导引导部件彼此分离的温度传感器（50）中的部件的数量。

公开(公告)号：US20070110124A1

公开(公告)日：2007-05-17

申请号：US10559763

申请日：2004-06-22

申请人： Satoru Shiraki ,  Kaoru Sasaki ,  Yutaka Wakabayashi

发明人： Satoru Shiraki ,  Kaoru Sasaki ,  Yutaka Wakabayashi

IPC分类号： G01K1/14 ,  G01K7/00 ,  G01K1/00

CPC分类号： G01K1/14 ,  G01K1/08

摘要： A temperature sensor with a reduced number of components is provided. In the temperature sensor (10) in accordance with the present invention, a cap part (44A) of a sensor cover (44) covers an opening (14) of a holder (12) as a whole, whereby water droplets and the like are prevented from entering between the holder (12) and a filler resin part (42). A neck part (44B) of the sensor cover (44) keeps a harness pair (34A, 34B) from breaking by bending in excess. Both of the cap part (44A) and neck part (44B) are a part of the sensor cover (44) and are integrated together. The number of components in the temperature sensor (10) employing such a sensor cover (44) is smaller than that in a temperature sensor (50) in which a cap and a lead drawing member are separate from each other.

摘要翻译： 提供了具有减少的部件数量的温度传感器。 在根据本发明的温度传感器（10）中，传感器盖（44）的盖部（44A）整体覆盖保持器（12）的开口（14），由此水滴等 被阻止进入保持器（12）和填充树脂部件（42）之间。 传感器盖（44）的颈部（44B）使线束对（34A，34B）通过弯曲过度而断裂。 帽部分（44A）和颈部部分（44B）都是传感器盖（44）的一部分并且被集成在一起。 使用这种传感器盖（44）的温度传感器（10）中的部件的数量小于其中盖和引导引导部件彼此分离的温度传感器（50）中的部件的数量。

公开(公告)号：US20080203513A1

公开(公告)日：2008-08-28

申请号：US12041530

申请日：2008-03-03

申请人： Yoshihiro Okada ,  Takahiko Ogo ,  Kaoru Sasaki

发明人： Yoshihiro Okada ,  Takahiko Ogo ,  Kaoru Sasaki

IPC分类号： H01L31/0224

CPC分类号： H01L27/14683 ,  H01L27/14623 ,  H01L27/14636 ,  H01L27/14685

摘要： A semiconductor integrated device comprises: a light-shielding film which shields at least some part of a transfer section of the semiconductor integrated device from light; a first wiring formed in the same layer as the light-shielding film, with one end connected to a pad electrode and an other end extended to a side edge of the semiconductor substrate; a second wiring arranged to go around a side face of the semiconductor substrate, and connected to the first wiring; and a sealing member which seals the solid-state image sensor.

摘要翻译： 半导体集成器件包括：遮光半导体集成器件的转印部分的至少一部分光的遮光膜; 形成在与所述遮光膜相同的层中的第一布线，其一端连接到焊盘电极，另一端延伸到所述半导体基板的侧边缘; 布置成绕着半导体衬底的侧面并连接到第一布线的第二布线; 以及密封固态图像传感器的密封构件。

公开(公告)号：US07361525B2

公开(公告)日：2008-04-22

申请号：US10530095

申请日：2003-11-14

申请人： Yoshiro Okada ,  Takahiko Ogo ,  Kaoru Sasaki

发明人： Yoshiro Okada ,  Takahiko Ogo ,  Kaoru Sasaki

IPC分类号： H01L21/00

CPC分类号： H01L27/14683 ,  H01L27/14623 ,  H01L27/14636 ,  H01L27/14685

摘要： A semiconductor integrated device comprises: a light-shielding film which shields at least some part of a transfer section of the semiconductor integrated device from light; a first wiring formed in the same layer as the light-shielding film, with one end connected to a pad electrode and an other end extended to a side edge of the semiconductor substrate; a second wiring arranged to go around a side face of the semiconductor substrate, and connected to the first wiring; and a sealing member which seals the solid-state image sensor.

摘要翻译： 半导体集成器件包括：遮光半导体集成器件的转印部分的至少一部分光的遮光膜; 形成在与所述遮光膜相同的层中的第一布线，其一端连接到焊盘电极，另一端延伸到所述半导体基板的侧边缘; 布置成绕着半导体衬底的侧面并连接到第一布线的第二布线; 以及密封固态图像传感器的密封构件。

公开(公告)号：US20060022288A1

公开(公告)日：2006-02-02

申请号：US10530095

申请日：2003-11-14

申请人： Yoshihiro Okada ,  Takahiko Ogo ,  Kaoru Sasaki

发明人： Yoshihiro Okada ,  Takahiko Ogo ,  Kaoru Sasaki

IPC分类号： H01L27/14 ,  H01L21/00

CPC分类号： H01L27/14683 ,  H01L27/14623 ,  H01L27/14636 ,  H01L27/14685

摘要： A semiconductor integrated device comprises: a light-shielding film which shields at least some part of a transfer section of the semiconductor integrated device from light; a first wiring formed in the same layer as the light-shielding film, with one end connected to a pad electrode and an other end extended to a side edge of the semiconductor substrate; a second wiring arranged to go around a side face of the semiconductor substrate, and connected to the first wiring; and a sealing member which seals the solid-state image sensor.

摘要翻译： 半导体集成器件包括：遮光半导体集成器件的转印部分的至少一部分光的遮光膜; 形成在与所述遮光膜相同的层中的第一布线，其一端连接到焊盘电极，另一端延伸到所述半导体基板的侧边缘; 布置成绕着半导体衬底的侧面并连接到第一布线的第二布线; 以及密封固态图像传感器的密封构件。

公开(公告)号：US06888450B2

公开(公告)日：2005-05-03

申请号：US10373253

申请日：2003-02-24

申请人： Kaoru Sasaki ,  Yoshiaki Uchida

发明人： Kaoru Sasaki ,  Yoshiaki Uchida

IPC分类号： G01L17/00 ,  B60C23/02 ,  B60C23/04 ,  B60C23/20 ,  B60C29/02 ,  B60Q1/00 ,  B60R25/10

CPC分类号： B60C23/0408 ,  B60C23/006 ,  B60C23/0401

摘要： A motor cycle incorporates a sensor detecting a condition of the tire, such as, for example, tire pressure. A transmitter transmits the tire condition and a receiver receives the tire condition. An indicator indicates the tire condition. A battery supplies electric power to an engine of the motorcycle, the receiver and the indicator. A control device controls the power supply to the engine, the receiver and the indicator from the battery. A main switch assembly and an activating switch, which activates the receiver and the indicator, are interposed between the battery and the control device. The control device allows power supply to the engine, the receiver and the indicator when the main switch assembly is turned on. The control device also allows power supply to the receiver and the indicator when the activating switch is turned on. In some arrangements, the activating switch is automatically turned on when another sensor detects a condition change of a frame assembly of the motorcycle.

摘要翻译： 电动循环包括检测轮胎状况的传感器，例如轮胎压力。 发射机传输轮胎状况，接收机接收轮胎状况。 指示灯表示轮胎状况。 电池为摩托车，接收器和指示器的发动机提供电力。 控制装置控制来自发动机的电源，接收器和来自电池的指示器。 启动接收器和指示器的主开关组件和启动开关插入在电池和控制装置之间。 当主开关组件打开时，控制装置允许对发动机，接收器和指示器供电。 当激活开关打开时，控制装置还允许对接收器和指示器供电。 在一些布置中，当另一传感器检测到摩托车的框架组件的状况变化时，启动开关自动开启。