摘要:
A rack for supporting electronic devices and modules with adjustable rails. The rack has a vertical wall with a set of holes at various elevations, each set of holes including at least a proximal hole evenly spaced apart from a distal hole. A longitudinally-extending rail has a set of clips for selectively securing the rail to the vertical wall, wherein the set of clips includes at least a proximal clip selectively receivable in the proximal hole at a selected elevation for supporting a proximal end of the rail and a distal clip selectively receivable in the distal hole at the selected elevation for supporting a distal end of the rail. The system may include a second rail for securing to an opposing vertical wall of the rack to form a shelf or bay for an electronic device. Each rail may be latched in place and can be selectively installed and removed without use of tools.
摘要:
A rack for supporting electronic devices and modules with adjustable rails. The rack has a vertical wall with a set of holes at various elevations, each set of holes including at least a proximal hole evenly spaced apart from a distal hole. A longitudinally-extending rail has a set of clips for selectively securing the rail to the vertical wall, wherein the set of clips includes at least a proximal clip selectively receivable in the proximal hole at a selected elevation for supporting a proximal end of the rail and a distal clip selectively receivable in the distal hole at the selected elevation for supporting a distal end of the rail. The system may include a second rail for securing to an opposing vertical wall of the rack to form a shelf or bay for an electronic device. Each rail may be latched in place and can be selectively installed and removed without use of tools.
摘要:
Method and apparatus for blind docking an electronic device or module with an electrical connector, for example within a rack for a computer system. A forwardly-directed power connector is secured to a distal end of at least one rail or shelf bracket for blind docking with a rearwardly-directed power connector on the electronic module. The shelf bracket securing the forwardly-directed electrical connector is included in a pair of longitudinally-extending shelf brackets secured to opposing vertical side walls of a rack at a common elevation to form a module bay. The electronic module may slide along the shelf bracket until a rearwardly-directed power connector of the electronic module blind docks with the forwardly-directed power connector. A boss or alignment stud may be included on the bracket to improve alignment of the connectors. The forwardly-direct electrical connector may also be secured to the bracket with a floating connection to enable minor adjustments in alignment during blind docking.
摘要:
Method and apparatus for blind docking an electronic device or module with an electrical connector, for example within a rack for a computer system. A forwardly-directed power connector is secured to a distal end of at least one rail or shelf bracket for blind docking with a rearwardly-directed power connector on the electronic module. The shelf bracket securing the forwardly-directed electrical connector is included in a pair of longitudinally-extending shelf brackets secured to opposing vertical side walls of a rack at a common elevation to form a module bay. The electronic module may slide along the shelf bracket until a rearwardly-directed power connector of the electronic module blind docks with the forwardly-directed power connector. A boss or alignment stud may be included on the bracket to improve alignment of the connectors. The forwardly-direct electrical connector may also be secured to the bracket with a floating connection to enable minor adjustments in alignment during blind docking.
摘要:
Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices.
摘要:
Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices.
摘要:
An apparatus comprising a chassis providing a plurality of module bays, one or more modules received in the module bays, wherein each module has at least one damper actuator extending from a distal end of the module. A fan assembly and a plurality of air flow dampers are secured in a distal end of the chassis, wherein each damper is aligned with one module bay to control air flow through the aligned module bay. Each damper is biased to close in the absence of contact with a damper actuator and opens in response to contact with a damper actuator. Each damper opens to a variable extent determined by the profile of the contacting damper actuator. The damper actuator of a particular module has a profile corresponding to the thermal load of that module, such that installing a module into the chassis automatically opens the aligned damper to the desired extent.
摘要:
A system for receiving and supporting a plurality of devices connected to a network. The system comprises a rack having a front side providing access to a plurality of chassis bays for receiving a chassis and aligning a back end of the chassis for blind docking with an electrical power source. The chassis includes a power supply, a fan, and a front side providing access to a plurality of module bays for receiving a module and aligning a back end of the module for blind docking with the power supply. A compute module is received in a module bay and directly blind docked to the power supply. The system further includes at least one other module received in a module bay within the same chassis as the compute module and directly blind docked with the same power supply along with the compute module. The at least one other module is interchangeably selected from the group consisting of a second compute module and an expansion module, wherein the one or more components of the expansion module are controlled by the motherboard of the compute module within the same chassis.
摘要:
A system comprising a chassis that includes a plurality of modules and a fan assembly disposed in a distal end of the chassis for drawing air in parallel pathways through the plurality of modules. At least one of the modules is a compute module having a thermal sensor disposed to sense the temperature of air flowing across a processor mounted on a motherboard. The system further comprises a fan controller receiving output from the thermal sensor, wherein the fan controller operates the fan assembly to cool the plurality of modules and maintain the thermal sensor output within an operating temperature range. The fan controller controls the fan speed according to predetermined thermal profile settings associated with one of the compute modules received in the chassis. For example, the predetermined thermal profile settings may include a minimum fan speed, a maximum fan speed, and control loop feedback settings.
摘要:
A system for receiving and supporting a plurality of devices connected to a network. The system comprises a rack having a front side providing access to a plurality of chassis bays for receiving a chassis and aligning a back end of the chassis for blind docking with an electrical power source. The chassis includes a power supply, a fan, and a front side providing access to a plurality of module bays for receiving a module and aligning a back end of the module for blind docking with the power supply. A compute module is received in a module bay and directly blind docked to the power supply. The system further includes at least one other module received in a module bay within the same chassis as the compute module and directly blind docked with the same power supply along with the compute module. The at least one other module is interchangeably selected from the group consisting of a second compute module and an expansion module, wherein the one or more components of the expansion module are controlled by the motherboard of the compute module within the same chassis.