公开(公告)号：US6021833A

公开(公告)日：2000-02-08

申请号：US713253

申请日：1996-09-12

申请人： Katsumi Uchikawa ,  Keiji Arai ,  Kouji Takamachi ,  Tohru Matsui ,  Ryo Fujita ,  Tohru Goto ,  Shigemitsu Matsumoto ,  Shuntaro Takizawa ,  Shuji Higuchi ,  Takanori Kobayashi ,  Koichi Takemata

发明人： Katsumi Uchikawa ,  Keiji Arai ,  Kouji Takamachi ,  Tohru Matsui ,  Ryo Fujita ,  Tohru Goto ,  Shigemitsu Matsumoto ,  Shuntaro Takizawa ,  Shuji Higuchi ,  Takanori Kobayashi ,  Koichi Takemata

IPC分类号： B23Q41/00 ,  B32B15/08 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K3/00 ,  H05K3/0082 ,  H05K3/0085 ,  H05K3/0091 ,  H05K3/382 ,  H05K3/4069 ,  H05K3/4652 ,  Y10T156/1339 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

摘要： A manufacturing line including a plurality of processing sections disposed in a series for manufacturing multi-layered printed circuit boards by continuously conveying and processing boards through the plurality of processing sections, in which the plurality of processing sections have at least two specific processing sections for conducting a common type of processes, and the specific processing sections are disposed in a common area.

摘要翻译： 一种制造线，包括通过连续输送和处理多个处理部分的多个处理部分而制造多层印刷电路板的多个处理部分，其中多个处理部分具有至少两个特定处理部分，用于导电 通常的处理类型，特定的处理部位配置在公共区域。