公开(公告)号：US3981074A

公开(公告)日：1976-09-21

申请号：US499951

申请日：1974-08-23

申请人： Katsumi Yamamoto ,  Masahiro Fujimori ,  Masahiro Fujinawa ,  Sanenobu Sonoda

发明人： Katsumi Yamamoto ,  Masahiro Fujimori ,  Masahiro Fujinawa ,  Sanenobu Sonoda

IPC分类号： H01L21/50 ,  H01L23/057 ,  B01J17/00

CPC分类号： H01L21/50 ,  H01L23/057 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01019 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  Y10T29/49121

摘要： A method for producing a completed base cap for a plastic package sealing a semi-conductor therein includes the steps of forming the initial body of a plastic base cap including a centrally located hollow recess on one side thereof, placing lead frames on said base cap body in such a manner that the terminal end portions of said individual leads rest on the peripheral land of said base cap body surrounding said central recess, and forming outer side sections to the base cap including a step shoulder on the top side thereof by molding the same integrally with said lead frame and said initial body such that an intermediate portion of each of said leads adjacent their inner terminal end portions is embedded within said outer side sections of the base cap. A liquid honing step is provided on the base cap shoulder after the formation thereof, and to the inner terminal end portions of the leads.

摘要翻译： 一种用于制造密封半导体的塑料封装的完整基座的方法包括以下步骤：在其一侧上形成包括位于中心的中空凹部的塑料基座的初始主体，将引线框架放置在所述基座主体 以使得所述单个引线的末端部分位于围绕所述中心凹部的所述基座主体的外围平台上，并且通过模制所述底盖而在其顶侧上形成包括台阶台肩的所述底盖的外侧部分 与所述引线框架和所述初始主体一体地使得每个所述引线的与其内部末端部分相邻的中间部分嵌入所述底盖的所述外侧部分内。 在其形成之后，在基座肩部上设置液体珩磨步骤，并且引线的内部末端部分。