Enclosure for a semiconductor device

    公开(公告)号:US06569380B2

    公开(公告)日:2003-05-27

    申请号:US09940049

    申请日:2001-08-27

    IPC分类号: B22F706

    摘要: A method to form a combined enclosure and heat sink structure for a semiconductor device is achieved. A first feedstock comprising a first mixture of powdered metal materials, lubricants, and binders is prepared. A second feedstock comprising a second mixture of powdered metal materials, lubricants, and binders is prepared such that the difference between the sintering shrinkage of each of the first and second feedstocks is less than 1%. The first and second feedstocks are pressed to form a first green part having an enclosure shape and a second green part having a heat sink shape. The lubricants and the binders from said first and second green parts are removed to form a first powdered skeleton and a second powdered skeleton. The first and second powdered skeletons are sintered to complete the combined enclosure and heat sink structure. The first and second powdered skeletons are in intimate contact during the sintering. Optionally, at least one hollow cooling channel is formed in the combine structure by burning away a fugitive plastic structure during the sintering process.

    Method to form multi-material components
    3.
    发明授权
    Method to form multi-material components 有权
    形成多材料成分的方法

    公开(公告)号:US06461563B1

    公开(公告)日:2002-10-08

    申请号:US09733527

    申请日:2000-12-11

    IPC分类号: B22F702

    摘要: The invention shows how powder injection molding may be used to form a continuous body having multiple parts, each of which has different physical properties such as magnetic characteristics or hardness. This is accomplished through careful control of the relative shrinkage rates of these various parts. Additionally, care is taken to ensure that only certain selected physical properties are allowed to differ between the parts while others may be altered through relatively small changes in the composition of the feedstocks used. An additional application of the present invention is a process for forming, in a single integrated operation, an object that is contained within an enclosure while not being attached to said enclosure. This is accomplished by causing the shrinkage rate of the object to be substantially greater than that of the enclosure. As a result, after sintering, the object is found to have detached itself from the enclosure and is free to move around therein. Several examples of structures formed using these processes are presented.

    摘要翻译: 本发明示出了如何使用粉末注射成型来形成具有多个部件的连续主体,每个部件具有不同的物理特性,例如磁特性或硬度。 这是通过仔细控制这些各个部件的相对收缩率来实现的。 另外,注意确保仅允许某些选定的物理性质在各部分之间不同,而其它物理性质可以通过使用的原料的组成的相对小的变化而改变。 本发明的另一个应用是在单个集成操作中形成被包含在外壳内而不附着到所述外壳的物体的过程。 这是通过使物体的收缩率显着大于外壳的收缩率来实现的。 结果,在烧结之后,发现物体已经从外壳脱离并且在其中自由移动。 介绍了使用这些过程形成的结构的几个例子。

    Method to form multi-material components
    4.
    发明授权
    Method to form multi-material components 有权
    形成多材料成分的方法

    公开(公告)号:US07347968B2

    公开(公告)日:2008-03-25

    申请号:US10676216

    申请日:2003-10-01

    IPC分类号: B22F7/06

    摘要: The invention shows how powder injection molding may be used to form a continuous body having multiple parts, each of which has different functional properties such as corrosion resistance or hardness, there being no connective materials such as solder or glue between the parts. This is accomplished through careful control of the relative shrinkage rates of these various parts. Although there is no limit to how many parts with different functional properties can make up an object, special attention is paid to certain pairs of functional properties that are difficult and/or expensive to combine in a single object when other manufacturing means are used.

    摘要翻译: 本发明示出了如何使用粉末注射成型来形成具有多个部分的连续体,每个部分具有不同的功能性质如耐腐蚀性或硬度,在部件之间不存在诸如焊料或粘合剂的连接材料。 这是通过仔细控制这些各个部件的相对收缩率来实现的。 尽管对于具有不同功能性质的多个部件可以组成一个对象没有限制,但是特别注意在使用其它制造装置时在单个对象中组合的某些功能特性对很困难和/或昂贵。

    Net shaped articles having complex internal undercut features
    5.
    发明授权
    Net shaped articles having complex internal undercut features 有权
    网状物品具有复杂的内部底切特征

    公开(公告)号:US06776955B1

    公开(公告)日:2004-08-17

    申请号:US09655113

    申请日:2000-09-05

    IPC分类号: B22F300

    摘要: This invention describes a novel production method of manufacturing metal/ceramic articles with complex internal undercut features using powder injection molding processes The shape of the undercut/hollow feature is initially molded using a disposable material such as a degradable polymer. The PIM feedstock is then molded onto this to form the required shape geometry, in effect encapsulating the polymeric feature in the PIM feedstock. The resulting two-material part is then sent for processing which removes the polymer through solvent or thermal process. After the polymer and the binder have been removed, the part now comprises a powder skeleton that contains the internal undercut feature within itself. After sintering the result is a metal/ceramic part having an internal undercut feature. The technical advantage of the present invention is that it does not require complex toolings or costly secondary operations while retaining the flexibility to design any internal undercut features of complex geometry. An additional embodiment of the invention is also disclosed in which a solid structure is encapsulated inside a hollow shell said structure being free to move around inside the shell.

    摘要翻译: 本发明描述了使用粉末注射成型工艺制造具有复杂内部底切特征的金属/陶瓷制品的新型制造方法。底切/中空特征的形状首先使用一次性材料如可降解聚合物模制。 然后将PIM原料模制到其上以形成所需的形状几何形状,实际上将聚合物特征包封在PIM原料中。 然后将所得的双材料部分送入加工,通过溶剂或热处理除去聚合物。 在聚合物和粘合剂已被去除之后,该部件现在包括其本身内部具有内部底切特征的粉末骨架。 烧结结果是具有内部底切特征的金属/陶瓷部件。 本发明的技术优点在于它不需要复杂的工具或昂贵的二次操作,同时保持灵活性来设计复杂几何形状的任何内部底切特征。 还公开了本发明的另外的实施例,其中将固体结构封装在中空壳内,所述结构可自由地在壳体内移动。