专利检索 ap:("Kazuaki Kozasa" OR "Motoharu Yamada" OR "Uasuhiro Tomita" OR "Hiromi Wakabayashi") AND inv:"Uasuhiro Tomita" 第 1 页

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发明申请
Polishing method for semiconductor wafer 有权

公开(公告)号：US20070059935A1

公开(公告)日：2007-03-15

申请号：US11512837

申请日：2006-08-30

申请人： Kazuaki Kozasa , Motoharu Yamada , Uasuhiro Tomita , Hiromi Wakabayashi

发明人： Kazuaki Kozasa , Motoharu Yamada , Uasuhiro Tomita , Hiromi Wakabayashi

IPC分类号： B24B51/00 , B24B49/00 , B24B7/30

CPC分类号： H01L21/02024 , B24B37/044 , B24B55/12 , B24B57/04 , C09G1/02 , Y02P70/179

摘要： A polishing method includes a slurry adjusting step for adjusting a polishing slurry containing silica particles so that the number of silica particles having a composition ratio of Si/O of 50-60 wt %/40-50 wt %, a modulus of elasticity of 1.4×1010 Pa or higher and a particle size of 1 μm or larger is 3000 pcs/ml or less. A semiconductor wafer is polished using the polishing slurry adjusted in the slurry adjusting step.