摘要:
According to one embodiment, a light source shape calculation method includes calculating a first light source shape as an exposure illumination light source shape, so that the first light source shape has a light source shape region symmetrical to an X-axis direction and a Y-axis direction, and a process margin when forming an on-substrate pattern corresponding to at least two pattern layouts defined by design rules is optimized. A point light source is calculated such that the process margin of formation of the on-substrate pattern corresponding to a pattern layout to be formed on a semiconductor device is optimized, and is applied to the first light source shape.
摘要:
A graph is created in which mask patterns adjacent to one another at a distance in which desired printing resolution cannot be obtained in a lithography process among mask patterns generated based on a pattern layout design drawing are set as nodes connected to one another by edges. An odd number loop formed by an odd number of nodes is selected from closed loops. When the selected odd number loop is not isolated, based on whether a closed loop group in which a plurality of closed loops including the odd number loop are connected includes an even number loop formed by an even number of nodes, rearrangement target nodes are selected from the odd number loop included in the closed loop group according to different selection references. The layout of patterns described in the pattern layout design drawing is rearranged corresponding to the selected rearrangement target nodes.
摘要:
A side of a correction target pattern is divided into a plurality of segments. A space between each of the divided segments or an imaginary segment extended from both the ends of the segment to outer sides and a side of an adjacent pattern adjacent to the segment is measured. An overlapping distance between each of the divided segments or the imaginary segment extended from both the ends of the segment to the outer sides and the side of the adjacent pattern is measured. A shift amount of the segment is corrected based on the overlapping distance.
摘要:
A process proximity effect (PPE) correction method includes providing corrected cells arranged in a place/route arrangement, the corrected cells being obtained by correcting design data of a semiconductor device based on correction value for correcting PPE correction, determining whether a cell arrangement of the corrected cells is registered or not based on environmental profiles, conducting lithography verification if the corrected cells includes the cell arrangement not registered in the environmental profiles, the verification being performed on the corrected cells, wherein the corrected cell to be conducted the verification corresponds to the cell arrangement not registered, determining whether error is found or not in the verification, correcting the corrected cell to which the verification is conducted if the error is found and registering the cell arrangement in the environmental profiles, and registering the cell arrangement of the corrected cell if the error is not found.
摘要:
According to the embodiment, a pattern after lithography is derived by using a mask pattern. The mask pattern is corrected by moving a first moving target pattern so that a first evaluation value calculated with respect to this pattern after lithography satisfies a first condition. Next, a pattern after lithography is derived by using the mask pattern after correction. The mask pattern after correction is further corrected by moving a second moving target pattern so that a second evaluation value calculated with respect to this pattern after lithography satisfies a second condition.
摘要:
A database creation method relating to semiconductor ICs, the database registering function block cells constituting a design data of semiconductor IC and evaluation values corresponding to the function block cells such that the function block cells are associated with the evaluation values, for each of the semiconductor ICs, the creation method includes judging whether or not that function block cells constituting a design data of desired semiconductor IC include an unregistered function block cell which is not registered in the database, calculating an unregistered evaluation value corresponding to the unregistered function block cell when the function block cells constituting the design data of the desired semiconductor IC are judged to include the unregistered function block cell, and updating the database by registering the unregistered function block cell and the unregistered evaluation value such that the unregistered function block cell is associated with the unregistered evaluation value.
摘要:
In a method for forming a pattern according to an embodiment, a first guide pattern and a second guide pattern for induced self organization of a DSA material are formed on substrate. On a first DSA condition, a first phase-separated pattern having regularity with respect to the first guide pattern is formed, and a first pattern is formed by processing the lower layer side. Subsequently, on a second DSA condition, a second phase-separated pattern having regularity with respect to the second guide pattern is formed, and a second pattern is formed by processing the lower layer side.
摘要:
A process-model generation method according to an embodiment of the present invention comprises: forming a test pattern on a film to be processed by exposing a test mask having a mask pattern formed thereon; generating a plurality of process models having a different model parameter; performing a simulation of the mask pattern by using each of the process models to predict a plurality of model patterns; calculating a difference in dimension between the test pattern and each of the model patterns; extracting a model pattern in which the difference in dimension from the test pattern is within a scope of specification from the model patterns; and specifying the process model, which predicts the extracted model pattern, as the mask pattern.