公开(公告)号：US20080198176A1

公开(公告)日：2008-08-21

申请号：US12034182

申请日：2008-02-20

申请人： Kazunari ISHII ,  Masaru Suzuki

发明人： Kazunari ISHII ,  Masaru Suzuki

IPC分类号： G09G5/00

CPC分类号： G01B21/02 ,  G01R31/2891

摘要： A method is for calculating a height of a chuck top. A height of the top surface of the chuck top which corresponds to an arbitrary position specified on the XY coordinate plane by a computer is calculated in each of the four quadrants based on a coordinate transformation formulas. The method includes setting, by using the computer, a conical model in which two adjacent points other than the center point of the chuck top which correspond to the specified coordinates in a predetermined quadrant of the XY coordinate plane are obtained on a circumference having the center point of the chuck top as the origin and specifying an arbitrary point in the predetermined quadrant by using the computer and calculating a height of the arbitrary point of the chuck top based on the conical model, the coordinate transformation formulas and the specified coordinates.

摘要翻译： 一种用于计算卡盘顶部的高度的方法。 基于坐标变换公式，在四个象限中的每一个中计算与计算机在XY坐标平面上指定的任意位置对应的卡盘顶部顶面的高度。 该方法包括通过使用计算机设置圆锥模型，其中在具有中心的圆周上获得与夹头顶部的中心点以外的两个相邻点相对应于XY坐标平面的预定象限中的指定坐标的圆锥模型 并且通过使用计算机指定预定象限中的任意点，并且基于圆锥模型，坐标变换公式和指定坐标来计算卡盘顶部的任意点的高度。

公开(公告)号：US20110234247A1

公开(公告)日：2011-09-29

申请号：US13071881

申请日：2011-03-25

申请人： Kazunari ISHII ,  Toshihiko Iijima ,  Shuji Akiyama

发明人： Kazunari ISHII ,  Toshihiko Iijima ,  Shuji Akiyama

IPC分类号： G01R31/00

CPC分类号： G01R31/2891 ,  G01R31/2887

摘要： A method for correcting inclination of a wafer chuck includes obtaining in advance a correction amount for each of the semiconductor chips which corrects the inclination of the wafer chuck in the case of applying a contact load to at least each one of the semiconductor chips and storing each of the correction amounts in a data storage unit; calculating a total correction amount for correcting the inclination of the wafer chuck by calculating the correction amount of each of the semiconductor chips bringing into contact with the probes when the semiconductor wafer comes into electrical contact with the probes and adding the calculated correction amounts; and correcting the inclination of the wafer chuck based on the total correction amount.

摘要翻译： 一种用于校正晶片卡盘倾斜度的方法，包括：在对至少每个半导体芯片施加接触负载的情况下，预先获得校正每个半导体芯片的校正量，该半导体芯片校正晶片卡盘的倾斜度， 在数据存储单元中的校正量; 计算用于通过计算当半导体晶片与探针电接触而与探针接触的每个半导体芯片的校正量并添加所计算的校正量时，计算校正晶片卡盘的倾斜度的总校正量; 并且基于总校正量来校正晶片卡盘的倾斜度。

公开(公告)号：US20100244876A1

公开(公告)日：2010-09-30

申请号：US12749587

申请日：2010-03-30

申请人： Kazunari ISHII

发明人： Kazunari ISHII

IPC分类号： G01R31/02

CPC分类号： G01R31/2891 ,  G01R31/2887

摘要： Disclosed is a method to set contact parameters, which can simulate the entire contact process of devices of a semiconductor wafer with probes while visually checking the contact parameters. The method includes preparing a coordinate graph including a time axis and a height axis, and setting contact parameters of the semiconductor wafer by specifying a plurality of points on the coordinate graph by a plurality of upward/downward movement positions of the semiconductor wafer during electrical contact of the electrode pads of the semiconductor wafer with the plurality of probes or separation of the electrode pads of the semiconductor wafer from the plurality of probes, and time required for the semiconductor wafer to move until reaching the upward/downward movement positions, respectively, and displaying a broken-line graph through connecting the specified points with straight-lines.

摘要翻译： 公开了一种设置接触参数的方法，其可以在目视检查接触参数的同时模拟具有探针的半导体晶片的器件的整个接触过程。 该方法包括准备包括时间轴和高度轴的坐标图，并且通过在电接触期间通过半导体晶片的多个向上/向下移动位置指定坐标图上的多个点来设置半导体晶片的接触参数 的半导体晶片的电极焊盘与多个探针或半导体晶片的电极焊盘与多个探针的分离，以及半导体晶片分别移动直到达到上/下移动位置所需的时间，以及 通过直线连接指定点显示虚线图。

公开(公告)号：US20080315904A1

公开(公告)日：2008-12-25

申请号：US12139920

申请日：2008-06-16

申请人： Kazunari ISHII

发明人： Kazunari ISHII

IPC分类号： G01R31/28

CPC分类号： G01R31/2891

摘要： A probe card registration method is for registering a probe card for use in inspecting electrical characteristics of a target object in a probe apparatus for performing the inspecting. The probe card registration method includes detecting a height of a load sensor provided at a mounting table for mounting thereon the target object by using a first imaging unit disposed above the mounting table; contacting the load sensor with a probe by moving the load sensor by the mounting table; and stopping the movement of the load sensor when the load sensor starts to make contact with the probe. The method further includes calculating a height of a needle of the probe based on a height of the load sensor and a stop height thereof.

摘要翻译： 探针卡登记方法用于登记用于检查用于进行检查的探针装置中的目标物体的电特性的探针卡。 探针卡配准方法包括通过使用设置在安装台上方的第一成像单元来检测设置在安装台上的负载传感器的高度，以安装目标物体; 通过由安装台移动负载传感器来将负载传感器与探头接触; 并且当负载传感器开始与探头接触时，停止负载传感器的移动。 该方法还包括基于负载传感器的高度及其停止高度来计算探针的针的高度。

公开(公告)号：US20080238455A1

公开(公告)日：2008-10-02

申请号：US12049799

申请日：2008-03-17

申请人： Kazunari ISHII

发明人： Kazunari ISHII

IPC分类号： G01R31/02

CPC分类号： G01R31/2887

摘要： A probing method measures electrical characteristics of an object to be inspected by bringing a probe needle to make a contact with an electrode pad of the object, the probe needle formed to be vertically pointing the object. The method includes the steps of: mounting the object on a mounting table; aligning the object and the probe needle; thereafter, contacting the probe needle with the electrode pad by moving the mounting table upwards, and then moving the mounting table vertically upwards while moving same horizontally to rend an oxide film formed on a surface of the electrode pad, so that a tip of the probe needle is stuck into the electrode pad and the probe needle and the electrode pad to conduct with each other.

摘要翻译： 探测方法通过使探针与物体的电极焊盘接触来测量待检查物体的电特性，探针形成为垂直指向物体。 该方法包括以下步骤：将物体安装在安装台上; 对准物体和探针; 此后，通过向上移动安装台使探针与电极焊盘接触，然后垂直向上移动安装台，同时水平移动，以形成在电极焊盘的表面上形成的氧化膜，使得探针的尖端 针头插入电极垫，探针和电极垫相互导电。