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公开(公告)号：US20060210144A1
公开(公告)日：2006-09-21
申请号：US11325552
申请日：2006-01-05
IPC分类号： G06K9/00
CPC分类号： G06T7/0006 , G06T2207/10061 , G06T2207/30148
摘要： A reviewing apparatus, for enabling to conduct detailed review (ADR) and/or defect classification (ADC), effectively, through making alignment of defects detected in an upstream inspecting apparatus into the reviewing apparatus, with certainty and at high accuracy, and further within a short time-period, comprises a defect selecting portion 240 for selecting or picking up a plural number of alignment candidates from a large numbers defects, upon defect inspection information, which is detected within the inspecting apparatus, an electron microscope 21 (30) for obtaining a SEM image of the plural number of alignment candidates, through picking up an image on each of the plural number of alignment candidates, which are selected or picked up, narrowly, and a determining portion 243 for calculating out characteristic quantities relating to the plural number of alignment candidates, upon basis of the obtained SEM images thereof, and for determining on suitableness/unsuitableness for use in alignment relating to the plural number of alignment candidates, upon basis of the characteristic quantities calculated therewith.
摘要翻译： 一种审查装置，能够有效地进行详细审查（ADR）和/或缺陷分类（ADC），通过将上游检测装置中检测到的缺陷与确定性和准确性进行对准，并进一步在 短时间段包括用于从大量缺陷中选择或拾取多个对准候选的缺陷选择部分240，在检查装置内检测到的缺陷检查信息时，具有电子显微镜21（30），用于 通过拾取选择或拾取的多个对准候选者中的每一个上的图像，以及用于计算与多个对准候选者相关的特征量的确定部分243，获得多个对准候选的SEM图像; 基于所获得的SEM图像和用于确定适合性/不适合性的对准候选数 基于由其计算的特征量，与多个对准候选对齐。
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公开(公告)号：US09390490B2
公开(公告)日：2016-07-12
申请号：US13520210
申请日：2010-12-22
申请人： Yuji Takagi , Minoru Harada , Ryo Nakagaki , Naoki Hosoya , Toshifumi Honda , Takehiro Hirai
发明人： Yuji Takagi , Minoru Harada , Ryo Nakagaki , Naoki Hosoya , Toshifumi Honda , Takehiro Hirai
CPC分类号： G06T7/001 , G06T2207/10061 , G06T2207/20081 , G06T2207/30148 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large.
摘要翻译： 在使用复查SEM执行电路图案的编程点检查时，即使在要检查的电路图案的变化大的情况下，也可以抑制误报的产生而进行稳定的检查。 通过使用评价SEM将预定电路图案顺序成像获得的SEM图像存储在存储单元中。 从存储的SEM图像中选择满足设定条件的图像，并平均以创建平均图像（GP图像）。 通过使用该GP图像通过GP比较进行模式检查，即使当电路图案的变化大时也可以在抑制伪报告的产生的同时执行检查。
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公开(公告)号：US06553323B1
公开(公告)日：2003-04-22
申请号：US09661182
申请日：2000-09-13
申请人： Kenji Obara , Yuji Takagi , Toshifumi Honda , Ryo Nakagaki , Toshiei Kurosaki , Yasuhiko Ozawa
发明人： Kenji Obara , Yuji Takagi , Toshifumi Honda , Ryo Nakagaki , Toshiei Kurosaki , Yasuhiko Ozawa
IPC分类号： G01B528
CPC分类号： H01L22/20 , G01N21/88 , G01N2021/8861
摘要： The present invention improves inspection efficiency in detailed inspections of defects performed based on inspection information from a defect inspection. Particles and defects are detected by a defect inspection device 1. If the cause of the particles and defects are to be determined by performing a detailed inspection with a details inspection device 3 using an SEM or the like, attributes are determined on the particles and defects detected by the defects inspection device 1 before the detailed inspection is performed. The attributes are determined with an attribute inspection device using an optical microscope or the like. Based on these attributes, the defects and particles are separated into those that require detailed inspection and those that do not require detailed inspection or that cannot be inspected in detail. A details inspection device 3 is used to inspect the particles and defects requiring detailed inspection.
摘要翻译： 本发明基于来自缺陷检查的检查信息进行的缺陷的详细检查，提高了检查效率。 通过缺陷检查装置1检测颗粒和缺陷。如果通过使用SEM等的细节检查装置3进行详细检查来确定颗粒和缺陷的原因，则根据颗粒和缺陷确定属性 在执行详细检查之前由缺陷检查装置1检测到。 属性由使用光学显微镜等的属性检查装置确定。 基于这些属性，缺陷和颗粒被分成需要详细检查的那些和不需要详细检查或者不能被详细检查的那些。 细节检查装置3用于检查需要详细检查的颗粒和缺陷。
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公开(公告)号：US07602962B2
公开(公告)日：2009-10-13
申请号：US10762091
申请日：2004-01-20
IPC分类号： G06K9/00
CPC分类号： G06T7/0004 , G06K9/6253 , G06T2207/30148
摘要： The present invention provides a method of classifying defects wherein defects are detected in a first inspection machine. The detected defects are then reviewed by a second inspection machine. A sampling rate for review by the second inspection machine is determined by a defect classifier in the first inspection machine.
摘要翻译： 本发明提供了在第一检查机中检测到缺陷的缺陷分类方法。 然后检测到的缺陷由第二台检查机检查。 由第二检查机检查的采样率由第一检查机中的缺陷分类器确定。
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公开(公告)号：US20060038986A1
公开(公告)日：2006-02-23
申请号：US11248697
申请日：2005-10-11
申请人： Toshifumi Honda , Yuji Takagi , Hirohito Okuda
发明人： Toshifumi Honda , Yuji Takagi , Hirohito Okuda
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/956
摘要： A method to solve the problem of a technique generally used to detect a defect of a semiconductor by calculating the differential image based on pattern matching, which requires that a reference image must be picked up to pick up an image of the inspection position in an area with the semiconductor pattern having no periodicity, resulting in a low throughput. The image of the inspection position is divided into local areas, each local area is matched with the local area of the image already stored and the difference between the local areas thus matched is determined to extract a defect area.
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公开(公告)号：US07583832B2
公开(公告)日：2009-09-01
申请号：US10378016
申请日：2003-02-28
申请人： Hirohito Okuda , Toshifumi Honda , Yuji Takagi , Atsushi Miyamoto
发明人： Hirohito Okuda , Toshifumi Honda , Yuji Takagi , Atsushi Miyamoto
CPC分类号： G06T7/001
摘要： A highly reliable defect automatic classifying method and apparatus capable of flexibly coping with a request for classifying a defect given by each user without having to collect lots of teach data items. A classifying class arrangement is defined by a user by combining classes supplied by the system itself or classes defined by the user and, further, a priori knowledge on the defect class is given by the user as a restriction so as to carry out restricted learning.
摘要翻译： 一种高度可靠的缺陷自动分类方法和装置，其能够灵活地应对用于分类每个用户给出的缺陷的请求，而不需要收集大量的教学数据项。 分类类安排由用户通过组合由系统本身提供的类或由用户定义的类来定义，此外，由用户给出缺陷类的先验知识作为限制，以便进行有限的学习。
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公开(公告)号：US07205555B2
公开(公告)日：2007-04-17
申请号：US11042021
申请日：2005-01-24
申请人： Hirohito Okuda , Yuji Takagi , Toshifumi Honda
发明人： Hirohito Okuda , Yuji Takagi , Toshifumi Honda
IPC分类号： H01J37/153 , G01N23/00 , G21K7/00
CPC分类号： G06T7/0004 , G01N23/225
摘要： An apparatus and a method for automatically inspecting a defect by an electron beam using an X-ray detector. The composition of a defective portion is analyzed with higher rapidity and the cause of the defect is easily and accurately determined based on an X-ray spectrum. The X-ray spectrum and the image of foreign particles formed on a process QC wafer are registered as reference data, and the defects generated on a process wafer are classified by collation with the reference data. The use of both the X-ray spectrum and the detected image optimizes the operating conditions for X-ray detection. A defect of which the X ray is to be detected is selected based on the result of classification of defect images automatically collected, and the defect is classified according to the features including both the composition and the external appearance.
摘要翻译： 使用X射线检测器通过电子束自动检查缺陷的装置和方法。 以更高的速度分析缺陷部分的组成，并且基于X射线光谱容易且准确地确定缺陷的原因。 将X射线光谱和在过程QC晶片上形成的异物的图像作为参考数据进行登记，并且通过与参考数据进行核对对在处理晶片上产生的缺陷进行分类。 使用X射线光谱和检测到的图像优化用于X射线检测的操作条件。 基于自动收集的缺陷图像的分类结果来选择要检测X射线的缺陷，并且根据包括组成和外观的特征对缺陷进行分类。
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公开(公告)号：US07170593B2
公开(公告)日：2007-01-30
申请号：US11248697
申请日：2005-10-11
申请人： Toshifumi Honda , Yuji Takagi , Hirohito Okuda
发明人： Toshifumi Honda , Yuji Takagi , Hirohito Okuda
CPC分类号： G01N21/9501 , G01N21/956
摘要： A method to solve the problem of a technique generally used to detect a defect of a semiconductor by calculating the differential image based on pattern matching, which requires that a reference image must be picked up to pick up an image of the inspection position in an area with the semiconductor pattern having no periodicity, resulting in a low throughput. The image of the inspection position is divided into local areas, each local area is matched with the local area of the image already stored and the difference between the local areas thus matched is determined to extract a defect area.
摘要翻译： 一种解决通常用于通过基于图案匹配计算差分图像来检测半导体缺陷的技术的问题的方法，其要求必须拾取参考图像以在区域中拾取检查位置的图像 半导体图案没有周期性，导致低的生产量。 检查位置的图像被划分为局部区域，每个局部区域与已经存储的图像的局部区域匹配，并且确定如此匹配的局部区域之间的差异来提取缺陷区域。
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公开(公告)号：US06965429B2
公开(公告)日：2005-11-15
申请号：US10224087
申请日：2002-08-19
申请人： Toshifumi Honda , Yuji Takagi , Hirohito Okuda
发明人： Toshifumi Honda , Yuji Takagi , Hirohito Okuda
CPC分类号： G01N21/9501 , G01N21/956
摘要： A method to solve the problem of a technique generally used to detect a defect of a semiconductor by calculating the differential image based on pattern matching, which requires that a reference image must be picked up to pick up an image of the inspection position in an area with the semiconductor pattern having no periodicity, resulting in a low throughput. The image of the inspection position is divided into local areas, each local area is matched with the local area of the image already stored and the difference between the local areas thus matched is determined to extract area.
摘要翻译： 一种解决通常用于通过基于图案匹配计算差分图像来检测半导体缺陷的技术的问题的方法，其要求必须拾取参考图像以在区域中拾取检查位置的图像 半导体图案没有周期性，导致低的生产量。 检查位置的图像被划分为局部区域，每个局部区域与已经存储的图像的局部区域匹配，并且确定如此匹配的局部区域之间的差异来提取区域。
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公开(公告)号：US06855930B2
公开(公告)日：2005-02-15
申请号：US10256585
申请日：2002-09-27
申请人： Hirohito Okuda , Yuji Takagi , Toshifumi Honda
发明人： Hirohito Okuda , Yuji Takagi , Toshifumi Honda
IPC分类号： G01N23/225 , G06T1/00 , H01L21/66 , G01N23/00
CPC分类号： G06T7/0004 , G01N23/225
摘要： An apparatus and a method for automatically inspecting a defect by an electron beam using an X-ray detector. The composition of a defective portion is analyzed with higher rapidity and the cause of the defect is easily and accurately determined based on an X-ray spectrum. The X-ray spectrum and the image of foreign particles formed on a process QC wafer are registered as reference data, and the defects generated on a process wafer are classified by collation with the reference data. The use of both the X-ray spectrum and the detected image optimizes the operating conditions for X-ray detection. A defect of which the X ray is to be detected is selected based on the result of classification of defect images automatically collected, and the defect is classified according to the features including both the composition and the external appearance.
摘要翻译： 使用X射线检测器通过电子束自动检查缺陷的装置和方法。 以更高的速度分析缺陷部分的组成，并且基于X射线光谱容易且准确地确定缺陷的原因。 将X射线光谱和在过程QC晶片上形成的异物的图像作为参考数据进行登记，并且通过与参考数据进行核对对在处理晶片上产生的缺陷进行分类。 使用X射线光谱和检测到的图像优化用于X射线检测的操作条件。 基于自动收集的缺陷图像的分类结果来选择要检测X射线的缺陷，并且根据包括组成和外观的特征对缺陷进行分类。
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