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公开(公告)号:US20090291232A1
公开(公告)日:2009-11-26
申请号:US12294428
申请日:2007-03-28
CPC分类号: C23C16/402 , C23C16/45542 , C23C16/5096 , H01L21/02164 , H01L21/02222 , H01L21/02274 , H01L21/0228 , H01L21/3141 , H01L21/31612
摘要: Oxygen gas, for example, is introduced into a film forming chamber, and high-frequency power is supplied to a plurality of monopole antennas arranged above a silicon substrate (101) in the film forming chamber to generate a plasma of the introduced oxygen gas, thereby supplying atomic oxygen (123) onto the surface of an aminosilane molecular layer (102). This plasma generation is performed for about 1 sec. With this operation, the adsorption layer (102) adsorbed onto the surface of the silicon substrate (101) is oxidized, thereby forming a silicon oxide layer (112) corresponding to one atomic layer of silicon on the surface of the silicon substrate (101).
摘要翻译: 例如,将氧气引入成膜室,向成膜室内的硅基板(101)上方配置的多个单极天线供给高频电力,生成引入氧气的等离子体, 从而将原子氧(123)提供到氨基硅烷分子层(102)的表面上。 执行该等离子体生成约1秒。 通过该操作,吸附在硅衬底(101)的表面上的吸附层(102)被氧化,从而在硅衬底(101)的表面上形成对应于一个原子层硅的氧化硅层(112) 。
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公开(公告)号:US08440268B2
公开(公告)日:2013-05-14
申请号:US12294428
申请日:2007-03-28
IPC分类号: H05H1/24
CPC分类号: C23C16/402 , C23C16/45542 , C23C16/5096 , H01L21/02164 , H01L21/02222 , H01L21/02274 , H01L21/0228 , H01L21/3141 , H01L21/31612
摘要: Oxygen gas, for example, is introduced into a film forming chamber, and high-frequency power is supplied to a plurality of monopole antennas arranged above a silicon substrate (101) in the film forming chamber to generate a plasma of the introduced oxygen gas, thereby supplying atomic oxygen (123) onto the surface of an aminosilane molecular layer (102). This plasma generation is performed for about 1 sec. With this operation, the adsorption layer (102) adsorbed onto the surface of the silicon substrate (101) is oxidized, thereby forming a silicon oxide layer (112) corresponding to one atomic layer of silicon on the surface of the silicon substrate (101).
摘要翻译: 例如,将氧气引入成膜室,向成膜室内的硅基板(101)上方配置的多个单极天线供给高频电力,生成引入氧气的等离子体, 从而将原子氧(123)提供到氨基硅烷分子层(102)的表面上。 执行该等离子体生成约1秒。 通过该操作,吸附在硅衬底(101)的表面上的吸附层(102)被氧化,从而在硅衬底(101)的表面上形成对应于一个原子层硅的氧化硅层(112) 。
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