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公开(公告)号：US4855697A
公开(公告)日：1989-08-08
申请号：US212309
申请日：1988-06-27
申请人： Keith E. Jones , Warren K. Harwood
发明人： Keith E. Jones , Warren K. Harwood
CPC分类号： H01P5/085
摘要： A launcher having an outer conductor and a tapered central contact pin within a bore of the outer conductor connects coaxial transmission lines with microstrip transmission lines. The launcher, when used with a microstrip transmission line having a specific dielectric substrate thickness, provides matching of both the characteristic impedance and the electro-magnetic field configuration. The launcher also may be used effectively with microstrip transmission lines having different substrate thicknesses An adjustable stop transversely positions the upper surface of the microstrip transmission line relative to the launcher's outer conductor to counteract capacitive discontinuities caused by different substrate thicknesses. Although such adjustments flex the central contact pin transversely, thus changing the launcher's characteristic impedance, the launcher provides better overall matching between the two types of transmission lines. The contact tip of the pin has a cylindrical contact surface coaxial with the pin, thus forming a repeatable line contact with the upper conductor of the microstrip transmission line enabling consistent results. The bore of the outer conductor is at an angle with respect to the coaxial transmission line jack, allowing the tapered pin to extend coaxially with the jack so that the pin can be drilled and tapped on its center axis, simplifying its mass production.
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公开(公告)号：US4961050A
公开(公告)日：1990-10-02
申请号：US309698
申请日：1989-02-10
CPC分类号： G01R1/04
摘要： A test fixture for testing microstrip assemblies and similar electronic circuit components and assemblies under application of high-frequency signals introduced through launchers whose positions are adjustable in the test fixture to accommodate circuit assemblies of different sizes and different geometry. An easily operated rapid connector positioning mechanism moves connectors which complete electrical connection between outer conductors of the launchers and a ground plane conductor of a microstrip assembly. The connectors also lift the microstrip assembly and support it while electrical connection is completed, without the need for a carrier beneath the test assembly. A lid is moved in coordination with operation of the connector positioning mechanism to provide electrical contact to a third point on the upper face of a circuit assembly to be tested.
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公开(公告)号：US07009383B2
公开(公告)日：2006-03-07
申请号：US10925526
申请日：2004-08-25
IPC分类号： G01R31/02
CPC分类号： H01L21/68785 , A46D1/00 , G01R1/06705 , G01R1/18 , G01R31/2862 , G01R31/2868 , G01R31/2886 , G01R31/2887 , H01L21/68714
摘要： A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.
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公开(公告)号：US5532609A
公开(公告)日：1996-07-02
申请号：US417982
申请日：1995-04-06
CPC分类号： G01R31/2886 , A46D1/00 , G01R1/0416 , G01R1/06705 , G01R1/06794 , G01R1/07392 , G01R1/18 , G01R31/2887 , H01L21/68785
摘要： A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probe holders. The positioning mechanisms for the supporting surface and probe holders each have portions located at least partially outside of the enclosure for transferring movement mechanically to the surface or holders, respectively.
摘要翻译： 晶片探测台配备有基本上围绕用于保持测试装置的支撑表面的集成环境控制外壳，这种外壳限制在外壳的内部和外部之间的流体连通，并且优选地还提供EMI屏蔽和黑暗环境。 即使支撑表面或探针支架的定位运动，外壳的内部和外部之间的有限通信也保持基本恒定。 用于支撑表面和探针保持器的定位机构各自具有至少部分位于外壳外部的部分，用于将机械机械分别转移到表面或保持器。
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公开(公告)号：US5266889A
公开(公告)日：1993-11-30
申请号：US891232
申请日：1992-05-29
IPC分类号： H01L21/66 , H01L21/68 , H01L21/683 , G01R31/02 , G01R1/073
CPC分类号： H01L21/68
摘要： A wafer probe station is equipped with a compact, integrated controlled-environment enclosure providing EMI shielding, substantially hermetic sealing for a dry purge gas for low-temperature testing, and a dark environment. The sealing isolation of the wafer chuck and test probe provided by the enclosure is maintained despite the fact that the probe and chuck positioning mechanisms extend partially outside the enclosure, with positioning members extending movably between the interior and exterior of the enclosure. Sealing is maintained by movable sealing members at the locations where the positioning members penetrate the enclosure.
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公开(公告)号：US07330023B2
公开(公告)日：2008-02-12
申请号：US11112813
申请日：2005-04-21
CPC分类号： G01R31/2886 , A46D1/00 , G01R1/0416 , G01R1/06705 , G01R1/06794 , G01R1/07392 , G01R1/18 , G01R31/2887 , H01L21/68785
摘要： A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times. With similar operation and effect, where any signal line element of the connector mechanism is arranged exterior of its corresponding guard line element, such as adjacent the chuck assembly or on the probe-holding assembly, a guard enclosure is provided to surround and fully guard such signal line element in interposed relationship between that element and the outer shielding enclosure.
摘要翻译： 探测台包括一个完全防护的卡盘组件和连接器机构，用于在降低沉降时间的同时提高对低电平电流的灵敏度。 卡盘组件包括由第二卡盘元件围绕的晶片支撑的第一卡盘元件，所述第二卡盘元件具有下部元件，裙边元件和上部元件，每个元件具有与第一元件相对延伸的表面部分，用于保护其。 连接器机构被连接到第二卡盘元件，以便在低电平电流测量期间，每个部件上的电位能够相对于围绕每个元件的外部屏蔽外壳测量的跟随第一卡盘元件上的电位。 因此，来自第一卡盘元件的泄漏电流几乎为零，因此能够提高电流灵敏度，并且由第二卡盘元件提供的减小的电容减少了充电周期，因此降低了稳定时间。 具有类似的操作和效果，其中连接器机构的任何信号线元件布置在其对应的保护线元件的外部，例如邻近卡盘组件或探针保持组件，防护罩被设置成围绕并完全保护 信号线元件在该元件和外屏蔽外壳之间的插入关系中。
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公开(公告)号：US06636059B2
公开(公告)日：2003-10-21
申请号：US10268244
申请日：2002-10-09
IPC分类号： G01R1073
CPC分类号： H01L21/68785 , A46D1/00 , G01R1/06705 , G01R1/18 , G01R31/2862 , G01R31/2868 , G01R31/2886 , G01R31/2887 , H01L21/68714
摘要： A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.
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公开(公告)号：US06335628B2
公开(公告)日：2002-01-01
申请号：US09784231
申请日：2001-02-13
IPC分类号： G01R3102
CPC分类号： G01R31/2886 , A46D1/00 , G01R1/0416 , G01R1/06705 , G01R1/06794 , G01R1/07392 , G01R1/18 , G01R31/2887 , H01L21/68785
摘要： A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times. With similar operation and effect, where any signal line element of the connector mechanism is arranged exterior of its corresponding guard line element, such as adjacent the chuck assembly or on the probe-holding assembly, a guard enclosure is provided to surround and fully guard such signal line element in interposed relationship between that element and the outer shielding enclosure.
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公开(公告)号：US5237267A
公开(公告)日：1993-08-17
申请号：US890970
申请日：1992-05-29
IPC分类号： G01R31/26 , G01R1/067 , H01L21/66 , H01L21/683
CPC分类号： G01R1/06705
摘要： A wafer probe station has a wafer-supporting vacuum chuck, together with one or more substrate-supporting auxiliary vacuum chucks having independent vacuum controls for mounting contact substrates and calibration substrates simultaneously with the wafer. A detachable interconnection of the various chucks enables independent replacement of each chuck to accommodate various different chuck types, and also permits the elevations of the respective chuck surfaces to be adjusted relative to each other to compensate for differences in thicknesses between the wafer substrate and the calibration or contact substrates. The invention is especially useful in wafer probe stations equipped with enclosures for controlled-environment testing where a large variety of different wafer chucks must be readily interchangeable for testing under different conditions.
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公开(公告)号：US06492822B2
公开(公告)日：2002-12-10
申请号：US10003948
申请日：2001-10-30
IPC分类号： G01R1073
CPC分类号： G01R31/2886 , A46D1/00 , G01R1/0416 , G01R1/06705 , G01R1/06794 , G01R1/07392 , G01R1/18 , G01R31/2887 , H01L21/68785
摘要： A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times. With similar operation and effect, where any signal line element of the connector mechanism is arranged exterior of its corresponding guard line element, such as adjacent the chuck assembly or on the probe-holding assembly, a guard enclosure is provided to surround and fully guard such signal line element in interposed relationship between that element and the outer shielding enclosure.
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