-
公开(公告)号：US07166926B2
公开(公告)日：2007-01-23
申请号：US10959437
申请日：2004-10-07
IPC分类号： H01L23/28
CPC分类号： H01L23/49575 , H01L21/565 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The method of producing a semiconductor device in which chips are resin-molded, including steps of: preparing frames having front and back surfaces and die pads; preparing an insulation resin sheet having a first and a second surfaces; preparing a resin-sealing metal mold having cap pins; mounting the resin sheet inside the resin-sealing metal mold in such a manner that the second surface of the resin sheet contacts an inner bottom surface of the resin-sealing metal mold; mounting power chips on the surfaces of the die pads; positioning the frames on the first surface of the resin sheet in such a manner that the back surfaces of the die pads contact the first surface of the resin sheet; pressing the die pads toward the resin sheet using the cap pins and fixing the die pads; injecting a sealing resin in the resin-sealing metal mold and hardening the sealing resin; and removing the semiconductor device in which the power chips are molded with the sealing resin out from the resin-sealing metal mold. The resin sheet may include a metal foil which is disposed to the second surface.
摘要翻译： 制造芯片是树脂模制的半导体器件的方法，包括以下步骤：制备具有正面和背面的芯片和芯片焊盘; 制备具有第一和第二表面的绝缘树脂片; 制备具有盖销的树脂密封金属模具; 以树脂片的第二面接触树脂密封金属模的内底面的方式将树脂片安装在树脂密封金属模具内; 将功率芯片安装在芯片焊盘的表面上; 将框架定位在树脂片的第一表面上，使得芯片焊盘的背面与树脂片的第一表面接触; 使用所述盖销将所述管芯焊盘朝向所述树脂片挤压并固定所述管芯焊盘; 在树脂密封金属模具中注入密封树脂并使密封树脂硬化; 并且用密封树脂从树脂密封金属模具中取出其中模制功率芯片的半导体器件。 树脂片可以包括设置在第二表面上的金属箔。
-
公开(公告)号：US07781262B2
公开(公告)日：2010-08-24
申请号：US11588407
申请日：2006-10-27
IPC分类号： H01L21/00
CPC分类号： H01L23/49575 , H01L21/565 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The method of producing a semiconductor device in which chips are resin-molded, including steps of: preparing frames having front and back surfaces and die pads; preparing an insulation resin sheet having a first and a second surfaces; preparing a resin-sealing metal mold having cap pins; mounting the resin sheet inside the resin-sealing metal mold in such a manner that the second surface of the resin sheet contacts an inner bottom surface of the resin-sealing metal mold; mounting power chips on the surfaces of the die pads; positioning the frames on the first surface of the resin sheet in such a manner that the back surfaces of the die pads contact the first surface of the resin sheet; pressing the die pads toward the resin sheet using the cap pins and fixing the die pads; injecting a sealing resin in the resin-sealing metal mold and hardening the sealing resin; and removing the semiconductor device in which the power chips are molded with the sealing resin out from the resin-sealing metal mold. The resin sheet may include a metal foil which is disposed to the second surface.
摘要翻译： 制造芯片是树脂模制的半导体器件的方法，包括以下步骤：制备具有正面和背面的芯片和芯片焊盘; 制备具有第一和第二表面的绝缘树脂片; 制备具有盖销的树脂密封金属模具; 以树脂片的第二面接触树脂密封金属模的内底面的方式将树脂片安装在树脂密封金属模具内; 将功率芯片安装在芯片焊盘的表面上; 将框架定位在树脂片的第一表面上，使得芯片焊盘的背面与树脂片的第一表面接触; 使用所述盖销将所述管芯焊盘朝向所述树脂片挤压并固定所述管芯焊盘; 在树脂密封金属模具中注入密封树脂并使密封树脂硬化; 并且用密封树脂从树脂密封金属模具中取出其中模制功率芯片的半导体器件。 树脂片可以包括设置在第二表面上的金属箔。
-
公开(公告)号：US20050082690A1
公开(公告)日：2005-04-21
申请号：US10959437
申请日：2004-10-07
IPC分类号： H01L25/18 , H01L21/56 , H01L23/28 , H01L23/29 , H01L23/433 , H01L23/495 , H01L25/04
CPC分类号： H01L23/49575 , H01L21/565 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The method of producing a semiconductor device in which chips are resin-molded, including steps of: preparing frames having front and back surfaces and die pads; preparing an insulation resin sheet having a first and a second surfaces; preparing a resin-sealing metal mold having cap pins; mounting the resin sheet inside the resin-sealing metal mold in such a manner that the second surface of the resin sheet contacts an inner bottom surface of the resin-sealing metal mold; mounting power chips on the surfaces of the die pads; positioning the frames on the first surface of the resin sheet in such a manner that the back surfaces of the die pads contact the first surface of the resin sheet; pressing the die pads toward the resin sheet using the cap pins and fixing the die pads; injecting a sealing resin in the resin-sealing metal mold and hardening the sealing resin; and removing the semiconductor device in which the power chips are molded with the sealing resin out from the resin-sealing metal mold. The resin sheet may include a metal foil which is disposed to the second surface.
摘要翻译： 制造芯片是树脂模制的半导体器件的方法，包括以下步骤：制备具有正面和背面的芯片和芯片焊盘; 制备具有第一和第二表面的绝缘树脂片; 制备具有盖销的树脂密封金属模具; 以树脂片的第二面接触树脂密封金属模的内底面的方式将树脂片安装在树脂密封金属模具内; 将功率芯片安装在芯片焊盘的表面上; 将框架定位在树脂片的第一表面上，使得芯片焊盘的背面与树脂片的第一表面接触; 使用所述盖销将所述管芯焊盘朝向所述树脂片挤压并固定所述管芯焊盘; 在树脂密封金属模具中注入密封树脂并使密封树脂硬化; 并且用密封树脂从树脂密封金属模具中取出其中模制功率芯片的半导体器件。 树脂片可以包括设置在第二表面上的金属箔。
-
公开(公告)号：US20050067719A1
公开(公告)日：2005-03-31
申请号：US10946470
申请日：2004-09-22
申请人： Kenichi Hayashi , Hisashi Kawafuji , Tatsuyuki Takeshita , Nobuhito Funakoshi , Hiroyuki Ozaki , Kazuhiro Tada
发明人： Kenichi Hayashi , Hisashi Kawafuji , Tatsuyuki Takeshita , Nobuhito Funakoshi , Hiroyuki Ozaki , Kazuhiro Tada
IPC分类号： H01L23/29 , H01L21/56 , H01L23/28 , H01L23/36 , H01L23/433 , H01L23/495 , H01L23/50
CPC分类号： H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49113 , H01L2924/00014 , H01L2924/01079 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device in which chips are resin-molded, including: frames having front and back surfaces and die pads; power chips mounted on the surfaces of the die pads; an insulation resin sheet having a first and a second surfaces which are opposed against each other, the resin sheet being disposed such that the back surfaces of the die pads contact the first surface of the resin sheet; and a mold resin applied on the first surface of the resin sheet so as to seal up the power chips. The thermal conductivity of the resin sheet is larger than that of the mold resin.
摘要翻译： 一种半导体器件，其中芯片是树脂模制的，包括：具有前表面和后表面的框架和芯片焊盘; 功率芯片安装在芯片的表面上; 具有彼此相对的第一和第二表面的绝缘树脂片，所述树脂片被设置成使得所述芯片焊盘的背面接触所述树脂片的所述第一表面; 以及在树脂片的第一表面上施加以密封功率芯片的模制树脂。 树脂片的导热率大于模制树脂的热导率。
-
公开(公告)号：US07671453B2
公开(公告)日：2010-03-02
申请号：US10946470
申请日：2004-09-22
申请人： Kenichi Hayashi , Hisashi Kawafuji , Tatsuyuki Takeshita , Nobuhito Funakoshi , Hiroyuki Ozaki , Kazuhiro Tada
发明人： Kenichi Hayashi , Hisashi Kawafuji , Tatsuyuki Takeshita , Nobuhito Funakoshi , Hiroyuki Ozaki , Kazuhiro Tada
IPC分类号： H01L23/495 , H01L23/28 , H01L23/29
CPC分类号： H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49113 , H01L2924/00014 , H01L2924/01079 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device in which chips are resin-molded, including: frames having front and back surfaces and die pads; power chips mounted on the surfaces of the die pads; an insulation resin sheet having a first and a second surfaces which are opposed against each other, the resin sheet being disposed such that the back surfaces of the die pads contact the first surface of the resin sheet; and a mold resin applied on the first surface of the resin sheet so as to seal up the power chips. The thermal conductivity of the resin sheet is larger than that of the mold resin.
摘要翻译： 一种半导体器件，其中芯片是树脂模制的，包括：具有前表面和后表面的框架和芯片焊盘; 功率芯片安装在芯片的表面上; 具有彼此相对的第一和第二表面的绝缘树脂片，所述树脂片被设置成使得所述芯片焊盘的背面接触所述树脂片的所述第一表面; 以及在树脂片的第一表面上施加以密封功率芯片的模制树脂。 树脂片的导热率大于模制树脂的热导率。
-
公开(公告)号：US20070042531A1
公开(公告)日：2007-02-22
申请号：US11588407
申请日：2006-10-27
IPC分类号： H01L21/00
CPC分类号： H01L23/49575 , H01L21/565 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The method of producing a semiconductor device in which chips are resin-molded, including steps of: preparing frames having front and back surfaces and die pads; preparing an insulation resin sheet having a first and a second surfaces; preparing a resin-sealing metal mold having cap pins; mounting the resin sheet inside the resin-sealing metal mold in such a manner that the second surface of the resin sheet contacts an inner bottom surface of the resin-sealing metal mold; mounting power chips on the surfaces of the die pads; positioning the frames on the first surface of the resin sheet in such a manner that the back surfaces of the die pads contact the first surface of the resin sheet; pressing the die pads toward the resin sheet using the cap pins and fixing the die pads; injecting a sealing resin in the resin-sealing metal mold and hardening the sealing resin; and removing the semiconductor device in which the power chips are molded with the sealing resin out from the resin-sealing metal mold. The resin sheet may include a metal foil which is disposed to the second surface.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.029 秒)
