公开(公告)号：US07538150B2

公开(公告)日：2009-05-26

申请号：US11219821

申请日：2005-09-07

申请人： Kenichi Oohori ,  Yoshihiro Nakamura ,  Hikari Murai ,  Yoshiyuki Takeda ,  Yasuyuki Hirai ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe ,  Syunichi Numata ,  Teruki Aizawa ,  Ken Nanaumi

发明人： Kenichi Oohori ,  Yoshihiro Nakamura ,  Hikari Murai ,  Yoshiyuki Takeda ,  Yasuyuki Hirai ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe ,  Syunichi Numata ,  Teruki Aizawa ,  Ken Nanaumi

IPC分类号： B32B15/08 ,  B32B27/04 ,  B32B27/28 ,  C08K5/521 ,  C08L61/08 ,  C08L63/02 ,  H05K1/05

CPC分类号： C08L61/34 ,  B32B27/00 ,  B32B27/04 ,  C08G59/226 ,  C08L63/00 ,  C08L2205/02 ,  C08L2205/03 ,  H05K1/0326 ,  Y10T428/24636 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/16 ,  C08L2666/14 ,  C08L2666/22

摘要： The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

摘要翻译： 本发明公开了一种热固性树脂组合物，其包含（A）35〜75重量份的含有以苯并恶嗪环作为主成分的化合物的热固性树脂，（B）10〜25重量份的缩聚产物 苯酚，具有三嗪环的化合物和醛，和（C）10至45重量份的环氧树脂，基于组分（A），（B）的有机固体组分的总量100重量份， 和（C），和（i）重均分子量为1,000〜3000的双酚F环氧树脂，或（ii）双酚F环氧树脂和双酚A环氧树脂的混合环氧树脂，其重均分子量 （C）中含有0〜100重量％的组分（C）; 以及预浸料，布线板用层叠板和使用该预浸料的布线基板。

公开(公告)号：US20060008632A1

公开(公告)日：2006-01-12

申请号：US11219821

申请日：2005-09-07

申请人： Kenichi Oohori ,  Yoshihiro Nakamura ,  Hikari Murai ,  Yoshiyuki Takeda ,  Yasuyuki Hirai ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe ,  Syunichi Numata ,  Teruki Aizawa ,  Ken Nanaumi

发明人： Kenichi Oohori ,  Yoshihiro Nakamura ,  Hikari Murai ,  Yoshiyuki Takeda ,  Yasuyuki Hirai ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe ,  Syunichi Numata ,  Teruki Aizawa ,  Ken Nanaumi

IPC分类号： B32B27/38 ,  B32B15/08 ,  C08L63/00 ,  B32B27/04

CPC分类号： C08L61/34 ,  B32B27/00 ,  B32B27/04 ,  C08G59/226 ,  C08L63/00 ,  C08L2205/02 ,  C08L2205/03 ,  H05K1/0326 ,  Y10T428/24636 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/16 ,  C08L2666/14 ,  C08L2666/22

摘要： The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

摘要翻译： 本发明公开了一种热固性树脂组合物，其包含（A）35〜75重量份的含有以苯并恶嗪环作为主成分的化合物的热固性树脂，（B）10〜25重量份的缩聚产物 苯酚，具有三嗪环的化合物和醛，和（C）10至45重量份的环氧树脂，基于组分（A），（B）的有机固体组分的总量100重量份， 和（C），和（i）重均分子量为1,000〜3000的双酚F环氧树脂，或（ii）双酚F环氧树脂和双酚A环氧树脂的混合环氧树脂，其重均分子量 （C）中含有0〜100重量％的组分（C）; 以及预浸料，布线板用层叠板和使用该预浸料的布线基板。

公开(公告)号：US07041772B2

公开(公告)日：2006-05-09

申请号：US10471204

申请日：2002-03-12

申请人： Teruki Aizawa ,  Yasuyuki Hirai ,  Syunichi Numata

发明人： Teruki Aizawa ,  Yasuyuki Hirai ,  Syunichi Numata

IPC分类号： C08G14/04

CPC分类号： C08G14/06

摘要： The present invention discloses a process for producing a benzoxazine resin which comprises the steps of reacting a phenol compound, an aldehyde compound and a primary amine in the presence of an organic solvent to synthesize a benzoxazine resin and removing generated condensation water and the organic solvent from a system under heating and a reduced pressure, wherein a pressure in the reaction system at the time of removal is set to 260 mmHg or higher.

摘要翻译： 本发明公开了一种苯并恶嗪树脂的制造方法，其特征在于，在有机溶剂的存在下，使酚化合物，醛化合物和伯胺反应，合成苯并恶嗪树脂，除去生成的冷凝水和有机溶剂 在加热和减压下的系统，其中在除去时反应体系中的压力设定为260mmHg以上。