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1.发明授权公开(公告)号：US08080767B2
公开(公告)日：2011-12-20
申请号：US12481754
申请日：2009-06-10
申请人： Kenichi Yamaga , Wenling Wang
发明人： Kenichi Yamaga , Wenling Wang
CPC分类号： H01L21/67109 , H01L21/67248
摘要： A thermal processing apparatus comprising a processing vessel containing, in addition to a plurality of objects subject to heat treatment, an acoustic wave device for temperature measurement. A holding unit holds the plurality of objects to be processed and an object for temperature measurement utilizing an acoustic wave device. A heating unit heats the objects to be processed and the object for temperature measurement. A first conductive member functions as an antenna for transmitting an electromagnetic wave toward the acoustic wave device in the processing vessel; a second conductive member functions as a receiver antenna for receiving an electromagnetic wave dependent on a temperature of the acoustic wave device which is emitted from the acoustic wave device. A temperature analysis part obtains a temperature of the object based on the electromagnetic wave received by the receiver antenna, and a temperature control part controls the heating unit. The first and second conductive members are each part of the thermal processing parts in the processing vessel.
摘要翻译： 一种热处理装置，包括处理容器，除了经受热处理的多个物体之外，还包括用于温度测量的声波装置。 保持单元保持要处理的多个物体和使用声波装置的温度测量对象。 加热单元加热要处理的物体和物体进行温度测量。 第一导电构件用作用于向处理容器中的声波装置传输电磁波的天线; 第二导电构件用作接收天线，用于接收根据从声波装置发射的声波装置的温度的电磁波。 温度分析部基于由接收天线接收到的电磁波获得被摄体的温度，温度控制部控制加热单元。 第一和第二导电构件是处理容器中的热处理部件的每一部分。
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2.发明申请公开(公告)号：US20090311807A1
公开(公告)日：2009-12-17
申请号：US12481754
申请日：2009-06-10
申请人： Kenichi Yamaga , Wenling Wang
发明人： Kenichi Yamaga , Wenling Wang
IPC分类号： H01L21/465 , H01L21/02 , H01L21/46
CPC分类号： H01L21/67109 , H01L21/67248
摘要： The present invention is a thermal processing apparatus comprising: a processing vessel capable of being evacuated, the processing vessel also being capable of accommodating, in addition to a plurality of objects, an object for temperature measurement equipped with an elastic wave device; a holding unit configured to be loaded into and unloaded from the processing vessel, while the holding unit holding the plurality of objects to be processed and the object for temperature measurement; a gas introduction unit configured to introduce a gas into the processing vessel; a heating unit configured to heat the plurality of objects to be processed and the object for temperature measurement that are accommodated in the processing vessel; a first conductive member configured to function as a transmitter antenna connected to a transmitter through a radiofrequency line, for transmitting an electric wave for measurement toward the elastic wave device accommodated in the processing vessel; a second conductive member configured to function as a receiver antenna connected to a receiver through a radiofrequency line, for receiving an electric wave dependent on a temperature of the elastic wave device which is emitted from the elastic wave device accommodated in the processing vessel; a temperature analysis part configured to obtain a temperature of the object for temperature measurement based on the electric wave received by the receiver antenna; and a temperature control part configured to control the heating unit; wherein: the first conductive member is disposed as a part of a thermal processing part in the processing vessel; and the second conductive member is disposed as a part of a thermal processing part in the processing vessel.
摘要翻译： 本发明是一种热处理装置，其特征在于，包括：能够被抽真空的处理容器，所述处理容器除了多个物体外，还能容纳配备有弹性波装置的温度测定对象物; 保持单元，其被构造成装载到处理容器中并从所述处理容器卸载;所述保持单元保持所述多个待处理物体和所述温度测量对象; 气体导入单元，被配置为将气体引入所述处理容器中; 加热单元，其构造成加热容纳在处理容器中的待处理对象物和温度测量对象物; 第一导电构件，被配置为用作通过射频线路连接到发射机的发射机天线，用于向容纳在处理容器中的弹性波装置发射用于测量的电波; 第二导电构件，其被配置为用作通过射频线连接到接收器的接收器天线，用于接收依赖于从容纳在处理容器中的弹性波装置发射的弹性波装置的温度的电波; 温度分析部，被配置为基于由所述接收器天线接收的电波获得用于温度测量的对象的温度; 以及温度控制部，被配置为控制所述加热单元; 其中：所述第一导电部件作为处理容器内的热处理部件的一部分设置; 并且所述第二导电构件作为所述处理容器中的热处理部件的一部分设置。
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公开(公告)号：US07974525B2
公开(公告)日：2011-07-05
申请号：US12071909
申请日：2008-02-27
CPC分类号： F26B23/06 , F27B17/0025 , H01L21/67109
摘要： The present invention is a heat processing furnace comprising: a processing vessel for accommodating an object to be processed and performing thereto a heat process; and a cylindrical heater disposed to surround a circumference of the processing vessel, for heating the object to be processed; wherein: the heater includes a cylindrical heat insulating member, ribbed shelf sections that are axially formed in a tier-like manner on an inner circumference of the heat insulating member, and heating resistance wires of a helical pattern that are placed along the respective shelf sections; and pin members are arranged in the heat insulating member at suitable intervals therebetween, the pin members holding the heating resistance wires such that the heating resistance wires are movable in a radial direction of the heater, while preventing dropout of the heating resistance wires from the shelf sections.
摘要翻译： 本发明是一种热处理炉，包括：处理容器，用于容纳待加工物体并进行加热处理; 以及设置成围绕处理容器的圆周的圆柱形加热器，用于加热被处理物体; 其特征在于，所述加热器包括圆筒形绝热构件，在所述隔热构件的内周上以层状的方式轴向形成的肋状搁板部，以及沿着各个搁板部放置的螺旋图案的耐热电线 ; 并且销构件以适当的间隔布置在绝热构件中，销构件保持加热电阻线，使得加热电阻线可在加热器的径向方向上移动，同时防止加热电阻丝从搁板 部分。
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公开(公告)号：US20110076632A1
公开(公告)日：2011-03-31
申请号：US12881556
申请日：2010-09-14
申请人： Yoshinori KUSAKABE , Kenichi Yamaga
发明人： Yoshinori KUSAKABE , Kenichi Yamaga
CPC分类号： H01L21/67109 , C30B25/10 , C30B35/00
摘要： A thermal processing apparatus including: a cylindrical processing vessel; a support unit to be loaded into and unloaded from the vessel; and a heating furnace surrounding an outer periphery of the vessel, with a cooling space therebetween. The furnace is connected to a cooling-gas introduction unit, including a gas introduction passage to which a blowing fan is connected, for introducing a cooling gas into the cooling space during a temperature lowering operation after a thermal process. The furnace is connected to a cooling-gas discharge unit, including a heat exchanger, a suction fan, and a gas discharge passage, for discharging the cooling gas of a raised temperature from the cooling space. Connected to the gas discharge passage at a position upstream of the heat exchanger is a temperature-lowering gas introduction unit for introducing a temperature-lowering gas to the cooling gas of a raised temperature so as to lower its temperature.
摘要翻译： 一种热处理设备，包括：圆柱形处理容器; 支撑单元，其被装载和卸载; 以及围绕容器的外周的加热炉，其间具有冷却空间。 炉子连接到冷却气体引入单元，该冷却气体引入单元包括连接有吹风扇的气体引入通道，用于在热处理之后的降温操作期间将冷却气体引入冷却空间。 炉子连接到冷却气体排出单元，该冷却气体排出单元包括热交换器，抽吸风扇和气体排出通道，用于将升温的冷却气体从冷却空间排出。 在该热交换器上游的位置与气体排出通路连接的是降温气体引入单元，用于将降温气体导入升温温度降低的气体，降低其温度。
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公开(公告)号：US20050028738A1
公开(公告)日：2005-02-10
申请号：US10494970
申请日：2002-09-27
申请人： Takanori Saito , Toshiyuki Makiya , Hisaei Osanai , Tsuyoshi Takizawa , Tomohisa Shimazu , Kazuhide Hasebe , Hiroyuki Yamamoto , Yukimasa Saito , Kenichi Yamaga
发明人： Takanori Saito , Toshiyuki Makiya , Hisaei Osanai , Tsuyoshi Takizawa , Tomohisa Shimazu , Kazuhide Hasebe , Hiroyuki Yamamoto , Yukimasa Saito , Kenichi Yamaga
IPC分类号： C23C16/44 , C23C16/455 , H01L21/00 , H01L21/205 , H01L21/22 , C23C16/00
CPC分类号： H01L21/67109 , H01L21/67098
摘要： The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a heating unit provided on an inside wall of the heating-furnace body; a reaction container consisting of a single tube contained in the heating-furnace body; a gas-discharging-pipe connecting portion formed at an upper portion of the reaction container; and a first temperature controlling unit provided around the gas-discharging-pipe connecting portion.
摘要翻译： 本发明是一种热处理单元，包括：上端具有开口的加热炉体; 设置在所述加热炉体的内壁上的加热单元; 由包含在加热炉体内的单个管构成的反应容器; 形成在反应容器的上部的气体排出管连接部; 以及设置在气体排出管连接部周围的第一温度控制单元。
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公开(公告)号：US06390754B1
公开(公告)日：2002-05-21
申请号：US09080254
申请日：1998-05-18
申请人： Kenichi Yamaga , Yuji Ono , Masahiro Miyashita , Osamu Tanigawa
发明人： Kenichi Yamaga , Yuji Ono , Masahiro Miyashita , Osamu Tanigawa
IPC分类号： B65G4907
摘要： A closed-type cassette is mounted on a cassette stand disposed in a working region at a position corresponding to an opening formed in a wall separating the working region from a loading region. When the cassette is mounted on the cassette stand, a detecting device gives a signal to that effect to a controller. Then, the controller closes a valve to interrupt nitrogen gas supply into the loading region. A lid of the cassette is opened 20 to 30 sec after the interruption of nitrogen gas supply into the loading region and, then, nitrogen gas supply is resumed. The pressure difference between the loading region and the interior of the cassette is decreased by interrupting nitrogen gas supply into the loading region, so that the lid can be easily opened.
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公开(公告)号：US5362229A
公开(公告)日：1994-11-08
申请号：US79386
申请日：1993-06-21
申请人： Kenichi Yamaga
发明人： Kenichi Yamaga
CPC分类号： F27D7/02 , F16L27/04 , F27D2007/023
摘要： In a semiconductor wafer heat-treating apparatus, there is provided a piping connection device on a gas inlet pipe leading to the heat-treating apparatus and a gas outlet pipe derived from the heat-treating apparatus. The piping connection device has a spherical convex connecting element, and a concave connecting element having a concave spherical surface into which the spherical element is snugly fitted. A pair of presser plates are placed on the outer surfaces of the two connecting elements and clamped by bolts so as to press confronting sealing surfaces of the convex and concave connecting elements against each other. Because the outer surfaces of the two connecting elements to be engaged with the pair of presser plates are spherically fashioned, the connection surfaces can present a satisfactory sealing condition without subjecting the pair of the pipes connected by the piping connection device to excessive biasing forces even though the two pipes are angled to each other.
摘要翻译： 在半导体晶片热处理装置中，在通向热处理装置的气体导入管和从该热处理装置得到的气体出口管上设置配管连接装置。 管道连接装置具有球形凸形连接元件和具有凹形球形表面的凹形连接元件，球形元件紧密配合到该凹形连接元件中。 一对压板放置在两个连接元件的外表面上，并被螺栓夹紧，以将相互凸起的和凹形的连接元件的相对的密封表面压在一起。 由于与一对压板接合的两个连接元件的外表面是球形的，所以连接表面可以呈现令人满意的密封条件，而不会使由配管连接装置连接的一对管子经受过大的偏压力，即使 两个管道彼此成角度。
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公开(公告)号：US5219464A
公开(公告)日：1993-06-15
申请号：US911479
申请日：1992-07-10
IPC分类号： H01L21/00 , H01L21/677
CPC分类号： H01L21/67757 , H01L21/67017 , H01L21/67769 , H01L21/67772
摘要： A clean air apparatus comprises a body in which clean air is supplied, an I/O port having an opening for carrying a carrier housing objects to be treated in/out of the body, a door which opens/closes the opening, and dust preventing device for preventing dusts from entering the body from the outside through the opening, when the door is opened.
摘要翻译： 清洁空气装置包括供给清洁空气的本体，具有用于承载承载物体的用于承载待处理进/离开身体的开口的I / O口，打开/关闭开口的门，防尘 当门打开时，防止灰尘从外部通过开口进入身体的装置。
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9.发明授权Semiconductor wafer transferring apparatus and boat for thermal treatment of a semiconductor wafer 失效用于半导体波导热处理的半导体波导传输装置和引擎
公开(公告)号：US5131799A
公开(公告)日：1992-07-21
申请号：US617872
申请日：1990-11-26
申请人： Hironobu Nishi , Kenichi Yamaga , Takanobu Asano
发明人： Hironobu Nishi , Kenichi Yamaga , Takanobu Asano
IPC分类号： H01L21/00 , H01L21/205 , H01L21/22 , H01L21/673 , H01L21/677
CPC分类号： H01L21/67313 , H01L21/67294 , H01L21/67326 , H01L21/67781 , Y10S414/136 , Y10S414/138 , Y10S414/14
摘要： A wafer transferring method for transferring wafers between a cassette and a boat having grooves to hold the wafers, comprises the steps of providing an identification mechanism for positional alignment on the boat in advance, detecting the identification mechanism, and aligning the boat to a predetermined position based on a detection result and transferring the wafers from the cassette to the boat. A wafer transferring apparatus comprises a loading device for extracting wafers from a cassette and transferring the wafers onto a boat, a detection device for detecting an identification section provided on the boat in order to identify a wafer transferring position on the boat, a control device for acquiring the wafer transferring position on the boat based on a detection result attained from the detection device and controlling a mutual position between the boat and the cassette to come to a predetermined position.
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公开(公告)号：US5088922A
公开(公告)日：1992-02-18
申请号：US644565
申请日：1991-01-23
申请人： Jyunichi Kakizaki , Kenichi Yamaga
发明人： Jyunichi Kakizaki , Kenichi Yamaga
CPC分类号： C30B31/16 , C30B25/14 , C30B35/00 , F27D17/001
摘要： A heat-treatment apparatus of the invention includes a collective exhaust unit for constantly performing gas exhaust from a clean room to keep the room in a clean atmosphere, a heat-treatment furnace for receiving a gas and/or a liquid for forming a desired film on a surface of an object to be treated in a heating atmosphere, an exhaust path, communicating with the collective exhaust unit and the heat-treatment furnace, for introducing a gas filling the heat-treatment furnace into the collective exhaust unit, an outer air intake unit for taking in outer air in the exhaust path to adjust an exhaust pressure of the exhaust path, and a trap unit, arranged below the exhaust path, for trapping a waste liquid collected in the exhaust path.
摘要翻译： 本发明的热处理装置包括：一个不间断地执行从洁净室排出气体以将房间保持在清洁气氛中的集合排气单元，用于接收气体的热处理炉和/或用于形成所需膜的液体 在加热气氛中待处理物体的表面上，与集体排气单元和热处理炉连通的排气路径，用于将填充热处理炉的气体引入到集合排气单元中，外部空气 进气单元，用于吸入排气路径中的外部空气以调节排气路径的排气压力;以及捕集单元，布置在排气通道下方，用于捕集在排气路径中收集的废液。
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